High-temperature-resistant coating material composition for electronic components
A technology for high-temperature resistant coatings and electronic components, applied in anti-corrosion coatings, fire-retardant coatings, anti-fouling/underwater coatings, etc. Resistant to high temperature and other issues, to achieve excellent bacteriostatic effect, good salt spray resistance, and improved service life
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Embodiment 1
[0026] A high-temperature-resistant coating composition for electronic components, characterized in that it comprises the following components in parts by weight: components in parts by weight: 19 butyl acrylate, 8 methyl methacrylate, alumina ceramic powder 7. Azobisisobutyronitrile 5, polyvinyl alcohol 13, dispersant 7, thickener 5, bactericide 31, defoamer 4, pH regulator 1, silicon carbide hollow microsphere 42, nanometer SAPO-31 molecular sieve 31. Distilled water17.
[0027] Further, the fungicide includes the following components in parts by weight: 31 parts of alfalfa extract, 13 parts of polyvinylpyrrolidone, and 39 parts of the extract of the leaves of the ash tree.
[0028] Among the present invention, the alfalfa extract that adopts adopts, and alfalfa (Medicago sativa) is a perennial herb plant, and its main root is longer, multi-branched, and the stem is often upright, almost glabrous, and the plant height is 30-100 cm. Distributed in Qinghai, Xinjiang, Ningxia,...
Embodiment 2
[0046] A high-temperature-resistant coating composition for electronic components, characterized in that it includes the following components in parts by weight: 32 parts by weight of butyl acrylate, 17 parts by methyl methacrylate, alumina ceramic powder 18. Azobisisobutyronitrile 11, polyvinyl alcohol 29, dispersant 12, thickener 9, bactericide 38, defoamer 7, pH regulator 3, silicon carbide hollow microsphere 59, nanometer SAPO-31 molecular sieve 47. Distilled water26.
[0047] Further, the fungicide includes the following components in parts by weight: 45 parts of alfalfa extract, 27 parts of polyvinylpyrrolidone, and 48 parts of the extract of the leaves of the ash tree.
[0048] Further, the dispersant is methyl pentanol.
[0049] Further, the thickener is hydroxyethyl cellulose ether.
[0050] Further, the defoamer is tributyl phosphate.
[0051] Further, the pH regulator is diethanolamine.
[0052] Through the synergistic compounding of the various components in th...
Embodiment 3
[0054] A high-temperature-resistant coating composition for electronic components, characterized in that it includes the following components in parts by weight: 23 parts by weight of butyl acrylate, 11 parts by methyl methacrylate, alumina ceramic powder 12. Azobisisobutyronitrile 7, polyvinyl alcohol 16, dispersant 9, thickener 6, bactericide 33, defoamer 5, pH regulator 1.5, silicon carbide hollow microsphere 45, nanometer SAPO-31 molecular sieve 34. Distilled water19.
[0055] Further, the fungicide includes the following components in parts by weight: 34 parts of alfalfa extract, 17 parts of polyvinylpyrrolidone, and 41 parts of the extract of the leaves of the ash tree.
[0056] Further, the dispersant is gull gum.
[0057] Further, the thickener is hydroxyethyl cellulose ether.
[0058] Further, the defoamer is tributyl phosphate.
[0059] Further, the pH regulator is diethanolamine.
[0060] Through the synergistic compounding of the various components in the prese...
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