Metalized magnetic core and preparation method thereof and chip inductor

Abstract

The invention provides a metalized magnetic core. The metalized magnetic core comprises a magnetic core, a metal film layer is formed on an electrode region of the magnetic core, the metal film layercomprises a first plating layer and a second plating layer; the first plating layer comprises n layers of first metal layers and n-1 layers of second metal layers in alternative arrangement; the materials of each first metal layer and each second metal layer are independently selected from one or multiple of nickel-copper alloy, nickel-vanadium alloy, silver, copper, and ferric-nickel-copper alloy, and the first metal layers and the second metal layers are made of different materials, and n is integer from 2 to 8; the second plating layer is a silver layer or a tin layer, and the first platinglayer and the second plating layer are prepared through magnetron sputtering. The metalized magnetic core is prepared through the magnetron sputtering, the deposition efficiency is high, the film layer thickness and precious metal consumption are reduced, and the metallization cost is reduced; the multi-layer structure design can reduce the film layer stress and improve the strength of the binding force, and the problem that the product is bad in heat resistance since the metal layers are partially oxidized at high temperature in the magnetron sputtering process is solved. The invention further provides a preparation method of the metalized magnetic core and a chip inductor.

Description

technical field [0001] The invention relates to a metallized magnetic core, a preparation method thereof and a chip inductor. Background technique [0002] Magnetron sputtering magnetic core metallization technology is currently being increasingly widely used as a coating method with high production efficiency, low cost and more environmental protection. Heat resistance and bonding strength are important parts of the reliability of electronic devices. Solder joints falling off and connection failure caused by poor heat resistance and bonding force are common circuit defects. In order to be applied to circuits, wire-wound chip inductors Metallized electrodes must achieve the required heat resistance and bond strength. The residual stress of the film is an important factor affecting the heat resistance and the strength of the bonding force between the metallized film and the substrate, which seriously affects the performance of the metallized magnetic core and limits its good...

AI Technical Summary

Problems solved by technology

[0003] In view of this, the present invention provides a metallized magnetic core, the solder joints of the magnetic core electrodes are prepared by magnetron sputtering to obtain a metal film layer with a special structure, the deposition efficiency is high, the film thickness is reduced, and precious The consumption of metal reduces the cost of metallization; the special multi-layer structure design is also conducive to reducing the stress of the film layer and improving the strength of the bonding force. Oxidation, resulting in poor heat resistance of the product, and the preparation process is green and pollution-free

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