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Antistatic adhesive and preparation method thereof

An antistatic and antistatic agent technology, applied in the direction of adhesives, conductive adhesives, adhesive types, etc., can solve the problems of easily damaged circuit boards, short circuits, protective film peeling, etc., and achieve excellent water repellency and chemical stability Good performance, the effect of eliminating static electricity

Inactive Publication Date: 2020-03-24
东莞市源岭硅胶科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the rapid development of the electronics industry and the semiconductor industry, the integration of electronic circuit boards is getting higher and higher. The high density of electronic components on the motherboard, the compact wiring, and even the widespread use of surface-mounted components make static electricity easy to damage Circuit boards, especially in the process of transportation and storage, are prone to accumulate static electricity. Static electricity will not only make the circuit board absorb a large amount of dust, resulting in easy short circuit during use, but also a series of hazards caused by the accumulation of static electricity to a certain extent, causing heavy losses
[0003] In order to prevent static electricity from damaging electronic circuit boards, a protective film is usually used to cover its surface, and the protective film used in electronic or electrical products must also have a characteristic, that is, static electricity should not be generated when it is removed, so as not to cause damage to electronic and electrical products. damage, but the existing anti-static glue has poor adhesion at higher or lower temperatures, which can easily cause the protective film to fall off

Method used

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  • Antistatic adhesive and preparation method thereof
  • Antistatic adhesive and preparation method thereof
  • Antistatic adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] The raw materials for the preparation of an antistatic glue include extra-high hexene content raw rubber, raw rubber, silicone oil, hydrogen-containing silicone oil, mold release agent, blue pigment, conductive carbon black and antistatic agent.

[0024] Wherein, the antistatic adhesive of the present invention includes the following components in parts by weight:

[0025]

[0026] Among them, the relative molecular weight of the ultra-high hexenyl content raw rubber is 55×10 4 , the vinyl content of the ultra-high hexenyl content raw rubber is 3wt%.

[0027] Wherein, the viscosity of silicone oil is 1000cP.

[0028] Wherein, the hydrogen content of the hydrogen-containing silicone oil is 1.6 wt%.

[0029] Wherein, the raw rubber is selected from nitrile rubber.

[0030] Wherein, the release agent is selected from fluororesins.

[0031] Wherein, the particle diameter of conductive carbon black is 8 μm, and the carbon black particle adhesion amount of described co...

Embodiment 2

[0038] The raw materials for the preparation of an antistatic glue include extra-high hexene content raw rubber, raw rubber, silicone oil, hydrogen-containing silicone oil, mold release agent, blue pigment, conductive carbon black and antistatic agent.

[0039] Wherein, the antistatic adhesive of the present invention includes the following components in parts by weight:

[0040]

[0041]

[0042] Among them, the relative molecular weight of the ultra-high hexenyl content raw rubber is 50×10 4 , the vinyl content of the ultra-high hexenyl content raw rubber is 2.5wt%.

[0043] Wherein, the viscosity of silicone oil is 500cP.

[0044] Wherein, the hydrogen content of hydrogen-containing silicone oil is 1.59wt%.

[0045] Wherein, raw rubber is selected from neoprene.

[0046] Wherein, the release agent is selected from polytetrafluoroethylene.

[0047] Wherein, the particle diameter of conductive carbon black is 2 μm, and the carbon black particle adhesion amount of de...

Embodiment 3

[0054] The raw materials for the preparation of an antistatic glue include extra-high hexene content raw rubber, raw rubber, silicone oil, hydrogen-containing silicone oil, mold release agent, blue pigment, conductive carbon black and antistatic agent.

[0055] Wherein, the antistatic adhesive of the present invention includes the following components in parts by weight:

[0056]

[0057] Among them, the relative molecular weight of the ultra-high hexenyl content raw rubber is 50×10 4 , the vinyl content of the ultra-high hexenyl content raw rubber is 3.5wt%.

[0058] Wherein, the viscosity of silicone oil is 1500cP.

[0059] Wherein, the hydrogen content of the hydrogen-containing silicone oil is 1.63wt%.

[0060] Wherein, raw rubber is selected from butyl rubber.

[0061] Wherein, the release agent is selected from silicone rubber.

[0062] Wherein, the particle diameter of conductive carbon black is 2 μm, and the carbon black particle adhesion amount of described con...

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Abstract

The invention provides an antistatic adhesive. The antistatic adhesive is prepared by mixing of raw rubber with high hexenyl content, raw rubber, silicone oil, hydrogen-containing silicone oil, a release agent, blue pigment, conductive carbon black and an antistatic agent. The antistatic adhesive disclosed by the invention has permanent antistatic function, the surface resistivity of the product is 10<5>-10<11>ohm / m<2>, static electricity is effectively eliminated, so that the product does not absorb dust or paper scraps, electric stunning and electric spark phenomena are not generated, also the antistatic adhesive has excellent high and low temperature resistance, can be used at a temperature ranging from -50 to 200DEG C, is not easily oxidized and degraded in ozone and radiant ray environments, has good chemical stability, and has excellent hydrophobicity, moisture resistance, shock resistance, physiological inertia and the like.

Description

technical field [0001] The invention relates to the field of glue and its preparation, in particular to an antistatic glue and its preparation method. Background technique [0002] With the rapid development of the electronics industry and the semiconductor industry, the integration of electronic circuit boards is getting higher and higher. The high density of electronic components on the motherboard, the compact wiring, and even the widespread use of surface-mounted components make static electricity easy to damage Circuit boards, especially in the process of transportation and storage, are prone to accumulate static electricity. Static electricity will not only make the circuit board absorb a large amount of dust, resulting in easy short circuit during use, but also a series of hazards caused by the accumulation of static electricity to a certain extent, causing heavy losses . [0003] In order to prevent static electricity from damaging the electronic circuit board, a pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J109/02C09J111/00C09J123/22C09J109/00C09J109/06C09J183/04C09J183/05C09J9/02C09J11/06C09J11/08
CPCC08K2201/001C08K2201/003C08K2201/017C08L2201/08C08L2203/18C08L2203/202C08L2205/025C08L2205/035C09J9/02C09J11/06C09J11/08C09J109/00C09J109/02C09J109/06C09J111/00C09J123/22C08L83/04C08K3/04C08K5/42C08K5/17
Inventor 凌发林
Owner 东莞市源岭硅胶科技有限公司
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