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A method for directly electroplating circuit boards based on graphene film formation

A graphene and circuit board technology, applied in printed circuit, printed circuit manufacturing, printed circuit components, etc., can solve the problems of high cost, cumbersome process, waste of production cost, etc., achieve mild operating conditions, simple wastewater treatment, and process short process effect

Active Publication Date: 2022-03-25
深圳市天泽科技实业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The traditional circuit board electroplating process in the printed circuit (PCB) industry uses copper sinking first, and then electroplating. This process is very mature, but it has its own insurmountable shortcomings: (1) Formaldehyde, a carcinogenic substance, is used. Seriously affect the health of the operator and pollute the environment; (2) A large amount of complexing agent for electroless copper makes wastewater treatment difficult and the cost of wastewater treatment is also high; (3) The stability of the liquid is difficult to control, resulting in waste and production costs (4) The process is cumbersome, takes a long time, and uses a large amount of liquid medicine and other materials, and the cost is relatively high, etc.
However, due to the structural characteristics of graphene itself, graphene sheets are neither hydrophilic nor lipophilic, and the sheets are easy to reunite due to the π-π interaction, which also restricts its wider application.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] 1. The graphene sheet (sheet diameter is 1 μm, particle thickness is 10 nm, specific surface area is 460 m) 2 / g), under acidic conditions, using KMnO 4 The graphene is treated to generate functional groups on the entire graphene basal plane and edges, thereby obtaining graphene oxide containing carboxyl (-COOH) and carbonyl (-CO-) functional groups.

[0027] 2. The graphene oxide containing the specified functional group (carboxyl group, hydroxyl group, carbonyl group, amino group, hydrogen peroxide group, peroxy group, thiol group, and isocyanate group functional group) is placed at 950 ° C in an atmosphere of nitrogen or argon. thermal expansion for 0.5 hours; then the thermally expanded graphene oxide was treated with positively charged polyethyleneimine (PEI) to improve the morphology of the graphene sheets; finally, the newly obtained graphene oxide was subjected to The polymer is grafted, graphene oxide, polyester resin, ethanol and acetone are mixed, and the re...

Embodiment 2

[0035] 1. The graphene sheet (the sheet diameter is 18 μm, the particle thickness is 0.70 nm, and the specific surface area is 1200 m) 2 / g), under acidic conditions, using H 2 SO 4 The graphene is treated to generate functional groups on the entire graphene basal plane and edges, thereby obtaining graphene oxide containing carboxyl (-COOH) and carbonyl (-CO-) functional groups.

[0036] 2. The graphene oxide containing the specified functional group (carboxyl group, hydroxyl group, carbonyl group, amino group, hydrogen peroxide group, peroxy group, thiol group, isocyanate group functional group) is placed at 700 ° C under nitrogen or argon atmosphere. Then, the thermally expanded graphene oxide was treated with positively charged polyethyleneimine (PEI) to improve the morphology of the graphene sheets; finally, the newly obtained graphene oxide was subjected to The polymer is grafted, graphene oxide, polyester resin, ethanol and acetone are mixed, and the reaction is complete...

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Abstract

The invention belongs to the technical field of circuit board production, and discloses a method for directly electroplating a circuit board based on graphene film formation. The method comprises: 1. washing the surface of the pre-treated circuit board, and vibrating the circuit board, so that the holes of the circuit board are filled with water; then removing the water on the surface of the circuit board, while keeping the water-filled state in the holes of the circuit board; 2. In the film-forming process, the circuit board is vibrated, so that the graphene oxide-polymer composite serous film formed on the surface of the circuit board and in the hole is dried, pickled, dried for the second time, and the board is collected; 3. The circuit board covered with the conductive film is activated in acidic solution; 4. Prepare the electroplating solution, set the electroplating parameters, perform electroplating, and complete the electroplating. The invention forms a conductive layer on a circuit board based on a graphene film forming process to replace electroless copper deposition. The circuit board is based on graphene direct electroplating process with short process flow, mild operating conditions, no formaldehyde, EDTA and other complexes, low pollution, easy control, and simple wastewater treatment.

Description

technical field [0001] The invention belongs to the technical field of circuit board manufacturing, and more particularly, relates to a method for direct electroplating circuit boards based on graphene film formation. Background technique [0002] The traditional circuit board electroplating process in the printed circuit (PCB) industry uses copper sinking first, and then electroplating. This process is very mature, but it has its own insurmountable shortcomings: (1) The use of formaldehyde, a carcinogen, Seriously affects the health of operators and pollutes the environment; (2) A large number of complexing agents for chemical copper precipitation make wastewater treatment difficult and the cost of wastewater treatment is high; (3) The stability of the transfer liquid is difficult to control, resulting in waste and production costs (4) The process is cumbersome and time-consuming, and a lot of materials such as potions are used, and the cost is relatively high. [0003] Th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/18H05K1/09C25D5/54C25D3/38
CPCH05K3/188H05K1/092C25D5/54C25D3/38
Inventor 周秋曼宋文杰刘根潘湛昌胡光辉魏志钢
Owner 深圳市天泽科技实业有限公司