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Solid cleaning adhesive and preparation method thereof

A cleaning glue and solid technology, applied in adhesive types, hydrocarbon copolymer adhesives, ester copolymer adhesives, etc., can solve the problem of poor removal of dust and particles, endangering the safety and health of operators, and harmful Volatility and other issues, to achieve excellent cleaning effect, dust removal effect is obvious, no toxic side effects

Inactive Publication Date: 2020-03-17
游利
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these cleaning solutions have their own insurmountable shortcomings: more chemicals are consumed and the cost is high; they are volatile and highly toxic, endangering the safety and health of operators and polluting the environment; they have certain corrosion and damage to devices
However, the effect of removing dust and particles is relatively poor, especially the effect of removing metal particles is not ideal

Method used

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  • Solid cleaning adhesive and preparation method thereof
  • Solid cleaning adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] First weigh 3.0g of azobisisobutyronitrile and dissolve it in 20g of toluene, add 80g of toluene into a 500ml four-neck flask equipped with an electric stirrer, thermometer, condenser tube and balanced separatory funnel, heat up to 50°C, add dropwise 1 / 3 pre-mixed homogeneous initiator and monomer (butyl acrylate 70g, methyl methacrylate 25g, KH-5701.5g) mixed solution, pre-reacted for 1h, then raised the temperature to 90°C, added dropwise the remaining monomer and 1g After adding dodecyl mercaptan, keep warm for 2-3h, add 1g of azobisisobutyronitrile, keep warm for 2h, and finally distill off the solvent under reduced pressure to obtain a colorless and translucent colloid.

Embodiment 2

[0027] First weigh 4.0g of azobisisobutyronitrile and dissolve it in 20g of toluene, add 80g of toluene to a 500ml four-necked flask equipped with an electric stirrer, a thermometer, a condenser tube and a balanced separatory funnel, heat up to 50°C and add 1 / 3 Mix the mixed solution of initiator and monomer (55g butyl acrylate, 5g isooctyl acrylate, 40g styrene, 1.5g vinylpyrrolidone) in advance, pre-react for 1h, then raise the temperature to 90°C, add the remaining monomer dropwise solid and 1g of dodecyl mercaptan, after the dropwise addition, keep warm for 2-3h, add 1g of azobisisobutyronitrile, keep warm for 2h, and finally distill off the solvent under reduced pressure to obtain a colorless and translucent colloid .

Embodiment 3

[0029] First weigh 5.0g of benzoyl peroxide and dissolve it in 10g of toluene, add 80g of toluene to a 500ml four-necked flask equipped with an electric stirrer, a thermometer, a condenser tube and a balanced separatory funnel, heat up to 60°C and add dropwise 1 / 4 Pre-mix the mixed solution of initiator and monomer (butyl acrylate 80g, methyl methacrylate 20g, hydroxypropyl acrylate 10g, vinylpyrrolidone 3g) in advance, pre-react for 1h, then raise the temperature to 80°C, add the remaining After the addition of the monomer, keep it warm for 2-3 hours, add 1 g of benzoyl peroxide, keep it warm for 2 hours, and finally remove the solvent by distillation under reduced pressure to obtain a colorless and translucent colloid.

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Abstract

The invention relates to a composition, a preparation method and application of a solid cleaning adhesive. The solid cleaning adhesive is prepared from a hard monomer, a soft monomer, an organic solvent, an initiator, other functional assistants and the like through polymerization and a series of post-treatment. The solid cleaning adhesive obtained by the invention is a solid cleaning product withcertain adhesion; solid particles, dust and metal pollution on the surfaces of a chip and a device and in gaps are removed through the adhesion and easy deformation of the surface of the material, residues are avoided, secondary pollution is not caused, the chip and the device are not scratched and damaged, and no harm is caused to a human body. The solid cleaning adhesive can be widely applied to semiconductors, microelectronic devices, printed circuit boards, television picture tubes, precise instruments, liquid crystal displays, computer keyboards, automobile interiors, mobile phones, video and audio equipment and the like.

Description

technical field [0001] The invention belongs to the field of new materials, and in particular relates to a solid cleaning glue and a preparation method thereof. Background technique [0002] With the development of microelectronics and semiconductor technology, the integration level of VLSI has increased rapidly, the feature size of devices has been continuously reduced, and the requirements for surface contamination of substrate chips have become more stringent. In the preparation process of VLSI, the surface state of the chip and the removal degree of pollutants are one of the most important factors affecting the yield of the wafer and the quality and reliability of the device. The chip manufacturing process has to go through oxidation, film formation, diffusion, photolithography, epitaxy and other processes, and some pollutants will inevitably be produced, such as particles (dust, human secretions, fibers, quartz powder, etc.), organic matter (photoresist , grease, wax, ...

Claims

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Application Information

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IPC IPC(8): C09J133/08C09J125/14C08F220/18C08F212/08C08F220/14C08F226/10C08F220/20
CPCC08F212/08C08F220/18C09J125/14C09J133/08
Inventor 游利
Owner 游利
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