Method for synthesizing polymeric microspheres

A technology for synthesizing polymers and polymer solutions, applied in the field of polymer microsphere preparation, can solve the problems of difficult size control, low reaction efficiency, back-locking of synthesis process steps, etc., achieves good molding state, simple preparation process, and is conducive to popularization applied effect

Active Publication Date: 2019-07-12
UNIV OF ELECTRONICS SCI & TECH OF CHINA +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to provide a method for synthesizing polymer microspheres to solve the problems of anti-locking of existing synthesis process steps, low reaction efficiency and difficult control of shape and size

Method used

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  • Method for synthesizing polymeric microspheres
  • Method for synthesizing polymeric microspheres
  • Method for synthesizing polymeric microspheres

Examples

Experimental program
Comparison scheme
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Embodiment 1

[0038] The method for synthesizing polymer microspheres in this embodiment comprises the following steps:

[0039] (1) Photolithography on the surface of the silicon wafer to obtain a microstructure with grooves and micro-platforms.

[0040] The silicon wafer was treated with plasma under vacuum condition for 25 minutes, and then the silicon wafer was heated at 300° C. for 25 minutes. Under the condition of yellow light irradiation, the photoresist is dropped on the surface of the silicon wafer with a thickness of 500um, an oxide layer thickness of 300nm, a crystal orientation of 100° and a diameter of 100mm, and then spin-coated, and the spin-coating acceleration is 750r / s 2 , the maximum speed is 3500r / s, then the silicon wafer is heated and solidified at 100°C, then the mask plate is exposed for 6s, and developed for 20s with a developer; the developer is 20wt% tetramethylammonium hydroxide solution and water according to 1: 7 volume ratio configuration.

[0041] The sili...

Embodiment 2

[0046] The method for synthesizing polymer microspheres in this embodiment comprises the following steps:

[0047] (1) Photolithography on the surface of the silicon wafer to obtain a microstructure with grooves and micro-platforms.

[0048] The silicon wafer was treated with plasma under vacuum for 35 minutes, and then the silicon wafer was heated at 250° C. for 35 minutes. Under the condition of yellow light irradiation, the photoresist is dropped on the surface of the silicon wafer with a thickness of 600um, an oxide layer thickness of 310nm, a crystal orientation of 100.5° and a diameter of 100.3mm, and then spin-coated, and the spin-coating acceleration is 850r / s 2 , the maximum speed is 3500r / s, then the silicon wafer is heated and solidified at 120°C, then the mask plate is exposed for 7s, and developed for 24s with a developer; the developer is 30wt% tetramethylammonium hydroxide solution and water according to 1: 9 volume ratio configuration.

[0049] The silicon wa...

Embodiment 3

[0054] The method for synthesizing polymer microspheres in this embodiment comprises the following steps:

[0055] (1) Photolithography on the surface of the silicon wafer to obtain a microstructure with grooves and micro-platforms.

[0056] The silicon wafer was treated with plasma under vacuum condition for 30 minutes, and then the silicon wafer was heated at 280° C. for 30 minutes. Under the condition of yellow light irradiation, the photoresist is dropped on the surface of the silicon wafer with a thickness of 400um, an oxide layer thickness of 290nm, a crystal orientation of 99.5° and a diameter of 99.7mm, and then spin-coated, and the spin-coating acceleration is 800r / s 2 , the maximum speed is 3500r / s, then the silicon wafer is heated and solidified at 110°C, then the mask plate is exposed for 7s, and developed for 22s with a developer; the developer is 25wt% tetramethylammonium hydroxide solution and water according to 1: The volume ratio of 8 is configured.

[0057]...

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Abstract

The invention discloses a method for synthesizing polymeric microspheres and belongs to the field of polymeric microsphere preparation technology. By combining the lithography technology, super-amphiphobic surface and microfluid spinning, synthesis of polymeric microspheres with a silicon chip as the surface of a matrix is realized. The whole preparation process is simple, and the technology is mature without the need of adding any additive, which facilitates promotion and application. Meanwhile, technological parameters which are suitable for molding of the polymeric microspheres are screenedout from lots of experimental data, and the best molding effect is achieved.

Description

technical field [0001] The invention relates to the technical field of preparing polymer microspheres, in particular to a method for synthesizing polymer microspheres. Background technique [0002] Polymer microspheres refer to spherical polymers with diameters ranging from nanometers to micrometers. Polymer microspheres have the characteristics of large specific surface area, strong adsorption, strong agglutination and strong surface reaction ability, and have broad application prospects in coatings, conductive polymer materials, synthetic perforated molecular sieves, drug carriers and catalysts. Polymer microspheres are also usually used as carriers in medicine, life sciences, agriculture and other fields. Through molecular biotechnology, it provides the possibility for the treatment of many diseases, such as hemophilia, cardiovascular disease, cancer, etc. [0003] Existing methods for synthesizing polymeric microspheres usually require emulsifiers, stabilizers, and post...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J3/12C08L33/12
CPCC08J3/12C08J2333/12
Inventor 邓旭王迎曦王德辉
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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