Diamond with cantilever structure and preparation method thereof

A diamond and cantilever technology, which is applied in the field of diamond with cantilever structure and its preparation, can solve the problem that complex structures cannot be prepared

Active Publication Date: 2021-03-23
CHANGSHA ADVANCED MATERIALS IND RES INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the diamond micro-nanostructure prepared by this method is a single-layer simple structure, and complex structures cannot be prepared; and there is no cantilever structure in the prepared diamond micro-nanostructure

Method used

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  • Diamond with cantilever structure and preparation method thereof
  • Diamond with cantilever structure and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0043] Please see figure 1 , a diamond with a cantilever structure and a preparation method thereof, the method comprising:

[0044] S11. Deposit non-metallic materials on the surface of diamond, fill the void structure of diamond with non-metallic materials, deposit non-metallic surface for grinding and polishing, and grind and polish to reveal the surface of diamond structure to obtain a smooth and flat surface sample a; in single-layer structure diamond or multi-layer On the surface of diamond with ladder structure, non-metallic materials are deposited on the first surface of diamond by sputtering or evaporation deposition method. Using diamond micropowder as a grinding and polishing material for fine grinding and polishing, the upper surface of the diamond structure is exposed by grinding and polishing, and a smooth and flat surface sample a is obtained. Among them, the non-metallic material is one of silicon dioxide, silicon, silicon carbide and silicon nitride, and sili...

specific Embodiment

[0061] Take 5 polycrystalline diamond sheets of 5mm*5mm*1mm, numbered G1, G2, G3, G4 and G5 respectively. The period of the polycrystalline diamond sheet prepared by nanoimprinting, coating, and plasma etching is 1um and the depth is 100nm. groove structure;

[0062] Deposition of 150 nm thick SiO on the surface of diamond samples with grooved structure by magnetron sputtering 2 layer;

[0063] Grinding and polishing the surface of the sample to expose the upper surface of the diamond, so that the SiO 2 The layer is flush with the upper surface of the diamond structure. Among them, the G1 sheet sample was ground and polished by ordinary grinding and polishing methods, and SiO 2 The layer is easily broken; in addition, the four pieces of G2, G3, G4 and G5 can avoid the cracking of the SiO2 layer by using diamond powder as the grinding material and using the cast iron disc to adopt an extremely low grinding rate;

[0064] Spin-coat a layer of PMMA photosensitive material on ...

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PUM

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Abstract

The invention discloses a diamond with a cantilever structure and a preparation method thereof. The method comprises the following steps: depositing a non-metallic material on the surface of the diamond; grinding and polishing the surface of the diamond structure; preparing a mask layer on the smooth diamond structure, and then growing diamond on the diamond surface of the mask layer; then carrying out laser cutting and grinding polishing; and removing the mask layer and a filling material to obtain the diamond with a cantilever structure. The diamond with a cantilever structure prepared by the preparation method is applied to chips and has very high sensitivity and reliability.

Description

technical field [0001] The invention relates to the technical field of diamond processing, in particular to a diamond with a cantilever structure and a preparation method thereof. Background technique [0002] Cantilever-structured diamond has a very high quality factor at room temperature. Cantilever diamonds are generally used in chips. Cantilever diamonds and electronic circuits are integrated on a single substrate to form MEMS sensors. MEMS sensors are used in gas sensors, material analysis and scanning microscope probes. And due to the high sensitivity and reliability of cantilever diamond, it can also be used in a wider range of fields such as disaster prevention and medical treatment. [0003] However, because diamond has extremely high hardness, thermal conductivity, insulation, light transmittance, and excellent physical and chemical properties such as acid resistance, heat resistance, and radiation resistance. At the same time, diamond has extremely high mechanic...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C30B25/04C30B25/20C30B29/04C23C14/10C23C14/24C23C14/30C23C14/34C23C14/35C23C14/58C23C16/02C23C16/04C23C16/27C23C16/56
CPCC23C14/10C23C14/24C23C14/30C23C14/34C23C14/35C23C14/5873C23C16/0272C23C16/042C23C16/27C23C16/56C30B25/04C30B25/20C30B29/04
Inventor 黄翀彭琎
Owner CHANGSHA ADVANCED MATERIALS IND RES INST CO LTD
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