Back coating process of titanium anode plate for producing electrolytic copper foils

A technology of titanium anode plate and back coating, which is applied in the coating process of metal materials, electrodes, coatings, etc., can solve the problems of short service life of titanium anode plate, uneven current density, wavy fold of electrolytic copper foil, etc., and achieve The effect of increasing service life, uniform speed and avoiding coating cracks

Active Publication Date: 2019-07-09
建滔(连州)铜箔有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Based on the problems and deficiencies in the prior art, the present invention aims to solve the short service life of the titanium anode plate used in the electrolytic copper foil in the prior art, the uneven current density, the small contact area, and the easy occurrence of "waves" in the electrolytic copper foil. Folding" and other issues, a process for coating the back of a titanium anode plate is disclosed

Method used

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  • Back coating process of titanium anode plate for producing electrolytic copper foils
  • Back coating process of titanium anode plate for producing electrolytic copper foils
  • Back coating process of titanium anode plate for producing electrolytic copper foils

Examples

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Effect test

Embodiment 1

[0060] Example 1 A back coating process for producing titanium anode plates for electrolytic copper foil

[0061] Specifically include the following steps:

[0062] (1) Select a titanium substrate with a smooth surface, good flatness, and no cracks, the length of which is 8m, and the width is 1.5m. The selected titanium substrate is annealed and leveled at a temperature of 500 ° C to obtain Annealed and leveled titanium anode plate;

[0063] (2) The annealed titanium anode plate obtained in step (1) is pickled with 10% oxalic acid for 10 hours. The pickling process is carried out in a boiling state, and finally forms a layer on the surface of the titanium anode. layer of titanium hydride, that is, to obtain the titanium anode plate after pickling;

[0064] (3) Coating a solution of an iridium compound and a tantalum compound with a concentration ratio of 5:1 on the back of the titanium anode plate obtained in step (2), with a coating thickness of 5 μm, to obtain a coated tit...

Embodiment 2

[0071] Example 2 A back coating process for producing titanium anode plates for electrolytic copper foil

[0072] Specifically include the following steps:

[0073] (1) Select a titanium substrate with a smooth surface, good flatness, and no cracks, the length of which is 8m, and the width is 1.5m. The selected titanium substrate is annealed and leveled at a temperature of 600°C to obtain Annealed and leveled titanium anode plate;

[0074] (2) The annealed titanium anode plate obtained in step (1) is pickled with 20% oxalic acid for 10 hours. The pickling process is carried out in a boiling state, and finally forms a layer on the surface of the titanium anode. layer of titanium hydride, that is, to obtain the titanium anode plate after pickling;

[0075] (3) Coating a solution of an iridium compound and a tantalum compound with a concentration ratio of 3.3:1 on the back of the titanium anode plate obtained in step (2), with a coating thickness of 3 μm, to obtain a coated tit...

Embodiment 3

[0082] Example 3 A back coating process for producing titanium anode plates for electrolytic copper foil

[0083] Specifically include the following steps:

[0084] (1) Select a titanium substrate with a smooth surface, good flatness, and no cracks, the length of which is 8m, and the width is 1.5m. The selected titanium substrate is annealed and leveled at a temperature of 550°C to obtain Annealed and leveled titanium anode plate;

[0085] (2) The annealed titanium anode plate obtained in step (1) is pickled with 15% oxalic acid for 15 hours. layer of titanium hydride, that is, to obtain the titanium anode plate after pickling;

[0086] (3) Coating a solution of an iridium compound and a tantalum compound with a concentration ratio of 3:1 on the back of the titanium anode plate obtained in step (2), with a coating thickness of 3 μm, to obtain a coated titanium anode plate;

[0087] (4) Place the back of the coated titanium anode plate obtained in step (3) on a sintering fra...

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Abstract

The invention provides a back coating process of a titanium anode plate for producing electrolytic copper foils, and belongs to the technical field of the electrolytic copper foils. The back coating process comprises the following steps of (1) selecting materials and carrying out annealing; (2) pickling; (3) coating; (4) drying and sintering; (5) cooling and annealing to obtain a titanium anode plate semi-finished product A with a back coating; (6) coating again, drying and sintering to obtain a titanium anode plate semi-finished product B with a back coating; and (7) repeating the step (6) one to ten times, and cooling to room temperature to obtain a finished product. According to the coating process, the generation of wave folding of the electrolytic copper foils is reduced, the currentdensity is uniform, the polarization reaction speed of each part of the titanium anode plate is uniform, the service life of the titanium anode plate is prolonged, the contact resistance of the titanium anode plate is reduced, the electricity is saved, and the energy consumption is reduced.

Description

technical field [0001] The invention belongs to the technical field of electrolytic copper foil, and in particular relates to a back coating process for producing titanium anode plates for electrolytic copper foil. Background technique [0002] Inert anodes are widely used in industrial hydrometallurgical industries. Good anode materials must be able to pass high current density and have good corrosion resistance and wear resistance. Generally, they must meet the following basic requirements: good electrical conductivity and strong corrosion resistance , high mechanical strength, easy processing, etc. Among them, titanium-based coating anode is a kind of inert anode material with good performance, which has shown good results in electrodes of some metals. [0003] As the anode of electrode copper foil, titanium anode is the key equipment to determine the quality of electrolytic copper foil. After more than 20 years of research and development of titanium anode plate used in ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25C7/02C25C1/12C23C18/12
CPCC23C18/1216C23C18/1291C25C1/12C25C7/02Y02P10/20
Inventor 林家宝
Owner 建滔(连州)铜箔有限公司
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