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Method for preparing elastic circuit board and elastic circuit board

A circuit board and elastic technology, applied in the manufacture of printed circuits, removal of conductive materials by chemical/electrolytic methods, printed circuits, etc., can solve problems such as poor tensile properties of elastic circuit boards, and achieve overcoming difficulties in welding and excellent ductility. , the effect of excellent mechanical and electrical properties

Active Publication Date: 2020-04-10
上海晶采微纳米应用技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the above problems, the object of the present invention is to provide a method for preparing an elastic circuit board and an elastic circuit board, so as to at least solve the technical problem of poor stretchability of the existing elastic circuit board

Method used

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  • Method for preparing elastic circuit board and elastic circuit board
  • Method for preparing elastic circuit board and elastic circuit board
  • Method for preparing elastic circuit board and elastic circuit board

Examples

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preparation example Construction

[0047] According to an embodiment of the present invention, a method for preparing a flexible circuit board is provided, see figure 1 , including the following preparation steps:

[0048] S1. setting a metal film 3 on the substrate 1;

[0049] S2. Coating a photosensitive material 4 on the surface of the metal thin film 3, and photoetching a metal circuit layout on the photosensitive material 4;

[0050] S3. Etching the part of the metal film 3 not covered by the photosensitive material 4 to remove the photosensitive material 4;

[0051] S4. Coating a solder resist support layer 5 on the surface of the remaining metal film 3, and pre-curing the solder resist support layer 5; the solder resist support layer 5 needs to meet the required curvature, and can be patterned and insulated at the same time.

[0052] S5. Etching the solder resist support layer 5 according to various required circuit diagrams, and thermally curing the solder resist support layer 5 to form a metal circui...

Embodiment 1

[0059] This embodiment relates to a method for preparing an elastic circuit board. The process flow for preparing the elastic circuit board is as follows: image 3 shown. Utilize the schematic diagram of the cross-section of the elastic circuit board processed by the present invention as Figure 4 As shown, it includes two layers of metal circuit layers, that is, two layers of metal films 3 and 3' and two layers of solder resist support layers 5 and 5', elastic polymer 6, solder paste 7 and a number of electronic components 8; in view of copper Metal has the advantages of low cost, superior electrical properties (low resistivity), easy etching and molding, etc. The metal film 3 and 3' material of this embodiment is copper; considering the copper metal layer thickness of 1 ounce of copper printed circuit board About 35 microns, in order to obtain similar current carrying capacity, the thickness of the metal film 3 and 3' in this embodiment is 40 microns, the minimum line width...

Embodiment 2

[0076] The preparation method of a flexible circuit board involved in this embodiment is the same as that of Embodiment 1, except that the metal film 3 is made of a low-cost aluminum film with a thickness of 10 microns; the minimum line width of the aluminum circuit is 10 microns; The support layer 5 is non-photosensitive polyimide, with a thickness of 15 microns and a minimum line width of 15 microns; the non-photosensitive polyimide solder resist support layer 5 is patterned by dry etching; the elastic polymer 6 It is silicone rubber with good tensile properties and biocompatibility, with a thickness of 1.5mm and 4 metal circuit layers.

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Abstract

The invention relates to the technical field of elastic and flexible circuit preparation, in particular to an elastic circuit board preparation method and an elastic circuit board. The method comprises the following steps of: S1, arranging a metal film on a substrate; S2, coating a photosensitive material on the surface of the metal film, and photoetching the photosensitive material to form a metal circuit layout; S3, etching the uncovered metal film portion of the photosensitive material, and removing the photosensitive material; S4, coating a solder mask supporting layer on the surface of the remaining metal film, and pre-curing the solder mask supporting layer; S5, etching the solder mask supporting layer according to the circuit diagrams of various requirements, and thermally curing the solder mask supporting layer to form a metal circuit layer; S6, repeating the steps S1-S5 to prepare a plurality of metal circuit layers, and stripping the metal circuit layers from the substrate; and S7, sequentially aligning the metal circuit layers, and welding the metal circuit layers to form the elastic circuit board. By adopting the PCB-like preparation method, the existing PCB processingequipment can be utilized to the maximum extent, and the advantages of multilayer elastic circuit preparation, large-scale production, the high yield, the low process cost and compatibility with a reflow soldering process can be achieved.

Description

technical field [0001] The invention relates to the technical field of preparation of elastic and flexible circuits, in particular to a method for preparing an elastic circuit board and the elastic circuit board, which are applicable to the fields of wearable devices, medical devices and robots, and even the field of aerospace. Background technique [0002] When electronic devices developed based on traditional printed circuit boards (Printed Circuit Board, PCB) are applied to curved surfaces (such as spherical surfaces, animal skin surfaces, etc.) and moving parts (such as human joints, robot joints, etc.), the PCB cannot be bent and Stretch, so that these products cannot form a tight fit with curved surfaces, and are not suitable for moving parts. Sensors (e.g. heart rate, pulse, EEG sensors) may lose measurement accuracy due to poor fit with the skin surface. Furthermore, this type of device also has the disadvantages of bulky equipment and poor wearing experience. Unde...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/06H05K3/28H05K3/36H05K3/34H05K1/18
CPCH05K1/189H05K3/06H05K3/282H05K3/34H05K3/363
Inventor 林树翔张笛陈迪
Owner 上海晶采微纳米应用技术有限公司
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