Thin film packaging structure and organic photoelectric device

Abstract

The invention provides a thin film packaging structure which is good in water-oxygen barrier property and can release inorganic layer stress to eliminate black spots and an organic photoelectric device using the thin film packaging structure. The thin film packaging structure comprises a first inner packaging layer, a metal layer, a second inner packaging layer, an adhesive layer and an outer packaging layer which are sequentially arranged from inside to outside. According to the invention, the above technical scheme is adopted, the metal layer is arranged between the first inner packaging layer and the second inner packaging layer of the thin film packaging structure, water and oxygen entering from the outside can form a compact metal oxide when encountering the metal layer, and the layerof oxide has a certain water and oxygen blocking performance, so that water and oxygen can be effectively prevented from entering the organic photoelectric device (such as an OLED device), the packaging performance of the organic photoelectric device is effectively improved, due to the arrangement of the metal layer, the stress of the second packaging layer can be released, and the situation thatblack spots appear on an OLED screen body due to electrode stripping of the second inner packaging layer is avoided.

Description

technical field [0001] The present application relates to the technical field of packaging of organic photoelectric devices, in particular to a thin film packaging structure and organic photoelectric devices. Background technique [0002] OLED is favored for its features such as bendable, foldable, thin and light, and high color saturation. As we all know, thin film encapsulation has excellent water and oxygen barrier properties and is widely used in OLED encapsulation. However, there are currently two problems in thin film packaging. One is that the inorganic layer of thin film packaging has a certain stress. During use, the inorganic layer will peel off the cathode of the OLED screen from the organic layer of the OLED, resulting in black spots. When the OLED screen is cut by the cutter wheel, it will cause microcracks in the inorganic packaging layer, which will make the screen invalid. Since the inorganic barrier layer is very thin and belongs to the amorphous state, onc...

AI Technical Summary

Problems solved by technology

However, there are currently two problems in thin film packaging. One is that the inorganic layer of thin film packaging has a certain stress. During use, the inorganic layer will peel off the cathode of the OLED screen from the organic layer of the OLED, resulting in black spots. When the OLED screen is cut by the cutter wheel, it will cause microcracks in the inorganic packaging layer, which will make the screen invalid. Since the inorganic barrier layer is very thin and belongs to the amorphous state, once the microcracks are formed, they will grow disorderly. This kind of crack growth belongs to Griffith The growth power of cracks comes from internal stress. There are two main ways to prevent such cracks. One is dam design to directly block the growth of micro-cracks. The other is to release its internal stress to prevent the growth of micro-cracks. At present, this kind of erosion is mainly slowed down by dame design. The design point of dame design is to design one or more rings of protrusions on the edge of the screen; and the height of the protrusions is below 5 μm, and its effect is only to extend the edge water. Oxygen attack path; its water and oxygen barrier properties are limited

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