Antioxidant copper-based conductive slurry and preparation method thereof

A technology of conductive paste and copper oxide, which is applied in the direction of conductive materials dispersed in non-conductive inorganic materials, cable/conductor manufacturing, circuits, etc., can solve the problem of increased resistivity, large local resistance, and large surface energy of electronic pastes and other problems, to achieve the effect of improving antioxidant performance, good antioxidant performance, and good electrical conductivity

Inactive Publication Date: 2019-06-18
莫爱军
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Compared with other conductive fillers, copper is a base metal representative, its price is low, and its conductivity is second only to silver, and copper does not undergo electron migration. Therefore, copper-based paste is the most ideal substitute material for silver-based paste However, micron-sized flake copper powder has a large specific surface area, large surface energy and high surface activity. Therefore, it is easily oxidized in the air to form copper oxide, and the conductive paste will accelerate the copper powder during the sintering process. Oxidation. Using the oxidized copper powder on the surface as a conductive filler may cause many problems. If it is small, it will cause a rapid increase in the resistivity of the electronic paste, causing an open circuit phenomenon, which will affect the use. If it is large, the local resistance will be too large and generate a lot of heat. , causing an accident

Method used

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  • Antioxidant copper-based conductive slurry and preparation method thereof

Examples

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Comparison scheme
Effect test

Embodiment 1

[0019] A preparation method for oxidation-resistant copper-based conductive paste, comprising the following steps:

[0020] (1) Add 65 parts of copper powder to 45 parts of aqueous solution containing 15wt% dispersant, add 12 parts of 0.5M hydrochloric acid solution under agitation, then add 8 parts of 3mg / mL aniline in ethanol solution, at room temperature Stir and mix for 30 minutes; then add 3 parts of chloroform and stir for 8 minutes;

[0021] (2) Add 6 parts of hydrochloric acid solutions containing 3wt% ammonium persulfate to the solution prepared in step (1) under the condition of an ice bath, and react for 3.5h under stirring; remove the precipitate in the reaction system by suction filtration The substance was intercepted, and washed 4 times with ethanol solution, and finally washed once with aqueous solution, and the precipitate was resuspended in 45 parts of step (1) in the aqueous solution containing 15wt% dispersant to prepare mixture A;

[0022] (3) AgNO 3 Add...

Embodiment 2

[0029] A preparation method for oxidation-resistant copper-based conductive paste, comprising the following steps:

[0030] (1) Add 50 parts of copper powder to 30 parts of aqueous solution containing 10wt% dispersant, add 8 parts of 0.5M hydrochloric acid solution under stirring conditions, then add 5 parts of 1mg / mL aniline ethanol solution, at room temperature Stir and mix for 20 minutes; then add 2 parts of chloroform and stir for 5 minutes;

[0031] (2) Add 4 parts of hydrochloric acid solutions containing 1wt% ammonium persulfate to the solution prepared in step (1) under the condition of an ice bath, and react for 2h under stirring; remove the precipitate in the reaction system by suction filtration Carry out interception, and wash with ethanol solution 3-5 times, finally wash again with aqueous solution, resuspend the precipitate in 30 parts of aqueous solution containing 10wt% dispersant in step (1), and prepare mixture A;

[0032] (3) AgNO 3 Added to the mixture A ...

Embodiment 3

[0039] A preparation method for oxidation-resistant copper-based conductive paste, comprising the following steps:

[0040] (1) Add 60 parts of copper powder to 40 parts of aqueous solution containing 12wt% dispersant, add 10 parts of 0.6M hydrochloric acid solution under stirring conditions, then add 6 parts of 2 mg / mL aniline ethanol solution, and at room temperature Stir and mix for 25 minutes; then add 2.5 parts of chloroform and stir for 6 minutes;

[0041](2) 5 parts of hydrochloric acid solutions containing 2wt% ammonium persulfate were added in the solution prepared in step (1) under the condition of ice bath, and reacted for 3h under stirring; the precipitate in the reaction system was removed by suction filtration Carry out interception, and wash with ethanol solution 3-5 times, finally wash once again with aqueous solution, resuspend the precipitate in 40 parts of the aqueous solution containing 12wt% dispersant in step (1), make mixture A;

[0042] (3) AgNO 3 Add...

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Abstract

The invention provides an antioxidant copper-based conductive slurry and a preparation method thereof, and the preparation method comprises the following steps: (1) treating the copper powder with ethanol solution of aniline to prepare polyaniline modified copper powder; (2) adding a hydrochloric acid solution of ammonium persulfate into the solution prepared in the step (1) under the ice bath condition, stirring for reaction, carrying out suction filtration to intercept precipitates in a reaction system, washing with an ethanol solution, and carrying out heavy suspension to prepare a mixtureA; (3) modifying a silver layer on the surface of the product prepared in the step (2); (4) preparing an organic adhesive; (5) and processing the composite copper powder prepared in the step (3) and the organic adhesive to prepare the antioxidant copper-based conductive slurry. The conductive paste prepared by the invention has strong adhesive capacity, low resistivity and good oxidation resistance. Therefore, the conductive paste has important practical value when being applied to the electrode of the solar cell.

Description

technical field [0001] The invention relates to a conductive paste, in particular to an anti-oxidation copper-based conductive paste and a preparation method thereof. Background technique [0002] At present, the conductive fillers widely used in conductive paste can be divided into silver-based, palladium-silver, gold-based, platinum-based, copper-based, nickel-based and other metal fillers. The conductivity and oxidation resistance of conductive fillers directly affect the conductivity. The advantages and disadvantages of slurry performance. Compared with other conductive fillers, copper is a base metal representative, its price is low, and its conductivity is second only to silver, and copper does not undergo electron migration. Therefore, copper-based paste is the most ideal substitute material for silver-based paste However, micron-sized flake copper powder has a large specific surface area, large surface energy and high surface activity. Therefore, it is easily oxidiz...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01B13/00H01L31/0224
Inventor 莫爱军
Owner 莫爱军
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