Surface treatment method of sapphire substrate and crucible therefor
A sapphire substrate and surface treatment technology, applied in the direction of post-processing, post-processing details, chemical instruments and methods, etc., can solve the problems of danger, time-consuming and laborious, low efficiency, etc., to optimize the processing effect, improve the processing efficiency, and facilitate the movement. Effect
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Embodiment 1
[0089] The surface treatment process of the sapphire substrate described in this embodiment adopts a traditional ark-shaped crucible, and the sapphire substrate is placed on one side corner of the crucible. The schematic diagram is as follows Figure 4 As shown, the sapphire substrate described in this embodiment is a C plane (0001), with a diameter of 3 inches, and its surface topography is as follows Figure 5 shown.
[0090] Described sapphire substrate surface treatment method comprises the following steps:
[0091] (1) The sapphire substrate is ultrasonically cleaned for 5 minutes by acetone, isopropanol, alcohol and deionized water in sequence, and the surface of the sapphire substrate is blown dry with nitrogen;
[0092] (2) the dried sapphire substrate according to the following Figure 4 Placed in the manner shown, the area of the contact surface between the sapphire substrate and the edge of the crucible side wall is 2% of the surface area on one side of the sapp...
Embodiment 2
[0095] This embodiment adopts as figure 1 Described crucible, the placement mode of sapphire substrate is as follows image 3 As shown, the side length of the square of the end face of the cylindrical housing 1 is 2cm (i.e. the distance between the relative inner wall of the cylindrical housing), and the thickness of the shell wall of the cylindrical housing is 0.2cm. The cross-sectional shape of is a rectangle, the long side of the rectangle is 0.4cm, and the short side of the rectangle is 0.2cm. The sapphire substrate described in this embodiment is a C-plane (0001) with a diameter of 3 inches.
[0096] Described sapphire substrate surface treatment method comprises the following steps:
[0097] (1) The sapphire substrate is ultrasonically cleaned for 5 minutes by acetone, isopropanol, alcohol and deionized water in sequence, and the surface of the sapphire substrate is blown dry with nitrogen;
[0098](2) Place the dried sapphire substrate horizontally on the open end of ...
Embodiment 3
[0101] Compared with Example 1, this embodiment replaces the temperature of annealing treatment with 1400°C, the time of annealing treatment is replaced with 3h, the flow rate of oxygen is 80 sccm, the pressure of oxygen atmosphere is 1 time of standard atmospheric pressure, other conditions and embodiment 1 compared to the exact same.
[0102] The sapphire substrate prepared in this example has a clean atomic-level step surface, that is, the surface of the sapphire substrate is free of contamination, the step width is uniform, and the step height is 200-400pm, which belongs to the height of the single atomic layer of sapphire, and the steps are continuous without breakpoints .
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