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Mud-like high-temperature-resistant heat-conducting composite material and preparation method thereof

A heat-conducting composite material and high-temperature-resistant technology, applied in the direction of heat exchange materials, chemical instruments and methods, etc., can solve the problems of poor high-temperature resistance, cumbersome use process, and short storage time of heat-conducting image-changing materials, and achieve thermal stability And high temperature aging performance is excellent, the operation is simple and convenient, and the effect of good storage stability

Inactive Publication Date: 2019-10-11
东莞市盛元新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Thermal pads are the current mainstream products, which need to be prepared into different thickness specifications and shapes, resulting in high production loss and high cost; moreover, the microscopic gap filling ability of thermal pads is poor, and microscopic gaps are not filled, resulting in large gaps. Contact thermal resistance, not conducive to rapid heat transfer
Thermal paste is easy to produce oil, which is easy to cause circuit board contamination during use, and there is a great risk of circuit short circuit. In addition, it is prone to sedimentation and oil powder separation during storage. It needs to be stirred again before each use, and the use process is cumbersome.
Thermal image change material has poor high temperature resistance and is not suitable for long-term use under high temperature conditions
[0004] At present, the thermal conductivity of thermal gel on the market is low, the oil yield is high, and the reaction is incomplete, resulting in a short storage time; some electrical components with long-term high calorific value require thermal conductive materials with high temperature resistance and aging resistance Requirements, the current thermal gel on the market can not meet the requirements

Method used

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  • Mud-like high-temperature-resistant heat-conducting composite material and preparation method thereof
  • Mud-like high-temperature-resistant heat-conducting composite material and preparation method thereof
  • Mud-like high-temperature-resistant heat-conducting composite material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Step 1. Add zinc oxide with a D50 of 1 μm, 5 μm alumina and 40 μm alumina into the kneader, stir and heat up to 120 ° C, and evenly add vinyl tris(b-methoxyethoxy) during the stirring process Silane and stearic acid, then heat-preserved and sealed and stirred for 0.5h, stopped stirring, stopped heating and evacuated to -0.1Mpa, 25min.

[0027] Step 2. Add phenylvinyl silicone oil with dynamic viscosity of 1000mPa.s at 25°C, vinyl silicone oil of 350mPa.s and flame retardant to the kneader, heat at 135°C, vacuumize and stir for 3 hours, cool down to room temperature, and make into the base material.

[0028] Step 3, put the base material made in step 2 into a three-roll mill and grind it three times.

[0029] Step 4. Add the base material ground in step 3 to the planetary mixer, then add 0.18% hydrogen-containing silicone oil with terminal side chains, 0.1% hydrogen-containing silicone oil at both ends, catalyst and other additives, and stir at room temperature for 0.5h...

Embodiment 2

[0031] Step 1. Add alumina with D50 of 0.5 μm, aluminum nitride of 2 μm and alumina of 70 μm into the kneader, stir and heat up to 110°C, add cetyltrimethoxysilane evenly during the stirring process, and then keep warm Seal and stir for 2h, stop stirring, stop heating and vacuumize to -0.1Mpa for 30min.

[0032] Step 2. Add phenyl dimethyl silicone oil with a dynamic viscosity of 500mPa.s at 25°C, MQ silicone resin with an M / Q of 0.9 at 1500mPa.s, and a flame retardant to the kneader, and stir at a high temperature of 150°C under vacuum 3h, cool down to room temperature, and make base material.

[0033] Step 3, put the base material made in step 2 into a three-roll mill and grind it three times.

[0034] Step 4. Add the base material ground in step 3 to the planetary mixer, then add 0.18% side chain hydrogen-containing silicone oil, 0.1% two-terminal hydrogen-containing silicone oil, catalyst and other additives, first stir at room temperature at 30r / min for 0.5h, Then heat ...

Embodiment 3

[0036] Step 1. Add alumina with a D50 of 0.5 μm, 7 μm alumina and 40 μm boron nitride into the kneader, stir and heat up to 110°C, and add 2-(3,4 epoxycyclohexane evenly during the stirring process base) propyltriethoxysilane and n-hexyltriethoxysilane, then heat-preserved, sealed and stirred for 1h, stopped stirring, stopped heating and evacuated to -0.1Mpa for 30min.

[0037] Step 2. Add vinyl silicone oil with a dynamic viscosity of 350mPa.s at 25°C, MQ silicone resin with an M / Q of 1.1 at 1000mPa.s, and a flame retardant to the kneader. Stir at a high temperature of 130°C for 2.5 hours under vacuum , cooled to room temperature, and made into a base material.

[0038] Step 3, put the base material made in step 2 into a three-roll mill and grind it three times.

[0039] Step 4. Add the ground material in step 3 to the planetary mixer, then add 0.18% hydrogen-containing silicone oil with side chains, 0.05% hydrogen-containing silicone oil with side chains, catalyst and other...

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Abstract

The invention discloses a mud-like heat-conducting composite material. The mud-like heat-conducting composite material comprises the following compositions according to a weight proportion: 3%-50% ofsilicone oil, 0.1%-5% of a cross-linking agent, 0.1%-5% of a surface modifier, 0-20% of a fire retardant, 50%-97% of heat-conducting filler, 0.05%-0.015% of a catalyst, and other auxiliaries. In addition, the invention further discloses a preparation method for the above mud-like high-temperature-resistant heat-conducting composite material. The mud-like heat-conducting composite material has theadvantages of excellent high temperature resistance, a high heat conductivity coefficient, good heat stability, a low oil yield, convenient extrusion, good storage stability and strong operability andthe like, and is capable of greatly improving efficiency, and very suitable for solving a heating problem of electronic components.

Description

technical field [0001] The invention belongs to the field of heat-conducting materials, and in particular relates to a mud-like high-temperature-resistant heat-conducting composite material. Background technique [0002] With the rapid development of the electronics industry, the miniaturization and density of electronic components are getting higher and higher, and the heat emitted per unit volume is also getting higher and higher. However, continuous high temperature will cause great damage to electronic components and greatly shorten the service life and efficiency of components. Therefore, it is urgent to develop a stable and efficient thermal conductive composite material. [0003] At present, the thermal conduction products in the market include thermal pads, thermal paste, thermal image change materials and thermal gels. Thermal pads are the current mainstream products, which need to be prepared into different thickness specifications and shapes, resulting in high pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K5/08
CPCC09K5/08
Inventor 赵志垒陈俊龙夏瑞祥宁宇明
Owner 东莞市盛元新材料科技有限公司
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