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A kind of niobium-doped silver-tin film eutectic solder and preparation method thereof

A technology of eutectic solder and doping elements, which is applied in welding equipment, welding/cutting media/materials, welding media, etc., can solve the problems of no silver-tin solder, cumbersome preparation process, long preparation cycle, etc., and achieve improved Reliability and weldability, simple process, and the effect of improving welding performance and reliability

Active Publication Date: 2020-03-31
苏州博志金钻科技有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The method of preparing Ag-Sn solder by smelting method has cumbersome preparation process, long preparation cycle, large pollution, and solidification and formation of voids due to uneven stirring
However, no silver-tin solder doped with the element "niobium" has been seen so far, especially reports on doping metal niobium in the silver-tin eutectic alloy by using magnetron sputtering technology, thereby improving the mechanical properties of solder welding

Method used

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  • A kind of niobium-doped silver-tin film eutectic solder and preparation method thereof
  • A kind of niobium-doped silver-tin film eutectic solder and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0030] Step 1: Chemical Cleaning

[0031] For the 6061 aluminum alloy substrate material, firstly clean it with 50Hz ultrasonic wave in acetone for 10min, then clean it with 50Hz ultrasonic wave in absolute ethanol for 10min, then rinse it with deionized water and dry it, then add it to 10% (wt) NaOH solution in sequence and 30% (wt) HNO 3 solution, remove the surface oxide film and other impurities, then ultrasonically clean in absolute ethanol at 50 Hz for 10 min, and finally rinse with deionized water and dry.

[0032] Step 2: Vacuum magnetron sputtering deposition process

[0033] The background vacuum of the magnetron sputtering chamber is 2.8×10 -4 Pa, through Ar (gas flow 30sccm, air pressure 0.3Pa), silver-tin eutectic target Ag 20 sn 80 The DC power supply power is 150W, and the niobium target adopts a DC power supply power of 0W. 20 sn 80 ) pre-sputtering for 10 minutes, then the substrate is biased at -80V, after 40 minutes of coating, stop sputtering (cooling...

Embodiment 2

[0037] Step 1: Chemical Cleaning

[0038] For the 6061 aluminum alloy substrate material, firstly clean it with 50Hz ultrasonic wave in acetone for 10min, then clean it with 50Hz ultrasonic wave in absolute ethanol for 10min, then rinse it with deionized water and dry it, then add it to 10% (wt) NaOH solution in sequence and 30% (wt) HNO 3 solution, remove the surface oxide film and other impurities, then ultrasonically clean in absolute ethanol at 50 Hz for 10 min, and finally rinse with deionized water and dry.

[0039] Step 2: Vacuum magnetron sputtering deposition process

[0040] The background vacuum of the magnetron sputtering chamber is 2.8×10-4 Pa, through Ar (gas flow 30sccm, air pressure 0.3Pa), silver-tin eutectic target Ag 20 sn 80 The DC power supply is 150W, and the niobium target is DC power supply 20W. First, the two targets are pre-sputtered for 10 minutes, and then the substrate is biased at -80V. After 40 minutes of coating, the sputtering (cooling) is s...

Embodiment 3

[0044] Step 1: Chemical Cleaning

[0045] For the 6061 aluminum alloy substrate material, firstly clean it with 50Hz ultrasonic wave in acetone for 15min, then clean it with 50Hz ultrasonic wave in absolute ethanol for 15min, then rinse it with deionized water and dry it, then add it to 10% (wt) NaOH solution in sequence and 30% (wt) HNO 3 solution, remove the surface oxide film and other impurities, then ultrasonically clean in absolute ethanol at 50 Hz for 10 min, and finally rinse with deionized water and dry.

[0046] Step 2: Vacuum magnetron sputtering deposition process

[0047] The background vacuum of the magnetron sputtering chamber is 2.8×10 -4 Pa, through Ar (gas flow 30sccm, air pressure 0.3Pa), silver-tin eutectic target Ag 20 sn 80 The DC power supply is 150W, and the niobium target is DC power supply 40W. First, pre-sputter the two targets for 10 minutes, then apply a bias voltage of -80V to the substrate, stop the sputtering (cooling) after 40 minutes of co...

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Abstract

The invention discloses niobium-doped silver-tin film eutectic solder and a preparation method thereof. The preparation method comprises the following steps: first, chemically cleaning a baseplate material; and then depositing a niobium-doped silver-tin film layer to a baseplate by means of a magnetron sputtering technique to obtain the niobium-doped silver-tin film eutectic solder. Compared witha conventional smelting technique, the preparation flow of ternary lead-free solder is simplified obviously, the preparation period is short, the solder components can be controlled precisely, and thepreparation method is energy-saving and environment-friendly and has good parameter performance. The niobium-doped silver-tin film eutectic solder prepared by the invention is low in cost, low in smelting point and good in welding performance and can be widely applied to microelectronic packaging.

Description

technical field [0001] The invention belongs to the field of electronic packaging and welding, and relates to the preparation of low-temperature lead-free solder, in particular to a preparation method of silver-tin film eutectic solder doped with niobium element. Background technique [0002] Lead (Pb) solder has good mechanical properties, excellent wettability, electrical and thermal conductivity, and low production cost. For example, Sn-Pb solder is widely used in the electronic packaging industry. However, studies at home and abroad have shown that Pb and its compounds are highly toxic, and the Environmental Protection Agency (EPA) has listed them as one of the most harmful chemical substances to humans and the environment. In 2003, the European Union mandated the upgrading of the interconnection material system, prohibiting the use of Pb and other six types of toxic substances and elements in electronic information products. [0003] At present, lead-free solder contai...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C13/00C23C14/35C23C14/16C23C14/02B23K35/26
CPCB23K35/262C22C13/00C23C14/021C23C14/165C23C14/35
Inventor 宋忠孝特日格乐张宏凯李雁淮李响
Owner 苏州博志金钻科技有限责任公司
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