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Nano-composite porous polyimide film and preparation method thereof

A polyimide film and polyimide technology are applied in the field of nano-composite porous polyimide film and its preparation to achieve the effects of good mechanical properties, reduced dielectric constant and mild conditions

Active Publication Date: 2020-05-01
INST OF CHEM ENG GUANGDONG ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the existing problems in the preparation of low dielectric constant polyimide films in the prior art, one of the purposes of the present invention is to provide a nanocomposite porous polyimide film, and two of the purposes of the present invention are to provide such Preparation method of nanocomposite porous polyimide film

Method used

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  • Nano-composite porous polyimide film and preparation method thereof
  • Nano-composite porous polyimide film and preparation method thereof
  • Nano-composite porous polyimide film and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0046] The preparation method of this example porous polyimide film comprises the following steps:

[0047] 1) Weigh 3g of nano-silica with an average particle size of 50nm-500nm into a 500mL three-neck flask, add 300mL of toluene and 4g of propyltriethoxysilane, and stir and reflux at 110°C for 1 day under nitrogen protection. Then centrifuge washing and drying to obtain modified nano silicon dioxide.

[0048] 2) 5 mg of polyimide and 0.1 mg of didodecyldimethylammonium bromide (DDAB) were dissolved in 20 mL of dichloromethane to prepare a polyimide organic solution.

[0049] 3) Add 0.05 mg of modified nano-silica particles to the polyimide organic solution, and disperse the nanoparticles evenly by ultrasonication for 30 minutes. Add 1 mL of deionized water to mix, and emulsify with an emulsifier to obtain a stable Pickering emulsion.

[0050] 4) The emulsion was coated on a clean glass substrate, and freeze-dried at -30° C. for 20 h to obtain a porous polyimide film. The ...

Embodiment 2～5

[0052] The preparation process of Examples 2-5 is the same as that of Example 1, and the obtained porous polyimide films are all about 100 μm. The only difference between the examples is that the emulsion components are different, and the emulsion components of Examples 1-5 are shown in Table 1.

[0053] The emulsion composition of each embodiment of table 1

[0054]

Embodiment 4

[0057] The scanning electron microscope figure of the polyimide thin film that embodiment 4 makes is as attached figure 1 shown. from figure 1 It can be confirmed that the polyimide film has a porous structure.

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Abstract

The invention discloses a nano-composite porous polyimide film and a preparation method thereof. The preparation method for the porous polyimide film comprises the following steps: 1) reacting nanoparticles with a silane coupling agent to obtain modified nanoparticles; 2) dissolving polyimide and an auxiliary additive in an organic solvent to obtain a polyimide solution; 3) mixing and dispersing the polyimide solution and the modified nanoparticles, adding water, and carrying out mixing and emulsifying to obtain a Pickering emulsion; and 4) coating a substrate with the emulsion, and carrying out drying to obtain the product. The preparation method disclosed by the invention has the characteristics of mild conditions, low cost, simple and convenient operation process and technology and thelike. Due to the fact that water drops and the modified nanoparticles are selected, air holes can be introduced into the polyimide film at low cost without an extra step for removing, a dielectric constant is reduced, and meanwhile, the mechanical property of the film can be improved by adding the nanoparticles; and the polyimide film is expected to be applied to the industries of electronics, microelectronics, aerospace and the like.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a nanocomposite porous polyimide film and a preparation method thereof. Background technique [0002] Polyimide (PI) has oxidation resistance, heat resistance, radiation resistance, low temperature characteristics and Drug resistance and other advantages, it has been widely used in the electrical and electronic industry. However, as microelectronic devices continue to advance to nanoscale technology nodes, the dielectric constant of interconnect layer dielectric materials is required to be less than 2.0 to reduce interconnection delay and dielectric loss. The traditional PI dielectric constant is between 2.9 and 3.4, which is difficult to meet the requirements of the future microelectronics industry. For this reason, low dielectric constant polyimide film and its preparation are of great significance. [0003] According to the Clausius-Mosotti equation, there are two...

Claims

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Application Information

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IPC IPC(8): C08J5/18C08J9/28C08L79/08C08K9/06C08K3/36
CPCC08J5/18C08J9/28C08J9/009C08J2379/08C08J2201/0484
Inventor 王全勇周军伟李伟浩麦裕良
Owner INST OF CHEM ENG GUANGDONG ACAD OF SCI