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Long-wavelength laser material printing method

A laser printing, long-wavelength technology, applied in the direction of additive processing, process efficiency improvement, transportation and packaging, etc., can solve the problems of complex process, low extrusion precision, long cycle, etc., to achieve broad application prospects, high precision and compactness effect

Inactive Publication Date: 2019-11-01
SHANGHAI INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the method of prefabricating the precursor is more complicated, the cost is higher, and the strength of the prepared silicon carbide ceramics is not high
However, the yield of grouting molding is low and the cycle is long, which is not conducive to mechanization and automation and it is difficult to guarantee product quality
The method of preparing silicon carbide by extrusion molding has low extrusion precision

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] A method for printing materials with a long-wavelength laser, the specific steps are:

[0028] Step S1, weighing resin and silicon carbide powder with a volume ratio of 1:1, the resin is a mixed resin uniformly mixed with HEMA, PHEA, HDDA and TMPTA with a volume ratio of 2:1:4:3;

[0029] Step S2, adding a composite dispersant of 2 wt% of the total amount of silicon carbide powder to the resin, the composite dispersant is BYK-110 and BYK-106 with a mass ratio of 1:1, and mixed and stirred for 5 minutes;

[0030] Step S3, adding a composite initiator of 1.5wt% of the total amount of resin, the composite initiator is dibenzoyl peroxide and N,N-dimethylacetamide with a mass ratio of 1:1, mixed and stirred for 5 minutes to obtain mixture;

[0031] Step S4, weighing boron carbide powder according to 1.5wt% of the total amount of silicon carbide powder, adding the weighed silicon carbide powder and boron carbide powder into the mixed solution, and continuing to mix and stir ...

Embodiment 2

[0038] A method for printing materials with a long-wavelength laser, the specific steps are:

[0039] Step S1, weighing resin and silicon carbide powder with a volume ratio of 2:3, the resin is a mixed resin uniformly mixed with HEMA, HDDA and TMPTA with a volume ratio of 3:4:3;

[0040] Step S2, adding a composite dispersant of 4 wt% of the total amount of silicon carbide powder to the resin, the composite dispersant is BYK-2012 and BYK-106 with a mass ratio of 1:2, and mixed and stirred for 8 minutes;

[0041] Step S3, continue to add the composite initiator of 2wt% of the total amount of resin, the composite initiator is dibenzoyl peroxide and N,N-dimethylacetamide with a mass ratio of 1:1, mix and stir for 7 minutes, and obtain mixture;

[0042] Step S4, adding the weighed silicon carbide powder and boron carbide powder with a total amount of 1.5wt% of the silicon carbide powder into the mixed solution, and continued mixing and stirring for 60 minutes until the powder was...

Embodiment 3

[0049] A method for printing materials with a long-wavelength laser, the specific steps are:

[0050] Step S1, weighing resin and silicon carbide powder with a volume ratio of 2:3, the resin is a mixed resin uniformly mixed with HEMA, HDDA, PHEA and TMPTA with a volume ratio of 3:2:3:2;

[0051] Step S2, add a composite dispersant of 5 wt% of the total amount of silicon carbide powder to the resin, the composite dispersant is BYK-2012 and BYK-106 with a mass ratio of 1:3, and mix and stir for 8 minutes;

[0052] Step S3, continue to add the composite initiator of 2wt% of the total amount of resin, the composite initiator is dibenzoyl peroxide and N,N-dimethylacetamide with a mass ratio of 1:1, mix and stir for 7 minutes, and obtain mixture;

[0053] Step S4, adding the weighed silicon carbide powder and boron carbide powder with a total amount of 1.5wt% of the silicon carbide powder into the mixed solution, and continued mixing and stirring for 60 minutes until the powder was...

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Abstract

The invention provides a method for printing a material through long-wavelength laser. The method is characterized by comprising the steps of: S1, weighing resin and silicon carbide or metal powder; S2, adding a composite dispersing agent and an initiator into the resin to prepare a mixed solution; S3, adding silicon carbide or metal powder and boron carbide powder into the mixed solution to prepare silicon carbide slurry or metal slurry; S4, uniformly coating a flat plate with the silicon carbide or metal slurry by using an SZQ type four-side wet film preparation device; S5, using a laser device with the wavelength ranging from 0.6-11 [mu]m for scan-heating the slurry to solidify the silicon carbide slurry or the metal slurry; and S6, sintering the cured silicon carbide or metal green body to prepare the silicon carbide or metal device. According to the invention, the problem of accurate shape control of the structure in the silicon carbide material is solved.

Description

technical field [0001] The invention relates to a method for printing materials with a long-wavelength laser. Background technique [0002] Silicon carbide ceramics have good mechanical strength, excellent corrosion resistance and oxidation resistance, high thermal conductivity and small thermal expansion coefficient. It is one of the best high-temperature mechanical properties among ceramic materials and is widely used in national defense, Machinery, chemical industry, metallurgy and electronics and other fields. Due to the characteristics of high hardness and high brittleness of silicon carbide ceramics, it brings great difficulties to its processing and molding. Devices with simple structures can be fabricated by conventional methods without the need for 3D printing. The fabrication of highly dense and irregularly shaped SiC parts is a difficult point. [0003] At present, the research on the method of preparing silicon carbide parts mostly uses the methods of prefabri...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/565C04B35/622B33Y70/00B22F1/00B22F3/105B33Y10/00
CPCC04B35/565C04B35/622B33Y70/00B33Y10/00C04B2235/3821C04B2235/6026C04B2235/665C04B2235/656C04B2235/6567C04B2235/658C04B2235/9638B22F10/00B22F1/10B22F10/36B22F10/16B22F12/41Y02P10/25
Inventor 曹传如王操赵喆
Owner SHANGHAI INST OF TECH
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