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Preparation method of pressure-sensitive film, pressure-sensitive film and pressure sensor

A pressure-sensitive film, extrusion grinding technology, applied in the preparation of pressure-sensitive film, pressure-sensitive film and pressure sensor field, can solve the problems of high cost, unstable pressure sensor quality, etc., achieve small detection limit, excellent piezoresistive effect , conductivity and piezoresistive effects can be controlled and adjusted

Pending Publication Date: 2019-10-15
TIANJIN VOCATIONAL INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention aims to solve the technical problems of unstable quality and high cost of pressure sensors in the prior art, and provides a pressure-sensitive film and its preparation method and a pressure sensor based on the pressure-sensitive film

Method used

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  • Preparation method of pressure-sensitive film, pressure-sensitive film and pressure sensor
  • Preparation method of pressure-sensitive film, pressure-sensitive film and pressure sensor
  • Preparation method of pressure-sensitive film, pressure-sensitive film and pressure sensor

Examples

Experimental program
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Effect test

Embodiment 1

[0039] Step 1: Mix graphite and 150-mesh cubic silicon carbide evenly, and then put them into a mortar grinder, wherein the mass ratio of graphite to silicon carbide is 1:10. Apply 100N / cm to the mortar 2 Extrusion grinding is carried out with the action force, and the grinding time is 5h.

[0040] Step 2, transfer the ground mixture to dichloromethane, shake it up, ultrasonically disperse, then let stand for 2 days or centrifuge 10min in a centrifuge at 1000rpm, take the supernatant to obtain an organic solution containing graphene, such as figure 1 (left) shown. The graphene has a thickness of 0.35-20 nm and a lateral dimension of 0.1-20 μm.

[0041] Step 3, the polyurethane is added into dichloromethane to dissolve to obtain an organic solution containing polyurethane. The organic solution containing graphene and the organic solution containing polyurethane are mixed together, and the mass ratio of graphite to polyurethane is 100:57 for preparation to obtain a mixed solu...

Embodiment 2

[0045] Step 1: Mix graphite, black arsenic and phosphorus with 150-mesh cubic silicon carbide uniformly at a mass ratio of 93:7, and then put them into a mortar grinder, wherein the mass ratio of graphite to cubic boron nitride is 1:10. Apply 100N / cm to the mortar 2 Extrusion grinding is carried out with the action force, and the grinding time is 5h.

[0046] Step 2, transfer the ground mixture to dichloromethane, shake it up, ultrasonically disperse, then let it stand for 2 days or centrifuge it in a centrifuge at 1000rpm for 10min, take the supernatant, and obtain a mixture containing two-dimensional graphene and two-dimensional graphene. Organic solutions of black arsenic and phosphorus, such as figure 1 (right) shown. Among them, the thickness of graphene and two-dimensional black arsenic phosphorus is 0.35-20 nm, and the lateral size is 0.1-20 μm.

[0047] Step 3, the polyurethane is added into dichloromethane to dissolve to obtain an organic solution containing polyur...

Embodiment 3

[0051] In step 1, the finished graphene is added into dichloromethane for ultrasonic dispersion, and the graphene dispersion is obtained by ultrasonication for 2 hours.

[0052] Step 2, dissolving the polyurethane into dichloromethane to obtain a polyurethane dispersion.

[0053] In step 3, the graphene dispersion and the polyurethane dispersion are mixed together and stirred to obtain a viscous mixture. Wherein, the mass ratio of graphene and polyurethane is 100:57.

[0054] Step 4: Spin-coat the viscous mixture prepared in Step 3 to form a film, and then heat and solidify at 60° C. for 2 hours, so that the viscous mixture is polymerized. Dichloromethane evaporates to form a pressure-sensitive film composed of graphene and polyurethane, such as figure 2 as shown in c.

[0055] Step five, the pressure-sensitive film that step four makes according to image 3 The pressure sensor structure shown was assembled to fabricate the pressure sensor.

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Abstract

The invention discloses a preparation method of a pressure-sensitive film, the pressure-sensitive film and a pressure sensor, wherein the preparation method of the pressure-sensitive film mainly comprises (1) grinding and extruding a layered material; (2) dissolving out a two-dimensional material with an organic solvent; (3) blending the two-dimensional material with an organic solution containinga polymer; and (4) making the film. The invention also discloses the pressure sensitive film prepared by the preparation method and the pressure sensor based on the pressure sensitive film. In addition, the invention also discloses the pressure sensitive film mainly composed of a two-dimensional conductive material, a two-dimensional semiconductor material and a flexible high molecular polymer. The pressure-sensitive film has the advantages of simple preparation method, industrial large-scale production, controllable product performance, uniform quality and the like.

Description

technical field [0001] The invention belongs to the field of flexible electronic devices, and in particular relates to a preparation method of a pressure-sensitive film, a pressure-sensitive film and a pressure sensor. Background technique [0002] The pressure sensor is a very widely used device in life, such as applied to smart water cups, precision balances, air switches in car seats, etc. On the one hand, pressure sensors require good linearity, such as pressure sensors in high-precision balances; on the other hand, they require high mechanical properties, such as pressure sensors in car seats, which need to go through repeated deformation and friction. A typical pressure sensor structure is as follows: conductive ink is used as the bottom layer, an open circuit silver circuit is used as the top layer, and an air gasket is used as the middle layer. When pressure is applied to the surface of the pressure sensor, the silver circuit on the top layer comes into contact with...

Claims

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Application Information

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IPC IPC(8): C08J5/18C08L75/04C08L79/04C08L61/16C08L71/02C08K3/04C08K3/02C08K3/30G01L1/18
CPCC08J5/18G01L1/18C08K2201/001C08J2375/04C08J2379/04C08J2361/16C08J2371/02C08K3/042C08K2003/026C08K2003/3009C08K3/30
Inventor 吴慧蔡兴科刘冰冰
Owner TIANJIN VOCATIONAL INST
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