Low-temperature co-fired ceramic material of double-phase ceramic filler, and preparation method thereof

A technology of low-temperature co-fired ceramics and ceramic fillers, which is applied in the field of low-temperature co-fired ceramic materials with dual-phase ceramic fillers and its preparation. and other issues to achieve the effect of low cost, low dielectric constant, and low loss

Pending Publication Date: 2020-04-17
HEFEI INSTITUTES OF PHYSICAL SCIENCE - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although this product has improved mechanical strength and suppressed the diffusion of silver, it has disadvantages with its preparation method. First of all, the thermal conductivity of the product is not good enough, which limits the scope of application, especially for higher power When the circuit is packaged; secondly, it is difficult to 2 o 3 Ceramic and SiO 2 Choose between ceramics to obtain products with higher dielectric properties; again, the preparation method cannot obtain products with better thermal conductivity and dielectric properties

Method used

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  • Low-temperature co-fired ceramic material of double-phase ceramic filler, and preparation method thereof
  • Low-temperature co-fired ceramic material of double-phase ceramic filler, and preparation method thereof
  • Low-temperature co-fired ceramic material of double-phase ceramic filler, and preparation method thereof

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Experimental program
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Effect test

Embodiment 1

[0044] The specific steps of preparation are:

[0045] Step 1. First, according to the molar ratio of bismuth trioxide, boron oxide, silicon oxide and zinc oxide of 1:0.1:0.25:0.5, the four are mixed to obtain a mixture. After the mixture was melted at 900°C, it was quenched by water cooling to obtain BBSZ glass slag.

[0046] Step 2: Grind the BBSZ glass slag ball into BBSZ glass powder with a particle size of 360nm. Then according to the weight ratio of BBSZ glass powder, alumina ceramic powder with a particle size of 2 μm and boron nitride ceramic powder with a particle size of 360 nm of 1:0.8:1.3, the three are mixed to obtain a mixed powder.

[0047] Step 3. According to the weight ratio of BBSZ glass powder, solvent and dispersant in the mixed powder of 1:0.1:0.1, the mixed powder, solvent and dispersant are ball milled together for 2h; where the solvent is ethanol and the dispersant It is castor oil to obtain a uniformly dispersed slurry. Then according to the weight ratio ...

Embodiment 2

[0050] Step 1. First, according to the molar ratio of bismuth trioxide, boron oxide, silicon oxide and zinc oxide of 1:0.3:0.2:0.63, the four are mixed to obtain a mixture. After the mixture is melted at 1000°C, it is quenched by water cooling to obtain BBSZ glass slag.

[0051] Step 2: Grind the BBSZ glass slag ball into BBSZ glass powder with a particle size of 370nm. Then according to the weight ratio of BBSZ glass powder, alumina ceramic powder with a particle size of 1.8 μm and boron nitride ceramic powder with a particle size of 370 nm of 1:1:0.98, the three are mixed to obtain a mixed powder.

[0052] Step 3. First, according to the weight ratio of BBSZ glass powder, solvent and dispersant in the mixed powder of 1:0.6:0.078, the mixed powder, solvent and dispersant are ball-milled for 5.25h; where the solvent is ethanol, and the dispersion The agent is castor oil to obtain a uniformly dispersed slurry. Then according to the weight ratio of BBSZ glass powder, binder, plasti...

Embodiment 3

[0055] Step 1. First, according to the molar ratio of bismuth trioxide, boron oxide, silicon oxide and zinc oxide of 1:0.6:0.15:0.75, the four are mixed to obtain a mixture. After the mixture was melted at 1100°C, it was quenched by water cooling to obtain BBSZ glass slag.

[0056] Step 2: Grind the BBSZ glass slag ball into BBSZ glass powder with a particle size of 380nm. Then according to the weight ratio of BBSZ glass powder, alumina ceramic powder with a particle size of 1.5 μm and boron nitride ceramic powder with a particle size of 380 nm of 1:1.2:0.66, the three are mixed to obtain a mixed powder.

[0057] Step 3. First, according to the weight ratio of BBSZ glass powder, solvent and dispersant in the mixed powder of 1:1.05:0.055, the mixed powder, solvent and dispersant are ball-milled for 8.5h; where the solvent is ethanol, and the dispersion The agent is castor oil to obtain a uniformly dispersed slurry. According to the weight ratio of BBSZ glass powder, binder, plasti...

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Abstract

The invention discloses a low-temperature co-fired ceramic material of a double-phase ceramic filler, and a preparation method thereof. The material comprises, by weight, 100 parts of BBSZ glass, 80-150 parts of aluminum oxide ceramic powder, 2-130 parts of boron nitride ceramic powder and 3 parts or below of carbide, wherein the particle size of the aluminum oxide ceramic powder is 1-2 [mu]m, andthe particle size of the boron nitride ceramic powder is less than or equal to 400 nm. The method comprises the following steps: mixing bismuth trioxide, boron oxide, silicon oxide and zinc oxide, melting the obtained mixture, carrying out water-cooling quenching, ball-milling the obtained BBSZ glass slag into powder, and mixing the powder with the aluminum oxide ceramic powder and the boron nitride ceramic powder, and then sequentially carrying out joint ball milling on the obtained mixed powder, a solvent, a dispersing agent, a binding agent, a plasticizer and a homogenizing agent, carryingout tape casting on the obtained slurry in a mold, drying the cast slurry, sequentially placing obtained raw ceramic chips at different temperatures to remove organic additives, and carrying out sinter molding to obtain the target product. The material has excellent heat conduction and dielectric properties, and can be easily and widely commercially applied to the field of electronic packaging.

Description

Technical field [0001] The invention relates to a low-temperature co-fired ceramic material and a preparation method, in particular to a low-temperature co-fired ceramic (LTCC) material of dual-phase ceramic filler and a preparation method thereof. Background technique [0002] With the rapid development of the information industry, people have put forward higher and higher requirements for the miniaturization, integration and portability of electronic products. In order to modularize and highly integrate electronic components and circuits, it is necessary to further improve the assembly density of the circuit and the stability of the system. Low-temperature co-fired ceramics is a technology in which interconnecting conductors, components and circuits are printed on unsintered cast ceramic materials, laminated together, and then sintered into an integrated ceramic multilayer material. The goal provides a practical solution. At present, people have made unremitting efforts to ob...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/583C04B35/10C04B35/622
CPCC04B35/10C04B35/583C04B35/622C04B2235/3217C04B2235/365C04B2235/386C04B2235/5436C04B2235/5445C04B2235/6025C04B2235/606C04B2235/656C04B2235/6567C04B2235/786C04B2235/9607
Inventor 陈林冯祥艳汪凤宇胡坤李潇潇孙俊刘岗郑康张献王化田兴友
Owner HEFEI INSTITUTES OF PHYSICAL SCIENCE - CHINESE ACAD OF SCI
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