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Soldering paste with stable performance and preparation method of soldering paste
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A solder paste, stable technology
Active Publication Date: 2020-04-17
EUNOW ELECTRONICS TECH CO LTD SUZHOU
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At the same time, the use of high-temperature alloys needs to raise the temperature above the melting point of the alloy during welding, which is much higher than the heat-resistant temperature of ordinary PCB materials, and has certain damage to the device.
[0004] Nowadays, SAC series alloys (tin-silver-copper series alloys) are commonly used as welding materials in the process of electronic assembly, and the temperature during welding is relatively high (soldering peak temperature > 240°C). The soldering temperature will cause problems such as device deformation and cause product performance and reliability defects, and the stability of the solder paste is not good. Under the condition of 240-250 ° C, it will flow and cannot maintain the shape of the solder joints, and there will be black spots when soldering. A large amount of residual substances emerge, and copper cannot be effectively fused with tin alloy
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[0033] The preparation method of described SAC 305 alloy powder, comprises the steps:
[0034] (1) Melt the prepared alloy SAC 305 in the melting furnace, and then slowly drop it onto the high-speed turntable of the centrifugal atomization device. Under the condition of nitrogen protection, the liquid solder is rotated at high speed and flew out, and is cooled in parallel into fine particles ;
[0035] (2) After sieving, the alloy powder whose particle size distribution conforms to the ipc j-std-006 standard is selected to obtain the SAC305 alloy powder.
[0037] In one embodiment, the nano metal powder is pure copper powder and / or bronze powder.
[0038] In a preferred embodiment, the nano metal powder is pure copper powder.
[0039] In a preferred embodiment, the particle size of the pure copper powder is 20-100 nm.
[0040] In a preferred embodiment, the particle size of the pure copper powder is 40-60 nm.
[0041] In a preferred embodiment...
Embodiment 1
[0093] Embodiment 1 provides a kind of solder paste with stable performance, and described solder paste comprises tin solder alloy, nanometer metal powder, flux paste; The mass ratio of described nanometer metal powder and tin solder alloy is 1:8; The content of solder paste is 10wt%;
[0094] The tin solder alloy is SAC 305 alloy powder; the SAC 305 alloy powder is self-made;
[0095] The preparation method of described SAC 305 alloy powder, comprises the steps:
[0096] (1) Melt the prepared alloy SAC 305 in the melting furnace, and then slowly drop it onto the high-speed turntable of the centrifugal atomization device. Under the condition of nitrogen protection, the liquid solder is rotated at high speed and flew out, and is cooled in parallel into fine particles ;
[0097] (2) After sieving, the alloy powder whose particle size distribution meets the ipc j-std-006 standard is selected to obtain the SAC305 alloy powder;
[0098] The nano metal powder is pure copper powde...
Embodiment 2
[0113] Embodiment 2 provides a kind of solder paste with stable performance, and described solder paste comprises tin solder alloy, nanometer metal powder, flux paste; The mass ratio of described nanometer metal powder and tin solder alloy is 1:14; The content of solder paste is 20wt%;
[0114] Described tin solder alloy is with embodiment 1;
[0115] The nano metal powder is pure copper powder; the particle diameter of the pure copper powder is 60nm;
[0116] In parts by weight, the solder paste includes 40 parts of disproportionated rosin, 35 parts of solvent, 13 parts of polybasic organic acid, 12 parts of unsaturated acid anhydride, 4 parts of amidewax, and 4 parts of anti-aging agent;
[0117] The disproportionated rosin is dihydroabietic acid (CAS No. 19402-28-9);
[0120] The amidewax is a compound of N,N-bis(2-chloro...
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Abstract
The invention relates to the technical field of soldering paste, in particular to soldering paste with stable performance and a preparation method of the soldering paste. The soldering paste at leastcomprises tinsolder alloy, nano metalpowder and soldering assisted paste. The mass ratio of the nano metalpowder to the tinsolder alloy is 1: (5-20); and the content of the soldering assisted paste is 5-30 wt%. The prepared soldering paste can be molten at the melting point of the SAC 305 alloy to form a welding spot, the effects of low-temperature welding and high-temperature service are achieved, the temperature fatigue resistance and mechanical fatigue resistance of the tin-silver-copperalloy are remarkably improved, and weldability is good; when the prepared soldering paste is used for welding under the condition of 240-250 DEG C, an oxide layer of the nano copperpowder can be effectively removed; therefore, copper powder separation is avoided, there are no black residues in thewelding process, copper and tin alloy are effectively fused, and the problem that the solder paste is prone to corroding metal powder in the storage process, so that viscosity is increased, and the solder paste cannot be used is effectively solved.
Description
technical field [0001] The invention relates to the technical field of solder paste, in particular to a solder paste with stable performance and a preparation method thereof. Background technique [0002] Solder paste is a new type of soldering material that emerged with SMT (Surface Mount Technology, referred to as SMT), mainly including solder powder and flux. Solder paste is mainly used for soldering electronic components such as PCB surface resistance, capacitors, and ICs in the SMT industry. In the modern electronic assembly process, it is often necessary to perform multiple soldering on some devices or modules. In the subsequent welding process, it is often easy to cause the previously welded devices to be damaged due to heat and melting of the solder joints. In order to avoid this situation, it is necessary to use solders with different melting point temperatures to solder and assemble devices / components at different stages. [0003] In the production and assembly ...
Claims
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