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A kind of bottom filling composition

A technology of underfill glue and composition, which is applied in the direction of adhesives, adhesive types, epoxy resin glue, etc., can solve the problems of low thermal expansion coefficient, high thermal conductivity, flexural strength, high viscosity of underfill glue composition, Inconvenient for flip-chip packaging and other problems, to overcome the effects of solder joints falling off or breaking, improving wetting and spreading, and low thermal expansion coefficient

Active Publication Date: 2021-11-26
深圳泰研半导体装备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, the underfill composition disclosed above still has high viscosity, and does not have low thermal expansion coefficient, high thermal conductivity, and high flexural strength, and its performance is not excellent enough, so it is not convenient to be used in flip-chip packaging.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] This embodiment provides an underfill composition, which includes the following components by weight: 40 g of spherical silica particles, 25 g of bisphenol A epoxy resin, 20 g of methyl hexahydrophthalic anhydride curing agent, and 0.4 g of silicone coupling agent. g and 14.6g of additives, of which the additives include accelerator 2-ethyl-4-methylimidazole 1.0g, BYK-370 0.5g, polysiloxane defoamer 0.3g, dimethyl phthalate 1.0 g, 0.6 g of carbon black, and 11.2 g of acetone.

[0044] The performance of the underfill composition prepared in the above-mentioned Example 1 is as follows:

[0045] The viscosity is 20pa.s, the thermal expansion coefficient CTEl: 38ppm / ℃, CTE2: 112ppm / ℃, the thermal conductivity is 1.6W / m·K, and the bending strength is 120MPa.

Embodiment 2

[0047] This embodiment provides an underfill composition, which includes the following components by weight: 60 g of a mixture of spherical silica particles and spherical alumina particles, 25 g of bisphenol A epoxy resin, and 5 g of methyl hexahydrophthalic anhydride curing agent , 0.6g of silicone coupling agent and 9.4g of auxiliary agent, wherein the auxiliary agent includes 1.0g of accelerator 2-ethyl-4-methylimidazole, 0.6g of acrylic dispersant, 0.5g of acrylic defoamer, o-phthalic 0.7 g of diethyl diformate, 0.6 g of black paste obtained by mixing carbon black and bisphenol F diglycidyl ether, and 6.0 g of ethyl acetate.

[0048] The performance of the underfill composition prepared in the above-mentioned Example 2 is as follows:

[0049] The viscosity is 30pa.s, the thermal expansion coefficient CTEl: 46ppm / ℃, CTE2: 120ppm / ℃, the thermal conductivity is 1.8W / m·K, and the bending strength is 115MPa.

Embodiment 3

[0051] This embodiment provides an underfill composition, which includes the following components by weight: 40 g of a mixture of spherical silica particles and spherical silicon nitride particles, 25 g of bisphenol F epoxy resin, 20 g of dicyandiamide curing agent, Organic titanate coupling agent 0.4g and auxiliary agent 14.6g, wherein auxiliary agent includes accelerator 2-ethyl-4-methylimidazole 1.0g, BYK-370 0.5g, polysiloxane defoamer 0.3g , 11.2 g of acetone, 0.6 g of carbon black, and 1.0 g of dibutyl phthalate.

[0052] The performance of the underfill composition prepared in the above-mentioned Example 3 is as follows:

[0053] The viscosity is 25.0pa.s, the thermal expansion coefficient CTEl: 35ppm / ℃, CTE2: 120ppm / ℃, the thermal conductivity is 1.7W / m·K, and the bending strength is 135MPa.

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PUM

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Abstract

The invention discloses a bottom filling glue composition, which comprises the following components in weight percentage: 30-65% of filler, 15-55% of epoxy resin, 7-20% of curing agent, and 0.1-2.0% of silane coupling agent , auxiliary agent 1.5~45%, described filler is inorganic filler, and described filler includes silicon dioxide spherical particle, and described auxiliary agent includes accelerator, diluent, plasticizer, defoamer, dispersant, pigment any one or any combination of them. Through the combination of the above formula and its component content, the underfill composition can have the properties of low viscosity, low thermal expansion coefficient, high thermal conductivity and high bending strength, and can overcome the solder joints that often lead to detachment in thermal cycle tests or fracture, and has long-term usability, good adhesion, and excellent mechanical properties.

Description

technical field [0001] The invention relates to the technical field of adhesives, in particular to an underfill adhesive composition with low viscosity, low thermal expansion coefficient, high thermal conductivity and high bending strength. Background technique [0002] An underfill is a liquid-phase adhesive, usually a highly silica-filled epoxy composition. Underfill is a key material in flip-chip packaging technology. [0003] Originally designed for flip chips to enhance their reliability, the thermal expansion coefficient of silicon chips is much lower than that of ordinary PCB board materials, so solder joints often fall off or break during thermal cycle tests. Therefore, the underfill should have a thermal expansion coefficient matching that of the solder ball, low viscosity, high thermal conductivity, and high flexural strength, as well as long-term usability, good adhesion, and excellent mechanical properties. [0004] However, the existing underfills do not have ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J163/02C09J11/04
CPCC08K2201/011C08L2205/025C08L2205/03C09J11/04C09J163/00C08L83/04C08K13/04C08K7/18C08K5/12C08K3/04C08K5/3445C08L63/00
Inventor 张少波
Owner 深圳泰研半导体装备有限公司
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