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High-temperature-resistant coating material composition for electronic components

A technology for high-temperature resistant coatings and electronic components, applied in anti-corrosion coatings, fire-retardant coatings, anti-fouling/underwater coatings, etc. Resistant to high temperature and other issues, to achieve excellent bacteriostatic effect, good salt spray resistance, and improved service life

Inactive Publication Date: 2019-06-25
周华健
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, there are roughly two types of protective coatings on the surface. One is based on organic materials, which are mechanically applied to the surface of the product after the outer electrode of the product is fired, and are formed after heating, drying and curing. High temperature firing can not withstand high temperature, the combination of coating and product is not firm; another coating needs to be fired at high temperature (700-900 ℃), after firing, the coating and the porcelain body form a dense overall structure, However, during the firing process, due to the inconsistency of the wettability of the coating material to the product porcelain body and electrode material, and the inherent 15%-20% sintering shrinkage rate of the coating and the volume change rate caused by the thermal expansion of the porcelain body Gap, the coating is easy to crack
At the same time, the coatings of electronic components in the prior art do not have properties such as antibacterial, high temperature resistance, and salt spray resistance.

Method used

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  • High-temperature-resistant coating material composition for electronic components
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Examples

Experimental program
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Effect test

Embodiment 1

[0026] A high-temperature-resistant coating composition for electronic components, characterized in that it comprises the following components in parts by weight: components in parts by weight: 19 butyl acrylate, 8 methyl methacrylate, alumina ceramic powder 7. Azobisisobutyronitrile 5, polyvinyl alcohol 13, dispersant 7, thickener 5, bactericide 31, defoamer 4, pH regulator 1, silicon carbide hollow microsphere 42, nanometer SAPO-31 molecular sieve 31. Distilled water17.

[0027] Further, the fungicide includes the following components in parts by weight: 31 parts of alfalfa extract, 13 parts of polyvinylpyrrolidone, and 39 parts of the extract of the leaves of the ash tree.

[0028] Among the present invention, the alfalfa extract that adopts adopts, and alfalfa (Medicago sativa) is a perennial herb plant, and its main root is longer, multi-branched, and the stem is often upright, almost glabrous, and the plant height is 30-100 cm. Distributed in Qinghai, Xinjiang, Ningxia,...

Embodiment 2

[0046] A high-temperature-resistant coating composition for electronic components, characterized in that it includes the following components in parts by weight: 32 parts by weight of butyl acrylate, 17 parts by methyl methacrylate, alumina ceramic powder 18. Azobisisobutyronitrile 11, polyvinyl alcohol 29, dispersant 12, thickener 9, bactericide 38, defoamer 7, pH regulator 3, silicon carbide hollow microsphere 59, nanometer SAPO-31 molecular sieve 47. Distilled water26.

[0047] Further, the fungicide includes the following components in parts by weight: 45 parts of alfalfa extract, 27 parts of polyvinylpyrrolidone, and 48 parts of the extract of the leaves of the ash tree.

[0048] Further, the dispersant is methyl pentanol.

[0049] Further, the thickener is hydroxyethyl cellulose ether.

[0050] Further, the defoamer is tributyl phosphate.

[0051] Further, the pH regulator is diethanolamine.

[0052] Through the synergistic compounding of the various components in th...

Embodiment 3

[0054] A high-temperature-resistant coating composition for electronic components, characterized in that it includes the following components in parts by weight: 23 parts by weight of butyl acrylate, 11 parts by methyl methacrylate, alumina ceramic powder 12. Azobisisobutyronitrile 7, polyvinyl alcohol 16, dispersant 9, thickener 6, bactericide 33, defoamer 5, pH regulator 1.5, silicon carbide hollow microsphere 45, nanometer SAPO-31 molecular sieve 34. Distilled water19.

[0055] Further, the fungicide includes the following components in parts by weight: 34 parts of alfalfa extract, 17 parts of polyvinylpyrrolidone, and 41 parts of the extract of the leaves of the ash tree.

[0056] Further, the dispersant is gull gum.

[0057] Further, the thickener is hydroxyethyl cellulose ether.

[0058] Further, the defoamer is tributyl phosphate.

[0059] Further, the pH regulator is diethanolamine.

[0060] Through the synergistic compounding of the various components in the prese...

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PUM

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Abstract

The present invention provides a high-temperature-resistant coating material composition for electronic components, wherein the high-temperature-resistant coating material composition comprises, by weight, 19-32 parts of butyl acrylate, 8-17 parts of methyl methacrylate, 7-18 parts of alumina ceramic powder, 5-11 parts of azobisisobutyronitrile, 13-29 parts of polyvinyl alcohol, 7-12 parts of a dispersant, 5-9 parts of a thickener, 31-38 parts of a bactericide, 4-7 parts of an antifoaming agent, 1-3 parts of a pH value adjuster, 42-59 parts of silicon carbide hollow microspheres, 31-47 parts of a nanometer SAPO-31 molecular sieve, and 17-26 parts of distilled water. According to the present invention, the advantages of the prior art are absorbed; after the external electrode of the electronic component is fired, the surface of the product is coated with the coating material by using the mechanical method, and the high temperature firing is performed, such that the combination of the coating material and the product is firm, no cracking is generated, and the electrode exposed to the product can be completely covered; and the high-temperature-resistant coating material composition for electronic components has functionality so as to further improve the service life of the product.

Description

technical field [0001] The invention relates to the technical field of protection of electronic components, in particular to a high temperature resistant coating composition for electronic components applied to electronic components. Background technique [0002] Electronic components are components of electronic components and electric small machines and instruments. They are often composed of several parts and can be used in similar products; they often refer to certain parts in industries such as electrical appliances, radios, and instruments, such as capacitors and transistors. The general term for sub-devices such as springs, hairsprings, and springs. Common ones include diodes, etc. [0003] Due to the requirements of product characteristics, the back edge of the existing low-melting point co-fired laminated chip electronic components, that is, the distance between the inner electrode and the edge of the product is getting smaller and smaller. Due to the limitation o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D4/06C09D4/02C09D5/14C09D5/08C09D5/18B05D1/02B05D1/36B05D3/02
Inventor 周华健罗曾莉闵名思
Owner 周华健