Preparation method of SMT (surface-mounted technology) adhesive

A patch adhesive and preparation step technology, which is applied in the direction of adhesives, epoxy resin glue, non-polymer adhesive additives, etc., can solve the problems of high part drop rate and poor high temperature resistance, and achieve high hardness and high temperature resistance Good performance and stable chemical properties

Inactive Publication Date: 2019-07-12
常州市贝特织造有限公司
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0006] The technical problem to be solved by the present invention: Aiming at the problems of poor high temperature resistance and high drop rate of patch red glue currently on the market, a preparation method of SMT patch glue is provided

Method used

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  • Preparation method of SMT (surface-mounted technology) adhesive

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Embodiment Construction

[0031]Put quartz sand with an average particle size of 45~55μm in a closed ball mill tank, ball mill at room temperature at a speed of 150~200r / min for 8~10h, and then dry it at 110~120°C to obtain an average particle size of 0.1~ 0.3μm silica powder, weigh 25~30 parts of sodium silicate, 0.1~0.3 parts of cetyltrimethylammonium bromide, 10~15 parts of absolute ethanol, 40~50 parts of Deionized water, add sodium silicate to deionized water, stir at 150~200r / min at room temperature for 10~15min to obtain sodium silicate solution, add cetyltrimethylammonium bromide to sodium silicate solution , ultrasonically dispersed for 30-40 min, then placed in a water bath at 85-95°C and stirred at a speed of 150-200r / min for 20-30 min to obtain a sodium silicate mixture, adding absolute ethanol to the sodium silicate mixture, Stir rapidly at a speed of 500~600r / min for 40~60min in a water bath at ~95°C, adjust the pH to 6~7 with phosphoric acid with a mass concentration of 1% to obtain sili...

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Abstract

The invention relates to a preparation method of an SMT (surface-mounted technology) adhesive, and belongs to the technical field of binding materials. According to the preparation method of the SMT adhesive, micro silicon powder is taken as packing for preparation of the SMT adhesive, does not easily react with other substances and does not chemically react with most acid and alkali, particles ofthe micro silicon powder uniformly cover the surface of an object and have higher corrosion resistance, tensile strength and compressive strength of a cured product can be enhanced, and wear resistance can be improved; besides, the micro silicon powder is high in purity, low in impurity content and stable in performance and can reduce exothermic peak temperature of an epoxy resin curing reaction,reduce linear expansion coefficient and shrink rage of the cured product and increase flame retardant property, so that the high-temperature resistance of the SMT adhesive is improved. By means of addition of talcum powder for preparation of the SMT adhesive, the talcum powder can be subjected to a chemical reaction with an organosilicon functional group in a silane coupling agent, silicon oxygenbonds with certain adhesive strength and protection force are formed, a coating can continuously bear certain heat load, high-temperature adhesive force is increased, and the high-temperature resistance of the SMT adhesive is improved accordingly.

Description

technical field [0001] The invention relates to a preparation method of SMT adhesive, which belongs to the technical field of bonding materials. Background technique [0002] SMT is surface mount technology, which is the most popular technology and process in the electronic assembly industry. SMT includes two completely different processes, one uses solder paste; the other uses glue, usually defined as patch glue, SMT patch glue is a special adhesive applied to surface assembly, also known as surface assembly adhesive, SMT glue. The former process is to apply solder paste on the PCB through the screen, and when the surface mount device (abbreviated as SMD) is installed, the connection is completed by reflow soldering. The second process is usually used on hybrid PCBs with both SMD and connectors. The connector is connected to the PCB by wave soldering. In wave soldering, hot-melt solder is filled between the component pins and the plug-in hole to connect and fix. SMD can...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/04C09J11/06C09J11/08
CPCC09J163/00C09J11/04C09J11/06C09J11/08C08K2201/011C08L2205/025C08L2205/03C08L2201/08C08L63/00C08L91/00C08K13/04C08K7/00C08K3/04C08K3/36C08K7/18C08K5/5425
Inventor 龙春秀
Owner 常州市贝特织造有限公司
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