Low-temperature cured single-component epoxy adhesive as well as preparation method and application thereof

An epoxy adhesive, one-component technology, used in epoxy resin adhesives, adhesives, organic chemistry, etc., can solve the problems of short service life, defective oxygen and moisture barrier properties, high transportation costs, and improve service life. , Solve the problem of storage stability and improve the effect of hydrophobicity

Active Publication Date: 2020-05-15
重庆中科力泰高分子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing low-temperature curing epoxy glue for edge sealing of electronic paper needs to be stored and transported at -40 degrees Celsius, which has high transportation costs, short service life, and defects in the barrier performance to oxygen and moisture.

Method used

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  • Low-temperature cured single-component epoxy adhesive as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Prepare a low-temperature curing one-component epoxy adhesive, which is prepared according to the following method:

[0036] (1) Preparation of latent mercaptans: adding epoxy-containing compounds (1,3,5-triglycidyl isocyanurate) and thioacetic acid in sequence, wherein 1,3,5-triglycidyl The mol ratio of the epoxy group in the isocyanurate and thioacetic acid is 1:1.2, and tetrabutylammonium bromide is added as a catalyst (the quality of tetrabutylammonium bromide is 1,3,5-triglycidyl 0.5% of the total mass of isocyanurate and thioacetic acid), reacted at 95°C for 2h, and distilled under reduced pressure to obtain latent mercaptan TGICS;

[0037] (2) By weight, 45 parts of bisphenol A epoxy resin 128, 20 parts of bisphenol S epoxy resin, 20 parts of diphenol base hexafluoropropane diglycidyl ether, 15 parts of glycidyl propyl octafluoropentyl Add ether, 1.0 part of coupling agent (KH-560) and 1.0 part of thixotropic thickener (Cabot TS720) into the planetary reactor, s...

Embodiment 2

[0041] Prepare a low-temperature curing one-component epoxy adhesive, which is prepared according to the following method:

[0042] (1) Preparation of latent mercaptans: adding epoxy-containing compounds (trimethylolpropane triglycidyl ether) and monothioacid compounds (thiopropionic acid) in sequence, wherein trimethylolpropane triglycidyl The mol ratio of the epoxy group in the ether to thiopropionic acid is 1:1.5, adding tetrabutylammonium bromide is a catalyst (the quality of tetrabutylammonium bromide is trimethylolpropane triglycidyl ether and thiosulfate 1.0% of the total mass of propionic acid), reacted at 85°C for 6h, and distilled under reduced pressure to obtain latent mercaptan TMPEGS;

[0043](2) By weight, 20 parts of UVR6103 epoxy resin, 10 parts of bisphenol F epoxy resin, 25 parts of 4080E hydrogenated bisphenol A epoxy resin, 40 parts of octafluorobiphenyl diglycidyl ether, 5 parts of glycidyl Glycerin propyl dodecafluoroheptyl ether, 2.0 parts of coupling a...

Embodiment 3

[0047] Prepare a low-temperature curing one-component epoxy adhesive, which is prepared according to the following method:

[0048] (1) Preparation of latent mercaptans: Add epoxy-containing compound (pentaerythritol tetraglycidyl ether) and monothioacid compound (thioacetic acid) in sequence, wherein the epoxy group in pentaerythritol tetraglycidyl ether and thioxate The molar ratio of acetic acid is 1:1.3, add tetrabutylammonium bromide as catalyst (the quality of tetrabutylammonium bromide is 0.8% of the total mass of pentaerythritol tetraglycidyl ether and thioacetic acid), and react at 90°C for 4h , distillation under reduced pressure, obtain latent mercaptan PETEGS;

[0049] (2) In parts by weight, 25 parts of UVR6103 epoxy resin, 40 parts of 4080E hydrogenated bisphenol A epoxy resin, 25 parts of two-(hexafluorohydroxypropyl) benzene diglycidyl ether, 10 parts of glycidyl propyl Hexafluorobutyl ether, 1.0 parts of coupling agent (KH-563) and 3.0 parts of thixotropic th...

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Abstract

The invention relates to a low-temperature cured single-component epoxy adhesive as well as a preparation method and application thereof, and belongs to the field of electronic packaging materials. The epoxy adhesive is prepared from the following materials in parts by weight: 40 to 75 parts of epoxy resin, 20 to 40 parts of fluorine-containing epoxy resin, 5 to 20 parts of mono-epoxy fluorine-containing epoxy monomer, 40 to 100 parts of latent mercaptan, 0.1 to 10 parts of an accelerant, 0.1 to 5 parts of a coupling agent and 1 to 10 parts of a thixotropic thickener. Fluorine-containing epoxyresin and mono-epoxy fluorine-containing epoxy monomer are adopted, the contents of the components such as epoxy resin, latent mercaptan (a curing agent), an accelerant, a coupling agent, a thixotropic thickener and the like are scientifically matched, and fluorine-containing epoxy resin and latent mercaptan are smartly combined, so that the storage stability problem of the low-temperature curedepoxy adhesive is solved, the adhesive has excellent water resistance and oxygen resistance, and the reliability in the field of edge sealing of electronic paper displays is greatly improved.

Description

technical field [0001] The invention belongs to the field of electronic packaging materials, and in particular relates to a low-temperature curing one-component epoxy glue and its preparation method and application. Background technique [0002] Electronic paper technology is actually a general term for a class of technologies. The English name E-paper mostly uses electrophoretic display technology (electrophoresis display, EPD) as the display panel. Its display effect is close to that of natural paper and avoids reading fatigue. The display technology that achieves comfortable reading like paper, ultra-thin, light, bendable, and ultra-low power consumption is called electronic paper technology. In the EPD electrophoretic display technology, the infiltration of oxygen and moisture will affect the quality of the display and damage the electronic paper membrane, so it is necessary to seal the electronic paper protective film. The highly hydrophobic, high-density low-temperatu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J163/02C09J11/04C09J11/06C08G59/66C07C327/22
CPCC09J163/00C09J11/04C09J11/06C08G59/66C07C327/22C08L2203/206C08L2201/14C08L2205/025C08L2205/03C08L63/00C08K13/06C08K9/06C08K9/04C08K7/26C08K5/5435
Inventor 丁远有李有刚何彬余中孝
Owner 重庆中科力泰高分子材料有限公司
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