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The application discloses a kind of composite tin paste for SEM chip and preparation method thereof, belong to composite tin paste technical field, including SnAgCu alloy spherical powder, spherical copper powder and soldering paste;Wherein, the particle size range of SnAgCu alloy spherical powder is 20~75 μm;The particle size range of the spherical copper powder is 1~60 μm;The mass percentage of the spherical copper powder in the total mass of alloy contained in the composite tin paste is 20%~70%;The soldering paste includes by mass percentage: rosin resin 40%~60%, organic acid activator 5%~15%, thixotropic agent 3%~8%, antioxidant 0.1%~5%, and the balance is organic solvent.The application adds the spherical copper powder with mass percentage 20%~70% and particle size range 1~60 μm in SnAgCu alloy spherical powder, substantially replaces expensive silver, significantly reduces the raw material cost of tin paste under the premise of guaranteeing or even improving welding performance, overcome the technical problems that the cost of existing SnAgCu tin paste is high due to high silver content.