Seed crystal substrate with double-shell structure, and preparation method thereof

A substrate and seed crystal technology, applied in the field of seed crystal substrates and their preparation, can solve the problems of low reuse rate and large consumption of raw materials, achieve high reuse rate, reduce procurement costs, and have both mechanical stability and The effect of chemical stability

Inactive Publication Date: 2020-03-27
SHANGHAI ADVANCED RES INST CHINESE ACADEMY OF SCI
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] In view of the above-mentioned shortcomings of the prior art, the object of the present invention is to provide a seed crystal substrate for layer trans...

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Seed crystal substrate with double-shell structure, and preparation method thereof
  • Seed crystal substrate with double-shell structure, and preparation method thereof
  • Seed crystal substrate with double-shell structure, and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0053] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

[0054] see Figure 1 to Figure 7 . It should be noted that the diagrams provided in this embodiment are only schematically illustrating the basic idea of ​​the present invention, and only the components related to the present invention are shown in the diagrams rather than the number, shape and shape of the components in actual implementation. Dimensional drawing, the type, quantity and proportion of each component can be changed arb...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a seed crystal substrate applied to growth of a single-layer transfer film, and a preparation method thereof. The preparation method comprises the following steps: 1) forming aphotoresist mask on the surface of a monocrystalline silicon substrate by adopting a photoetching process; 2) depositing a metal layer on the substrate with the photoresist mask; 3) removing the photoresist mask; 4) carrying out selective etching on the substrate by adopting a wet etching process; 5) depositing a growth barrier layer comprising silicon nitride and silicon oxide on the surface of the substrate; and 6) removing the metal mask layer at the top end of the pyramid seed crystal array to obtain the seed crystal substrate. The obtained seed crystal substrate of the invention integrates mechanical stability and chemical stability, and has advantages of high reuse rate and long service life, and the preparation process is simple and convenient, and is suitable for automatic production.

Description

technical field [0001] The invention belongs to the field of semiconductor materials, in particular to a seed crystal substrate and a preparation method thereof. Background technique [0002] Nowadays, due to the excellent electrochemical properties and mature preparation process of semiconductor single crystal silicon, it has become the main raw material of semiconductor components. The methods for preparing single crystal silicon include Czochralski method, zone melting method and chemical vapor deposition method. Among them, chemical vapor deposition method has the advantages of high purity, good compactness, small residual stress and high crystallinity in the process of preparing single crystal silicon film. However, it has received widespread attention. The most widely used chemical vapor deposition method at this stage is the vapor phase epitaxy growth method, which is characterized by the reaction under normal pressure, simple operation and low cost. [0003] The mai...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): C30B25/20C30B29/06C23C14/04C23C14/10C23C14/06C23C14/30
CPCC23C14/042C23C14/0652C23C14/10C23C14/30C30B25/186C30B25/20C30B29/06
Inventor 刘东方鄢靖源张伟李纪周王聪陈小源杨辉
Owner SHANGHAI ADVANCED RES INST CHINESE ACADEMY OF SCI
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products