Formula of DMD insulation paper
A technology of insulating paper and formula, which is applied in the direction of chemical instruments and methods, adhesive additives, layered products, etc., can solve the problem of poor dissipation of frictional heat in the sliding contact area, poor thermal stability of DMD insulating paper, and limitations The use of DMD insulating paper and other issues, to achieve the effect of more surface active atoms, improved mechanical properties, and good tensile properties
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Embodiment 1
[0020] The present invention provides embodiment one: a formula of DMD insulating paper, including DMD insulating paper composed of polyester non-woven fabric, polyester film and adhesive, wherein the adhesive includes 100 parts of the first main ingredient, 50 parts of the second main ingredient and 9 to 15 parts of auxiliary materials, the auxiliary materials are nano-Al 2 o 3 ;
[0021] The first main ingredient includes 30% to 45% of acrylic resin by volume, 20% to 30% of toughening agent, 0.1% to 5% of coupling agent, and 1% to 7% of KH550 accelerator. The rest of the main material becomes a solvent;
[0022] The second main ingredient includes 25%-35% epoxy resin by volume, 20%-30% plasticizer, 9%-15% oxidant, and the rest of the second main ingredient is solvent.
[0023] Specifically, nano-Al 2 o 3 The average particle size is 40nm, nano Al 2 o 3 Larger or smaller particle sizes all affect the anti-friction performance and tensile performance of the present inve...
Embodiment 2
[0033] Embodiment 2 is different from Embodiment 1 in that: a formula of DMD insulating paper, including DMD insulating paper composed of polyester non-woven fabric, polyester film and adhesive, wherein the adhesive includes 100 parts of the first main ingredient, the second 2. 50 parts of main material and 9 parts of auxiliary material, the auxiliary material is nano-Al 2 o 3 ;
[0034] The first major ingredient comprises 37% acrylates by volume, 30% toughening agent, 5% coupling agent, and 6% accelerator, and the rest in the first major ingredient becomes a solvent;
[0035] The second main ingredient includes 35% epoxy resin by volume, 30% plasticizer, and 10% oxidant, and the remaining components in the second main ingredient are solvents.
[0036] The preparation method of the present invention,
[0037] S1: Put butyl methacrylate, polyamide resin, KH550, triphenylphosphine, and ethyl acetate into the reaction kettle in proportion, and stir at 25 degrees Celsius for 3...
Embodiment 3
[0043] Embodiment 3, the difference from Embodiment 1 is: DMD insulating paper composed of polyester non-woven fabric, polyester film and adhesive, wherein the adhesive includes 100 parts of the first main material, 50 parts of the second main material and 15 parts of auxiliary materials parts, the auxiliary material is nano-Al 2 o 3 ;
[0044] The first major ingredient comprises 37% of the volume of acrylic esters, 30% of the toughening agent, 5% of the coupling agent, 2% of the auxiliary accelerator, and the rest in the first major ingredient becomes a solvent;
[0045] The second main ingredient includes 35% epoxy resin by volume, 30% plasticizer, and 10% oxidant, and the remaining components in the second main ingredient are solvents.
[0046] The preparation method of the present invention,
[0047] S1: Put butyl methacrylate, polyamide resin, KH550, triphenylphosphine, and ethyl acetate into the reaction kettle in proportion, and stir at 25 degrees Celsius for 3.5 ho...
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