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Alumina polishing solution for copper polishing and preparation method thereof

A technology of alumina and polishing fluid, which is applied in the direction of polishing compositions containing abrasives, etc., can solve the problems that the cutting rate and flatness cannot meet the requirements of industrial production, and achieve the effect of reducing equipment damage

Active Publication Date: 2019-09-20
HUNAN HAOZHI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The research and development of alkaline copper polishing fluid is the main direction of current research, but because the cutting rate and flatness cannot meet the requirements of industrial production, there is currently no mass-produced product on the market

Method used

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  • Alumina polishing solution for copper polishing and preparation method thereof

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Comparison scheme
Effect test

Embodiment 1

[0030] The preparation of the aluminum oxide polishing liquid for copper polishing of the present embodiment comprises the following steps:

[0031] A, material preparation: get respectively by weight:

[0032] 200 parts of alumina (α-alumina, with an average particle size of 0.5 μm), 10 parts of polyacrylic acid (surfactant), 20 parts of disodium hydrogen phosphate (corrosion inhibitor), ethylenediaminetetraacetic acid and aluminum chloride (mass The ratio is 1:1) (pH regulator) 50 parts, sodium hexametaphosphate (dispersant) 10 parts, magnesium aluminum silicate (suspension agent) 10 parts, deionized water 1000 parts, spare;

[0033] B. Initial mixing: add aluminum oxide and polyacrylic acid to deionized water, stir evenly to obtain the initial mixed solution, and set aside;

[0034] C. Compound mixing: Add sodium hexametaphosphate, magnesium aluminum silicate and disodium hydrogen phosphate to the initial mixed solution in sequence, stir evenly, and place it for 24 hours, ...

Embodiment 2

[0037] The preparation of the aluminum oxide polishing liquid for copper polishing of the present embodiment comprises the following steps:

[0038] A, material preparation: get respectively by weight:

[0039] 150 parts of alumina (α-alumina, with an average particle size of 1.5 μm), 20 parts of polyacrylic acid and sodium dodecylbenzenesulfonate (mass ratio 1:1) (surfactant), disodium hydrogen phosphate and hydroxyl Ethylenediphosphonic acid (mass ratio 1:1) (corrosion inhibitor) 40 parts, aluminum nitrate (pH regulator) 100 parts, polyethylene glycol-400 (dispersant) 20 parts, magnesium aluminum silicate (suspension agent) 20 parts, 1000 parts of deionized water, standby;

[0040] B. Initial mixing: Add aluminum oxide, polyacrylic acid and sodium dodecylbenzenesulfonate to deionized water, stir evenly to obtain the initial mixed solution, and set aside;

[0041] C. Compound mixing: add polyethylene glycol-400, magnesium aluminum silicate, disodium hydrogen phosphate, and ...

Embodiment 3

[0044] The preparation of the aluminum oxide polishing liquid for copper polishing of the present embodiment comprises the following steps:

[0045] A, material preparation: get respectively by weight:

[0046] 100 parts of alumina (α-alumina, with an average particle size of 2.5 μm), 30 parts of sodium benzoate and sodium dodecylbenzenesulfonate (1:1 by mass ratio) (surfactant), benzotriazole and Hydroxyethylidene diphosphonic acid (mass ratio 1:1) (corrosion inhibitor) 60 parts, citric acid and aluminum chloride (mass ratio 1:1) (pH regulator) 150 parts, sodium tripolyphosphate (dispersion agent) 30 parts, sodium carboxymethylcellulose (suspending agent) 30 parts, deionized water 1000 parts, standby;

[0047] B. Initial mixing: Add aluminum oxide, sodium benzoate and sodium dodecylbenzenesulfonate to deionized water, stir evenly to obtain the initial mixed solution, and set aside;

[0048]C. Compound mixing: Add sodium tripolyphosphate, sodium carboxymethylcellulose, benzo...

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Abstract

The invention discloses an alumina polishing solution for copper polishing and a preparation method thereof, belonging to the technical field of preparation of blue glass polishing materials. The alumina polishing solution comprises the following components by weight: 100-400 parts of alumina, 1-40 parts of a surfactant, 1-80 parts of a corrosion inhibitor, 1-100 parts of a pH adjuster, 1-40 parts of a dispersant, 1-40 parts of a suspending agent and 1000 parts of deionized water. The preparation method comprises the following steps: A, material preparation; B, initial mixing; C, re-mixing; and D, pH adjustment. The alumina polishing solution has the characteristics of high polishing efficiency, little environmental pollution, little corrosion to equipment, etc., and is applicable to high-precision polishing of copper surfaces.

Description

technical field [0001] The invention relates to the technical field of preparation of copper substrate surface polishing materials, in particular to an aluminum oxide polishing solution for copper polishing and a preparation method thereof. Background technique [0002] Chemical mechanical polishing (CMP) is currently recognized as the most effective method to achieve local and global planarization of materials, and is widely used in surface planarization of IC manufacturing processes. It uses the chemical solution in the slurry and the tiny abrasive particles to undergo a series of chemical reactions with the surface of the workpiece, thereby changing the chemical bonds on the surface and generating chemical reaction products with low shear strength that are easy to remove, and then through the mechanical action of the polymer polishing pad and the workpiece , to remove the reaction products to obtain a smooth surface with low roughness. [0003] With the development of ve...

Claims

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Application Information

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IPC IPC(8): C09G1/02
CPCC09G1/02
Inventor 吴兴泽
Owner HUNAN HAOZHI TECH
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