The invention relates to a micromechanical component for a
stress sensor, having a first substrate (10) with a first
substrate surface (10a), a second substrate (12) with a second
substrate surface (12a) and an evaluation
electronics (20) configured at and / or in the second substrate (12), wherein the first substrate (10) is fixed at the second substrate (12) by means of at least one
electrical connection (22) formed by means of a
metal bonding method, which is configured in an intermediate volume (14) between the first
substrate surface (10a) and the second substrate surface (12a), wherein at least one
electrode (16, 16a, 16b, 62) and at least one counter
electrode (18a, 18b, 18c) are arranged in the intermediate volume (14), wherein the at least one
electrode (16, 16a, 16b, 62) and / or the at least one counter electrode (18a, 18b, 18c) are electrically connected at the evaluation
electronics (20) by means of the at least one
electrical connection (22) formed by means of a
metal bonding method.