A kind of iron oxide photoanode system and preparation method of embedded silicon pn junction
A technology of iron oxide light and pn junction, which is applied in the direction of photovoltaic power generation, semiconductor devices, and final product manufacturing, etc. The effect of ensuring uniformity
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Embodiment 1
[0037] An iron oxide photoanode system with embedded silicon pn junction, such as figure 1 As shown: the photoanode is a composite layer structure, which sequentially includes an iron oxide absorption layer 1-4, a p-type silicon doped layer 1-2, an n-type silicon substrate 1-1, and a back conductive layer 1 along the light incident direction -5, the back waterproof insulation layer 1-6; the p-type silicon doped layer and the n-type silicon substrate form a silicon pn junction: (1) the morphology of the silicon pn junction is a pyramidal array structure; (2) p-type silicon A transparent conductive tunneling layer 1-3 is disposed between the doped layer 1-2 and the iron oxide absorbing layer 1-4, and the thickness of the transparent conductive tunneling layer is equal everywhere.
[0038] The iron oxide photoanode system with embedded silicon pn junction proposed by the present invention can completely photolyze water. The incident light enters the inside of the photoanode, and...
Embodiment 2
[0040] A method for preparing an iron oxide photoanode system embedded with a silicon pn junction, comprising the following steps:
[0041] 1) Use an n-type silicon wafer with a resistivity of 1-5 Ω·cm to perform standard RCA cleaning.
[0042] 2) In a mixed solution of potassium hydroxide and isopropanol, react at 80°C for 60 minutes, and clean the silicon wafer to obtain an n-type silicon pyramid array structure, such as figure 2 shown.
[0043] 3) The n-type silicon pyramid array obtained in step 2) is doped with boron by means of thermal diffusion, and the doping concentration is 2.0×10 19 cm -3 , the junction depth is 200nm. Protect the back side of the n-silicon during thermal diffusion, so that boron doping only occurs on the front side of the silicon pyramid structure.
[0044] 4) Put the prepared silicon pn junction pyramid array into the cavity of the atomic layer deposition system, using tetrakis(dimethylamino)tin as the tin source and tert-butyliminotris(dieth...
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