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Composition for encapsulating organic light emitting diode and organic light emitting diode display

A technology of light-emitting diodes and compositions, which is applied in the manufacture of electric solid-state devices, semiconductor devices, and semiconductor/solid-state devices, etc., can solve problems such as ultraviolet damage, damage, and shortened lifespan.

Active Publication Date: 2020-03-10
SAMSUNG SDI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] On the other hand, organic light-emitting diodes can be damaged by ultraviolet (UV) light when exposed to sunlight, resulting in a shortened lifespan
In particular, since OLEDs used in vehicles are exposed to sunlight for a long period of time, UV damage has become a significant issue for OLEDs

Method used

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  • Composition for encapsulating organic light emitting diode and organic light emitting diode display
  • Composition for encapsulating organic light emitting diode and organic light emitting diode display
  • Composition for encapsulating organic light emitting diode and organic light emitting diode display

Examples

Experimental program
Comparison scheme
Effect test

preparation example 1

[0264] Preparation Example 1: Compounds of Preparation Formula 1-4

[0265] In a 1,000ml flask equipped with a cooling tube and a stirrer, place 300ml of acetone, 39g of triethylamine, and 50g of 2,2'-[9,10-anthracenediylbis(oxyl)]bisethanol (2,2 '-[9,10-antracendiylbix(oxy)]bisethanol) (Atomax Co., Ltd.), to which 30.2 g of methyl Acryloyl Chloride. Next, the mixture was stirred for 1 hour after raising the temperature of the flask to 40°C. The remaining solvent was removed by distillation, thereby obtaining the compound of formula 1-4 with a high performance liquid chromatography (HPLC) purity of 96%.

preparation example 2

[0266] Preparation example 2: the compound of preparation formula 3-1

[0267] In a 1,000ml flask equipped with a cooling tube and a stirrer, 200g of cyanoacetic acid, 320g of 2-hydroxyethyl methacrylate, 600ml of toluene, and 3g of concentrated sulfuric acid (Daejung Chemicals & Materials Co., Ltd. ., Ltd.)), then nitrogen was purged for 30 minutes and the flask was heated to 160° C. to remove water therefrom. The solvent was removed by distillation, thereby obtaining 2-acrylate-2-methyl-2-[(cyanocarbonyl)oxy]ethyl ester (2-cyanoacetoxyethyl methacrylate) with an HPLC purity of 96%. ester, weight average molecular weight: 197.19 g / mol). (H NMR ( 1 Hnuclear magnetic resonance, 1H NMR): δ6.12, s, 1H; δ5.62, s, 1H; δ4.45, m, 2H; δ4.38, m, 2H; δ3.01, s, 2H; 3H)

[0268] In the 500ml flask that cooling tube and stirrer are provided, 15.2g KOH, 38g methyl iodide, 50g 2-phenyl-1H-indole-3-formaldehyde and 150g dimethylformamide (dimethylformamide, DMF) are placed and Stirred a...

preparation example 3

[0270] Preparation example 3: the compound of preparation formula 5-2

[0271] In a 1,000ml flask equipped with a cooling tube and a stirrer, 300ml of ethyl acetate, 21g of 3,3-diphenyl-1,1,5,5-tetramethyltrisiloxane and 43g of alkene Propanol (Daei Chemical Materials Co., Ltd.), followed by nitrogen purging for 30 minutes. Next, 72 ppm of Pt-loaded carbon black powder (Aldrich GmbH) was added thereto, and then the flask was heated to 80° C. and the components were stirred for 4 hours. The remaining solvent was removed by distillation, whereby the compound was obtained. 71.5 g of the obtained compound and 39 g of triethylamine were sequentially added to 300 ml of methylene chloride, and then 30.2 g of methacryloyl chloride was slowly added thereto while stirring the mixture at 0°C. The remaining solvent was removed by distillation, thereby obtaining a compound represented by Formula 5-2 with an HPLC purity of 96%. ( 1 H NMR: δ7.52,m,6H; δ7.42,m,4H; δ6.25,d,2H; δ6.02,dd,2H;...

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Abstract

The invention provides a composition for encapsulating an organic light emitting diode and an organic light emitting diode display including an organic layer formed from the composition. The composition comprises: a component A: at least one of a compound of a formula 1, a compound of a formula 2 and a compound of a formula 3; a component B: at least one selected from the group consisting of a non-silicone photocurable polyfunctional monomer and a silicone photocurable polyfunctional monomer; a component C: a photocurable monofunctional monomer; and a component D: an initiator in which at least one selected from the group consisting of compounds of the formula 1, compounds of the formula 2, and compounds of the formula 3 is present in an amount of 0.01 to 10 parts by weight based on 100 parts by weight of the total of the component A, the component B, the component C, and the component D. The definitions of the formula 1, the formula 2 and the formula 3 are the same as the definitionsof specific embodiments. The encapsulating composition of the present invention can realize an organic layer having a good ultraviolet blocking effect and a low plasma etching rate.

Description

[0001] Cross References to Related Applications [0002] This application claims the rights to Korean Patent Application 10-2018-0103066 filed with the Korean Intellectual Property Office on Aug. 30, 2018, the entire disclosure of which is incorporated herein by reference. technical field [0003] The present invention relates to a composition for encapsulating an organic light emitting diode and an organic light emitting diode display including an organic layer formed using the composition. Background technique [0004] Organic light emitting diodes are easily damaged when they come into contact with external moisture or oxygen, and their reliability decreases due to the loss of their functions. Therefore, organic light emitting diodes must be encapsulated with a composition for encapsulating organic light emitting diodes. [0005] On the other hand, organic light emitting diodes may be damaged by ultraviolet (UV) light when exposed to sunlight, resulting in a shortened li...

Claims

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Application Information

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IPC IPC(8): C08F222/14C08F230/08C08F220/30C08F222/20C08F2/48C08F2/44C08K5/3475C08F220/18C08F226/06H01L51/52
CPCC08F2/48C08F2/44C08K5/3475C08F222/102H10K50/844C08F230/085C08F220/301C08F222/1025C08F220/1812C08F226/06C08F220/18C08F2/50C08F222/20C08F222/1006C08F216/12C08G77/12C08G77/42
Inventor 南成龙韩明淑李知娟
Owner SAMSUNG SDI CO LTD
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