Preparation method of polytetrafluoroethylene copper-clad plate

The technology of polytetrafluoroethylene and polytetrafluoroethylene powder is applied in the field of preparation of polytetrafluoroethylene copper clad laminates, which can solve the problems of fluororesin being unable to fill the voids of glass cloth, poor mechanical properties, and affecting the performance and uniformity of plates, etc. To avoid product surface defects, improve dimensional stability, and meet the effect of sheet uniformity

Inactive Publication Date: 2019-07-23
CHINA ELECTRONICS TECH GRP NO 46 RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the characteristics of PTFE resin, such as insoluble and non-melting, self-lubricating, non-sticky, etc., it is often necessary to repeat the above steps many times to obtain a PTFE varnished cloth with a suitable resin content, so there are flows formed by vertical flow of different dipping times on the surface of the adhesive tape. marks, resulting in large fluctuations in the uniformity of the local characteristics of the plate, which is very unfavorable for the preparation of PTFE copper-clad laminates with excellent comprehensive properties
This production method has high energy consumption and low efficiency, and the PTFE copper clad laminate produced has a large t

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Step (1): In parts by weight, 55 parts of PTFE powder, 20 parts of lubricant petroleum ether, and ceramic powder TiO with a particle size of 5 μm 2 Put 44 parts of (titanium dioxide) and 1 part of short glass fiber into a V-shaped mixer and mix evenly; put the evenly mixed powder at 35°C for 8 hours to make the lubricant fully absorbed by the resin and evenly distributed throughout the in the resin system.

[0028] Step (2): Fill the uniform powder prepared in step (1) into the mold cavity and press to obtain a preform; set the pressure at 20kgf / cm 2 , keeping the pressure for 5 minutes.

[0029] Step (3): The preform obtained in step (2) is calendered to obtain a green substrate, wherein the calendering pressure is 490N, the roller speed is 0.5m / min, and the roller gap is 990μm; then the green substrate is put into Dry and remove the lubricant in an oven at a temperature of 310°C for 6 hours.

[0030] Step (4): Cover both sides of the raw substrate dried in step (3)...

Embodiment 2

[0033] Step (1): In parts by weight, 55 parts of PTFE powder, 20 parts of lubricant petroleum ether, and ceramic powder SiO with a particle size of 15 μm 2 Put 44 parts of (silicon dioxide) and 1 part of short glass fiber into a V-shaped mixer and mix evenly; put the evenly mixed powder at 40°C for 6 hours to make the lubricant fully absorbed by the resin and evenly distributed throughout the resin system.

[0034] Step (2): Fill the uniform powder prepared in step (1) into the mold cavity and press to obtain a preform; set the pressure at 20kgf / cm 2 , keeping the pressure for 5 minutes.

[0035] Step (3): The preform obtained in step (2) is calendered to obtain a green base sheet, wherein the calendering pressure is 490N, the linear speed of the roller is 0.5m / min, and the roller gap is 990μm;

[0036] Then put the green substrate into an oven to dry and remove the lubricant. The temperature of the oven is 310° C. for 6 hours.

[0037] Step (4): Copper foil is covered on b...

Embodiment 3

[0040] Step (1): In parts by weight, 35 parts of PTFE powder, 20 parts of lubricant paraffin oil, and ceramic powder SiO with a particle size of 20 μm 2 Put 60 parts of (silicon dioxide) and 5 parts of short glass fiber into a V-shaped mixer and mix evenly; put the evenly mixed powder at 45°C for 5 hours to make the lubricant fully absorbed by the resin and evenly distributed throughout the resin system.

[0041] Step (2): Fill the uniform powder prepared in step (1) into the mold cavity and press to obtain a preform; set the pressure at 20kgf / cm 2 , keeping the pressure for 5 minutes.

[0042] Step (3): The preform obtained in step (2) is calendered to obtain a green base sheet, wherein the calendering pressure is 490N, the linear speed of the roller is 0.5m / min, and the roller gap is 990μm;

[0043] Then put the green substrate into an oven to dry and remove the lubricant. The temperature of the oven is 310° C. for 6 hours.

[0044] Step (4): Copper foil is covered on bot...

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Abstract

The invention discloses a preparation method of a polytetrafluoroethylene copper-clad plate. The preparation method comprises the following steps: 1, evenly mixing raw material ingredients of polytetrafluoroethylene powder, a lubricating agent, ceramic powder and short glass fiber and curing; 2, moulding pressing to prepare a preform; 3, calendering to obtain a raw substrate and then drying; 4, covering the two sides of the raw substrate by copper foils, sintering, maintaining pressure and then cooling to the room temperature to obtain the polytetrafluoroethylene copper-clad plate. The preparation method replaces a preparation mode applying PTFE dispersion liquid to coating and impregnating and avoids harm of toxic fluoride, nitric oxide and the like; a good filler dispersing effect, evenness in mixing and good dimensional stability of a product are achieved. By means of reasonable matching, the prepared PTFE copper-clad plate has different dielectric constants from 2.6 to 8.6 MHz, a dielectric loss factor is smaller than or equal to 0.003, the peel strength is greater than or equal to 1.7 kN/m, and overall performance can meet the use requirement. The preparation method disclosedby the invention has the advantages of simple technological process and ability in meeting the requirement of industrial batch product.

Description

technical field [0001] The present invention relates to a copper-clad laminate preparation process, in particular to a preparation method for a polytetrafluoroethylene copper-clad laminate, which is a high-frequency microwave copper-clad laminate, and the prepared polytetrafluoroethylene copper-clad laminate meets the requirements of high-frequency microwave circuit boards. Require. Background technique [0002] Polytetrafluoroethylene (PTFE for short) material has excellent dielectric properties (lower dielectric constant and dielectric loss, etc.), as well as good chemical and thermal stability. With the gradual development of communication and electronic products in the direction of high frequency and high speed, the market demand for PTFE copper clad laminates is growing rapidly, and it is widely used in manufacturing industries such as communication equipment, computers, automotive electronics, and household appliances. In the high-frequency substrate industry, the die...

Claims

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Application Information

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IPC IPC(8): B32B15/20B32B15/085B32B27/32B32B27/18B32B37/06B32B37/10B32B37/08H05K3/02C08L27/18C08K3/22C08K7/14C08K3/36
CPCB32B15/085B32B15/20B32B27/18B32B27/322B32B37/06B32B37/08B32B37/1018B32B2262/101B32B2307/204B32B2307/306B32B2307/734B32B2457/00C08K3/22C08K3/36C08K7/14C08K2003/2241H05K3/022C08L27/18
Inventor 高枢健张立欣金霞贾倩倩韩伏龙
Owner CHINA ELECTRONICS TECH GRP NO 46 RES INST
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