High-flame-retardance resin thin film and preparing method thereof

A resin film, high flame retardant technology, applied in the direction of plastic/resin/wax insulators, organic insulators, electrical components, etc., can solve problems such as heat resistance and flame retardancy defects, easy to achieve molecular weight, convenient source, and reaction conditions mild effect

Inactive Publication Date: 2019-07-30
DONGHUA UNIV +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the field of organic polymers, polyester, polycarbonate, polyurethane, polyacrylate, polyacrylonitrile, polyethylene, polypropylene, polyst

Method used

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  • High-flame-retardance resin thin film and preparing method thereof
  • High-flame-retardance resin thin film and preparing method thereof
  • High-flame-retardance resin thin film and preparing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] Add 32.2 grams (0.1 moles) of 1,4-bis(2,4-diaminophenoxy)benzene 14BDAPB and 560 grams of N,N-dimethylacetamide into the reaction kettle, stir and dissolve at room temperature, add 92.8 gram (0.2 mol) tetrabromophthalic anhydride, stirred for 15 minutes, added 20.0 gram (0.1 mol) 4,4'-diaminodiphenyl ether, stirred and cooled to 0°C-5°C, added 43.6 gram (0.2 mol) pyromellitic Formic acid dianhydride was stirred and reacted for 2 hours to obtain 748.6 grams of homogeneous, transparent, viscous resin solution, adjust the viscosity, form a film in a casting machine, heat up and carry out dehydration thermal imidization reaction (the reaction temperature range is 100 ° C -350°C), recover the organic solvent for recycling, cool, and release the film to obtain the 14BDAPB type high flame-retardant resin film, which is designated as F-1.

[0048] Measure its performance, the results are as follows: tensile strength 110.2MPa; elongation at break 25.8%; limiting oxygen index 41....

Embodiment 2

[0050] Add 32.2 g (0.1 mol) of 1,4-bis(2,4-diaminophenoxy)benzene 14BDAPB, 1000 g of N,N-dimethylformamide and 700 g of N-ethyl-2-pyrrolidone In the reaction kettle, stir and dissolve at room temperature, add 95.1 grams (0.205 moles) of tetrabromophthalic anhydride, stir for 30 minutes, add 80.0 grams (0.4 moles) of 4,4'-diaminodiphenyl ether and 21.6 grams (0.2 moles) of p-phenylene Diamine, stirring and cooling to 0°C-5°C, adding 154.1 grams (0.497 moles) of 3,3',4,4'-tetracarboxydiphenyl ether dianhydride and 43.6 grams (0.2 moles) of pyromellitic acid dianhydride and stirring React for 5 hours to obtain 2126.6 grams of homogeneous, transparent, viscous resin solution, adjust the viscosity, form a film in a casting machine, heat up and carry out dehydration thermal imidization reaction (reaction temperature range is between 100°C-350°C between), recover the organic solvent for recycling, cool, and release the film to obtain the 14BDAPB type high flame-retardant resin film, ...

Embodiment 3

[0053] Add 32.2 grams (0.1 moles) of 1,4-bis(2,4-diaminophenoxy)benzene 14BDAPB and 5245 grams of N,N-dimethylacetamide into the reaction kettle, stir and dissolve at room temperature, add 93.7 gram (0.202 mol) of tetrabromophthalic anhydride, stirred and reacted for 25min, added 29.0 gram (0.1 mol) of 4,4'-diamino-4"-hydroxytriphenylmethane, 29.2 gram (0.1 mol) of 1,3-bis(4- Aminophenoxy)benzene and 160.0 grams (0.8 moles) of 4,4'-diaminodiphenyl ether, stirred and cooled to 0°C-5°C, added 238.7 grams (1.095 moles) of pyromellitic dianhydride and stirred for 4 hours , to obtain 5827.8 grams of homogeneous, transparent, viscous resin solution, adjust the viscosity, form a film in a casting machine, heat up and carry out dehydration thermal imidization reaction (the reaction temperature range is between 100 ° C and 350 ° C), Recover the organic solvent for recycling, cool, and release the film to obtain a 14BDAPB type high flame-retardant resin film, which is designated as F-3....

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Abstract

The invention relates to a high-flame-retardance resin thin film and a preparing method thereof. The thin film is a reaction production of aromatic quaternary amine, tetrabromophthalic anhydride, aromatic binary amine and aromatic binary anhydride. The thin film has quite high flame retardance, heat resistance, electrical insulativity, excellent mechanical performance and the like; the preparing method of the thin film is high in universality, mild in reaction condition, simple in operation, low in cost, friendly to the environment and beneficial for industrial large-scale production and can be applied to the high-tech fields of large motor main insulation materials, electromagnetic wire covering electrical insulation materials, flexible copper-clad plates (FCCL) and the like.

Description

technical field [0001] The invention belongs to the field of organic films, in particular to a high flame-retardant resin film and a preparation method thereof. Background technique [0002] In the field of organic polymers, polyester, polycarbonate, polyurethane, polyacrylate, polyacrylonitrile, polyethylene, polypropylene, polystyrene, etc. can produce resin film materials with wide application value, but their heat resistance Both resistance and flame retardancy have defects. [0003] Polyimide film is a kind of polymer material with excellent comprehensive properties. It has particularly excellent heat resistance, low temperature resistance, electrical properties and mechanical properties. It is widely used in electronic microelectronics, printed circuit boards, wires, etc. Cables, motor main insulation, shipping, aerospace, laser, photoelectric and other high-tech fields. [0004] Traditional polyimide films, such as the KAPTON film produced by the American DUPONT com...

Claims

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Application Information

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IPC IPC(8): C08J5/18C08G73/10H01B3/30C08L79/08
CPCC08G73/1007C08G73/1039C08G73/1042C08G73/1071C08J5/18C08J2379/08H01B3/306
Inventor 虞鑫海李智杰董浩李紫璇
Owner DONGHUA UNIV
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