Conductive ink used for ink-jet printing, and preparation method and applications thereof

A conductive ink and inkjet printing technology, applied in the field of 3D printing, can solve the problems of inability to form continuous layer-by-layer printing lines, prolong the drying process of conductive ink, and limit the accumulation efficiency of layers, so as to save drying time, provide efficiency, and improve Effect of Volatility Gradient

Inactive Publication Date: 2019-08-06
北京大华博科智能科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the addition of high boiling point solvents greatly prolongs the drying process of conductive ink during the process of layer-by-layer printing to prepare multi-layer circuit boards, and the drying and sintering curing process of conductive ink also greatly limits the layer-by-layer accumulation efficiency.
Therefore, the current research on printing conductive circuits based on conductive inks is mainly single-sided and single-layer circuits, which cannot form continuous layer-by-layer printing circuits. The second layer of printing can only be performed after the surface is dry and sintered and solidified.
[0005] Using infrared treatment is one of the solutions to solve the problem of fast drying after printing, but high-power infrared lamps are needed to drive high-boiling point solvents to volatilize. In addition to high energy consumption, high-power infrared will generate a lot of volatile gas during the drying process, and at the same time High-power infrared can easily cause deformation of the printing substrate

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] The present embodiment provides a kind of conductive ink that can be used for inkjet printing, and its preparation raw material comprises and comprises nano-silver 30 weight parts; Ethoxy ethoxy ethyl acrylate (EOEOEA) 10 weight parts; Propylene glycol methyl ether acetate 56 Parts by weight; 2 parts by weight of polyester binder resin; 1 part by weight of UV curing agent 2,4,6-trimethylbenzoyl-diphenylphosphine oxide (TPO); 1 part by weight of leveling agent BYK333.

[0048] The preparation method of the conductive ink provided in this embodiment is as follows.

[0049] (1) Mix 10 parts by weight of ethoxy ethoxy ethyl acrylate (EOEOEA) and 56 parts by weight of propylene glycol methyl ether acetate, and mechanically stir until they are evenly mixed to obtain an ink main solvent.

[0050](2) Add 2 parts by weight of polyester binder resin in the main solvent of the ink; 1 part by weight of UV curing agent 2,4,6-trimethylbenzoyl-diphenylphosphine oxide (TPO); Leveling ...

Embodiment 2

[0056] The present embodiment provides a kind of conductive ink that can be used for inkjet printing, and its preparation raw material comprises nano-silver 60 weight parts; Trimethylol cyclohexyl acrylate (TMCHA) 16 weight parts; Isopropanol 20 weight parts; 2 parts by weight of resin binder; 2 parts by weight of UV curing agent 2,4,6-trimethylbenzoylphenyl phosphonic acid ethyl ester (TOP-L).

[0057] The preparation method of the conductive ink provided in this embodiment is as follows.

[0058] (1) Mix 16 parts by weight of trimethylolcyclohexyl acrylate (TMCHA) and 20 parts by weight of isopropanol, and mechanically stir until they are evenly mixed to obtain an ink main solvent.

[0059] (2) Add 2 parts by weight of vinyl chloride resin binder in the main solvent of the ink; 2 parts by weight of UV curing agent 2,4,6-trimethylbenzoylphenylphosphonic acid ethyl ester (TOP-L) share. Add in no particular order, and stir mechanically at room temperature or with heating assi...

Embodiment 3

[0065] The present embodiment provides a kind of conductive ink that can be used for inkjet printing, and its preparation raw material comprises and comprises nano-copper 50 weight parts; Cyclotrimethylol propane formal acrylate (CTFA) 22 weight parts; Ethylene glycol diacetate 25 parts by weight; UV curing agent isopropylthioxanthone (ITX) 1.5 parts by weight; surfactant BYK-346 is 1.5 parts by weight.

[0066] The preparation method of the conductive ink provided in this embodiment is as follows.

[0067] (1) Mix 22 parts by weight of cyclotrimethylolpropane formal acrylate (CTFA) and 25 parts by weight of ethylene glycol diacetate, and mechanically stir until they are evenly mixed to obtain the ink main solvent.

[0068] (2) Add 1.5 parts by weight of UV curing agent isopropylthioxanthone (ITX) to the main solvent of the ink; 1.5 parts by weight of surfactant BYK-346. Add in no particular order, and stir mechanically at room temperature or with heating assistance (30°C to ...

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PUM

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Abstract

The invention embodiment provides a conductive ink used for ink-jet printing, and a preparation method and applications thereof. The conductive ink used for ink-jet printing comprises, by weight, 30 to 70 parts of nano metal, 10 to 40 parts of a high-boiling UV monomer humectant, 10 to 60 parts of a fast-drying solvent, 0 to 5 parts of a binder, 0.5 to 2 parts of a UV curing agent, and 0 to 2 parts of an auxiliary agent.

Description

technical field [0001] The embodiments of the present invention relate to the technical field of 3D printing, and specifically relate to a conductive ink that can be used for inkjet printing and its preparation method and application. Background technique [0002] Printed Electronics (Printed Electronics) is the use of functional inks to directly print electronic circuits on the printing plate, such as printing conductive inks on flexible organic films to obtain conductive circuits, printing semiconductor inks to obtain transistors or memory components, etc. This new generation of printed electronic circuits is an assembly containing electronic connection lines and components, which will replace the traditional printed circuit board and reinstall the components. [0003] Inkjet printed circuit board technology based on conductive ink is an advanced circuit board manufacturing technology, which is the development trend of circuit board digital manufacturing technology, and is...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/52C09D11/38H01B5/00H01B5/14
CPCC09D11/38C09D11/52H01B5/00H01B5/14
Inventor 不公告发明人
Owner 北京大华博科智能科技有限公司
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