A kind of diamond resin bond abrasive disc and its preparation method and application
A diamond and bonding agent technology, applied in metal processing equipment, grinding/polishing equipment, abrasives, etc., can solve problems such as easy migration, human body and environmental pollution, and easy residue of matrix resin, so as to achieve uniform filler dispersion and high product yield High, high production efficiency effect
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[0032] The present invention provides the preparation method of the diamond resin bonded grinding disc described in the above scheme, comprising the following steps:
[0033] mixing the preparation raw materials to obtain a mixture;
[0034] The mixture is injected into a mold for hot pressing and sintering to obtain a diamond resin bonded abrasive sheet.
[0035] The invention mixes the preparation raw materials to obtain the mixture. In the present invention, the mixing of the raw materials for preparation is preferably achieved under stirring conditions. The present invention has no special requirements on the speed and time of the stirring, as long as the uniform mixing of the raw materials can be realized.
[0036] After the mixed material is obtained, the present invention injects the mixed material into a mold for hot pressing and sintering to obtain a diamond resin bonded abrasive sheet.
[0037] Before hot pressing and sintering, the present invention preferably co...
Embodiment 1
[0043] In terms of parts by mass, 30 parts of nylon modified bisphenol A epoxy resin, 8 parts of polyetheramine curing agent (type D230), 25 parts of polycrystalline diamond micropowder with a particle size of 800 mesh, and silicon carbide with a particle size of 1000 mesh 10 parts of micropowder, 5 parts of corundum with a particle size of 800 mesh, 25 parts of talcum powder with a particle size of 1000 mesh, 5 parts of glass fiber with a particle size of 800 mesh, 3 parts of nano-silica balls with a diameter of 30nm, 1 part of KH5501 after mechanical stirring, and The above mixture is injected into the mold, and the cotton cloth with the same size as the mold is covered on the top surface of the incompletely cured abrasive tool, raised from room temperature to 120°C, kept at a heat preservation pressure (4MPa pressure) for 5 minutes, hot-pressed and sintered, and then the abrasive tool is taken out. The sheet was baked in an oven at 140° C. for 1 hour to obtain a diamond resi...
Embodiment 2
[0045] In terms of parts by mass, 25 parts of polyamide modified phenolic resin, 15 parts of acid anhydride curing agent (methyl hexahydrophthalic anhydride, MHHPA), 0.25 parts of aromatic tertiary amine curing agent (DMP-30), and the particle size number is 800 mesh polycrystalline 20 parts of diamond powder, 10 parts of silicon carbide powder with particle size number of 1000 mesh, 3 parts of white corundum with particle size number of 800 mesh, 3 parts of zirconia with particle size number of 1000 mesh, 20 parts of calcium carbonate with particle size number of 2000 mesh, carbon fiber with particle size number of 1000 mesh 5 parts of powder, 2 parts of carbon nanotubes with a diameter of 20nm, 1 part of KH5601 After mechanical stirring, the above mixture is injected into the mold by hot pressing and sintering, and the cotton cloth with the same size as the mold is covered on the top surface of the incompletely cured abrasive tool From room temperature to 120°C, heat preserva...
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Abstract
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