Conductive resin binder grinding wheel and preparation process thereof

Abstract

The invention designs a conductive resin binder grinding wheel based on the use requirement and a manufacturing method for a resin binder diamond grinding wheel. The conductive resin binder grinding wheel is prepared from the following raw materials in percentage by weight: 10%-55% of bismaleimide resin powder, 17%-45% of antimony powder, 12%-20% of green silicon carbide micro powder, 1%-5% of a silane coupling agent and the balance of diamond powder. In comparison with a metal binder diamond grinding wheel, great improvements are achieved in aspects such as grinding sharpness and workpiece surface quality; and in comparison with a resin binder diamond grinding wheel, the advantages of being efficient and high in precision in machining of special-shaped working faces are achieved, and thus, the efficient and high-precision machining requirements of materials such as ultra-precision numerical control alloy cutters and special-shaped precision glass / ceramic electronic components are met.

Description

technical field [0001] The invention belongs to the technical field of diamond grinding wheels, and in particular relates to a conductive resin bond grinding wheel and a preparation process thereof. Background technique [0002] Resin bonded diamond grinding wheel has the advantages of good self-sharpening, sharpness, heat resistance, acid resistance and micro-elasticity, and is suitable for fine grinding of workpieces made of cemented carbide, stone, ceramics, glass, rare earth metals, non-ferrous metals, etc. The processing field has been widely used. With the maturity and popularization and application of 5G technology, advanced mobile communication technology and precision electronic technology have also put forward higher requirements for supporting hardware facilities. The technical requirements for elements such as ceramic electronic components have also been greatly improved. [0003] There are usually two kinds of bonded diamond grinding wheels available for the g...

AI Technical Summary

Problems solved by technology

One is the resin bonded diamond grinding wheel. The resin grinding wheel has good self-sharpening, sharpness and micro-elasticity, so when processing hard and brittle materials, it can take into account the advantages of high grinding efficiency, good surface quality, and high yield. ; However, the problem with resin grinding wheels is that their special shapes (including concave, arc and other surfaces) have poor dimensional accuracy, and it is difficult to achieve sub-micron size and shape accuracy through conventional dressing, and it is even more difficult to achieve stable mass production of special-shaped electronic components

The second is the metal bond grinding wheel. Due to its good electrical conductivity, the metal grinding wheel can control the shape and position accuracy of the special-shaped grinding surface at the sub-micron level, which can meet the special grinding processing requirements of special-shaped precision electronic components; but the metal grinding wheel The hardness of the bond is high, and the rigidity of the grinding wheel layer is large, which has certain limitations in the application of soft elastic grinding

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