Multilayer composite coating layer suitable for milling and preparation method thereof
A multi-layer composite and milling technology, applied in coating, metal material coating process, ion implantation plating and other directions, can solve the problems of insufficient deposition energy, difficult α structure of coating, large brittleness, etc., to avoid stress The effect of too large, firm bonding, high strength and toughness
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0025] Put the clean cemented carbide substrate into the vacuum chamber of the plasma-enhanced composite ion coating system, and when the vacuum of the back is evacuated to 0.05Pa, turn on the auxiliary heating device on the furnace wall to heat the substrate, and at the same time turn on the rotating power to make the substrate Rotate continuously, heat until the substrate temperature reaches 380°C; then pass argon gas into the vacuum chamber, adjust the flow rate of argon gas to ensure the pressure is 0.2Pa, and then apply a DC bias voltage of -200V and a pulse bias voltage of -400V to the substrate , using the ionized Ar + Etch the surface of the substrate for 80 minutes; turn off the bias voltage of the substrate in turn, adjust the flow of argon to ensure that the working pressure is 0.15Pa, turn on the main arc power supply of the evaporation plating for evaporation coating, the main arc current on the crucible is 190A, and evaporate the raw material for Co 0.15 Ni 0.1...
Embodiment 2
[0027] Put the clean cemented carbide substrate into the vacuum chamber of the plasma-enhanced composite ion coating system, and when the vacuum of the back is evacuated to 0.05Pa, turn on the auxiliary heating device on the furnace wall to heat the substrate, and at the same time turn on the rotating power to make the substrate Rotate continuously, heat until the substrate temperature reaches 380°C; then pass argon gas into the vacuum chamber, adjust the flow rate of argon gas to ensure the pressure is 0.15Pa, and then apply a DC bias voltage of -200V and a pulse bias voltage of -300V to the substrate , using the ionized Ar + Etch the surface of the substrate for 30 minutes; turn off the bias voltage of the substrate in turn, adjust the flow of argon to ensure that the working pressure is 0.2Pa, turn on the main arc power supply of the evaporation plating for evaporation coating, the main arc current on the crucible is 210A, and evaporate the raw material for Co 0.2 Ni 0.2 ...
Embodiment 3
[0029] Put the clean cemented carbide substrate into the vacuum chamber of the plasma-enhanced composite ion coating system, and when the vacuum of the back is evacuated to 0.04Pa, turn on the auxiliary heating device on the furnace wall to heat the substrate, and at the same time turn on the rotating power to make the substrate Rotate continuously, heat until the substrate temperature reaches 380°C; then pass argon gas into the vacuum chamber, adjust the flow rate of argon gas to ensure the pressure is 0.25Pa, and then apply a DC bias of -100V and a pulse bias of -300V to the substrate , using the ionized Ar + Etch the surface of the substrate for 90 minutes; turn off the bias voltage of the substrate in turn, adjust the flow of argon to ensure that the working pressure is 0.15Pa, turn on the main arc power supply of evaporation plating for evaporation coating, the main arc current on the crucible is 220A, and evaporate the raw material for Co 0.2 Ni 0.2 Cr 0.2 Al 0.2 Y ...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More