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Solvent-free adhesive film and preparation method thereof

A solvent-free, adhesive film technology, used in adhesives, epoxy resin adhesives, adhesive types, etc., can solve the problems of poor heat resistance and low breakdown voltage, achieve excellent bonding performance and ensure heat resistance. and withstand breakdown voltage, the effect of meeting the requirements of production process and product use

Inactive Publication Date: 2020-04-10
SHENZHEN NEWCCESS IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the above deficiencies in the prior art, the object of the present invention is to provide a solvent-free adhesive film and its preparation method, aiming to solve the problems of low breakdown voltage and poor heat resistance of the existing adhesive film

Method used

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  • Solvent-free adhesive film and preparation method thereof
  • Solvent-free adhesive film and preparation method thereof
  • Solvent-free adhesive film and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0054] Solvent-free glue: CTBN1300X8 (acrylonitrile content 18%, viscosity 135000cps@27℃, molecular weight Mn3550) 5 parts, bisphenol A epoxy resin (Nanya epoxy 128, epoxy equivalent 190) 10 parts, propylene oxide butylene 2 parts of base ether (501 active diluent), 2.2 parts of Ethacure200 aromatic amine, 0.034 parts of 2E4MZ, 51 parts of silicon dioxide (particle size 1-5um), 0.106 parts of BYK-333, 5.1 parts of KYC-918, DP-60 0.071, KH560 0.071 parts.

[0055] Apply the solvent-free glue with a slanted blade, and apply it to the release surface of the release PET film at one time. The thickness of the PET film is 36um. The curing process is as follows:

[0056]

Embodiment 2

[0058] Solvent-free glue: CTBN1300X8 (acrylonitrile content 18%, viscosity 135000cps@27℃, molecular weight Mn3550) 3 parts, CTBN1300X13 (acrylonitrile content 26%, viscosity 500000cps@27℃, molecular weight Mn3150) 2 parts, bisphenol F ring Oxygen resin NPEF-170 (epoxy equivalent 160-180g / eq, viscosity 2000-5000cps@25℃) 10 parts, propylene oxide butyl ether (501 reactive diluent) 2 parts, Ethacure200 aromatic amine 2 parts, methyl tetra 3 parts of hydrophthalic anhydride (MTHPA), 0.034 parts of 2E4MZ, 51 parts of silicon dioxide (particle size 1-5um), 0.106 parts of BYK-333, 5.1 parts of KYC-918, 0.071 parts of DP-60, 0.071 parts of KH5600.

[0059] Apply the solvent-free glue with a slanted blade, and apply it to the release surface of the release PET film at one time. The thickness of the PET film is 36um. The curing process is as follows:

[0060]

[0061]

Embodiment 3

[0063] Solvent-free glue: CTBN1300X8 (acrylonitrile content 18%, viscosity 135000cps@27℃, molecular weight Mn3550) 3 parts, CTBN1300X13 (acrylonitrile content 26%, viscosity 500000cps@27℃, molecular weight Mn3150) 3 parts, bisphenol A ring Oxygen resin (Nanya epoxy 128, epoxy equivalent 190) 5 parts, bisphenol F epoxy resin NPEF-170 (epoxy equivalent 160-180g / eq, viscosity 2000-5000cps@25℃) 5 parts, propylene oxide 2 parts of butyl ether (501 active diluent), 2 parts of Ethacure200 aromatic amine, 3 parts of methyltetrahydrophthalic anhydride (MTHPA), 0.034 parts of 2E4MZ, 51 parts of alumina (particle size 5um), BYK-3330.106 parts, KYC -918 5.1 parts, DP-60 0.071, KH560 0.071 parts.

[0064] Apply the solvent-free glue with a slanted blade, and apply it to the release surface of the release PET film at one time. The thickness of the PET film is 36um. The curing process is as follows:

[0065]

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Abstract

The invention discloses a solvent-free adhesive film and a preparation method thereof. The method comprises the following steps: mixing nitrile rubber with epoxy resin and reacting to obtain a prepolymer; adding a diluent, a curing agent, an accelerant, an inorganic filling material and an assistant into the prepolymer and reacting to obtain a solvent-free glue solution; and depositing the solvent-free glue solution on a carrier layer and curing to obtain the solvent-free glue film. No organic solvent harmful to the environment is used in the preparation process of the adhesive film and the environmental protection requirement of the application industry can be met; meanwhile, the prepared solvent-free glue solution has excellent bonding performance and can be well attached to carrier layers such as metal base materials and plastic; furthermore, no organic solvent is used in the preparation process of the adhesive film so that no solvent is left in the prepared adhesive film, the heatresistance and breakdown voltage resistance of the adhesive film can be ensured and the subsequent production process and product use requirements can be met.

Description

technical field [0001] The invention relates to the field of printed circuit boards, in particular to a solvent-free adhesive film and a preparation method thereof. Background technique [0002] The existing adhesive films used in the aluminum substrate industry are all made of solvent-based adhesives through coating processes. Most of the solvents are organic solvents such as dimethylformamide, butanone, acetone, propylene glycol monomethyl ether, xylene, and ethyl acetate. . As we all know, solvents are basically toxic, which brings more or less physical harm to production workers, and at the same time, solvents also pollute the environment. In the production process, the solvent is finally volatilized, recycled, and burned, which adds some processing costs to the enterprise. The formula contains a large amount of solvent, and there will be a certain amount of residue in the subsequent curing process of the resin, which will affect the breakdown voltage and heat resistan...

Claims

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Application Information

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IPC IPC(8): C09J7/20C09J7/30C09J163/00C09J113/00C09J11/04
CPCC08K2003/222C08K2003/2227C08L2201/08C08L2205/025C08L2205/03C08L2205/035C09J11/04C09J163/00C09J2203/326C09J7/20C09J7/30C09J2301/122C09J2301/408C08L13/00C08K3/36C08L63/00C08K3/22
Inventor 刘飞贺琼何岳山练超
Owner SHENZHEN NEWCCESS IND