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An electronic equipment housing and electronic equipment

A technology for electronic equipment and shells, which is applied in the field of electronic equipment shells and electronic equipment, can solve problems such as cracking of coating layers, achieve the effects of reducing thermal expansion coefficient, improving dimensional thermal stability, and solving cracking of coating layers

Active Publication Date: 2022-04-15
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the technical problem of cracking of the coating layer of the electronic equipment housing during hot pressing, the present invention provides an electronic equipment housing and electronic equipment, the dimensional thermal stability of the texture layer of the electronic equipment housing is improved, and the hot pressing During the forming process, the thermal stress between the texture layer and the coating layer is reduced, and the problem of cracking of the coating layer is significantly improved

Method used

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  • An electronic equipment housing and electronic equipment
  • An electronic equipment housing and electronic equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] Use a transfer machine to coat a layer of UV-curable adhesive on the surface of polymethyl methacrylate (thickness 0.05 mm) and polycarbonate (thickness 0.3 mm) double-layer transparent polymer substrate, which contains magnesium borate nanoparticles fiber (diameter is 40nm, aspect ratio is 20), the weight of magnesium borate nanofiber is 8% of the weight of UV curing adhesive; under the action of UV light, the UV curing adhesive is polymerized and cured to form a texture layer with a certain shape (thickness is 7 μm); deposit titanium nitride and silicon dioxide coating layers (total thickness 100 nm) on the surface of the texture layer, and the coating can reflect blue light with a central wavelength of 450 nm; heat-press the polymer matrix after the above treatment, An electronic equipment case S1 is obtained.

Embodiment 2

[0039] Use a transfer machine to coat a layer of UV-curable adhesive on the surface of polymethyl methacrylate (thickness 0.05 mm) and polycarbonate (thickness 0.5 mm) double-layer transparent polymer substrate, which contains tin dioxide Nanofibers (diameter 20nm, aspect ratio 100), the weight of tin dioxide nanofibers is 25% of the weight of the UV curable adhesive; under the action of UV light, the UV curable adhesive is polymerized and cured to form a textured layer with a certain shape (15 μm in thickness); deposit titanium dioxide and silicon dioxide coating layers on the surface of the texture layer (the total thickness is 50 nm), and the coating can reflect blue light with a central wavelength of 450 nm; print an ink layer on the surface of the coating layer (thickness is 15 nm) μm), the above-mentioned treated polymer matrix was thermocompressed to obtain an electronic device casing S2.

Embodiment 3

[0041] A three-layer transparent polymer substrate of polymethyl methacrylate (thickness 0.05 mm), polycarbonate (thickness 0.5 mm) and polymethyl methacrylate (thickness 0.05 mm) was coated with a transfer printing machine. A layer of UV curable adhesive, UV curable adhesive contains montmorillonite (sheet thickness is 1nm, diameter-thickness ratio is 100), the weight of montmorillonite is 40% of the weight of UV curable adhesive; under the action of UV light, the UV curable adhesive Polymerization and curing to form a textured layer with a certain shape (thickness 30 μm); deposit titanium dioxide and silicon dioxide coating layers (total thickness 50 nm) on the surface of the textured layer, and the coating can reflect blue light with a central wavelength of 450 nm; An ink layer (thickness: 30 μm) was printed on the surface of the coating layer, and the above-mentioned treated polymer substrate was thermocompressed to obtain the electronic device casing S3.

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Abstract

The invention discloses an electronic equipment casing, which comprises a substrate, a texture layer and a coating layer sequentially stacked on the substrate, the texture layer contains inorganic nanomaterials, and the inorganic nanomaterials are one-dimensional Inorganic nanomaterials and / or two-dimensional inorganic nanomaterials. The texture layer of the electronic equipment casing of the present invention contains the above-mentioned inorganic nanomaterials, which can effectively reduce the thermal expansion coefficient of the texture layer, so that the difference between the thermal expansion coefficient of the texture layer of the electronic equipment casing and the thermal expansion coefficient of the coating layer is reduced, and the hot press molding process The thermal stress between the texture layer and the coating layer is reduced, and the problem of cracking of the coating layer is significantly improved.

Description

technical field [0001] The invention relates to the field of electronic products, in particular to an electronic equipment shell and the electronic equipment. Background technique [0002] With the advent of the 5G era, due to the limited signal penetration ability of metal shells, its application in the 5G field is limited to a certain extent. Therefore, the choice of polymer materials that are conducive to 5G signal penetration as electronic equipment shells The widespread attention of engineers is expected to be used in large-scale commercial applications. By setting a multi-layer structure such as texture layer, coating layer and ink layer on the substrate, the electronic device housing based on polymer material can have the visual effect of optical texture pattern and metallic luster, thereby enhancing the polymer material housing. texture. On the other hand, in order to make the electronic equipment have a good feel, it is also necessary to hot-press the housing of t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B9/00B32B9/04B32B27/06B32B33/00H04M1/18
CPCB32B9/00B32B9/04B32B27/06B32B33/00H04M1/185
Inventor 陈小芳周维
Owner BYD CO LTD