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A kind of ultra-fast photon curing conductive adhesive and preparation method thereof

A technology of photonic curing and conductive adhesives, applied in the direction of conductive adhesives, modified epoxy resin adhesives, etc., can solve the problems of short operation time, long operation time, generally more than 2 hours, etc., to achieve fast curing speed, The effect of high practical value and low volume resistance

Active Publication Date: 2021-08-03
诺特达新材料科技(上海)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, there are room temperature curing conductive adhesives, which have a longer curing time, usually more than 2 hours, in order to achieve the required electrical and mechanical properties
Obviously, high-temperature curing and long-time curing of conductive adhesives can no longer meet the growing micro-nano electronic packaging and interconnection of semiconductor components, especially in the field of printed electronics based on flexible substrates, which require low-temperature curing environment, ultra-fast curing and very short operating time

Method used

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  • A kind of ultra-fast photon curing conductive adhesive and preparation method thereof
  • A kind of ultra-fast photon curing conductive adhesive and preparation method thereof
  • A kind of ultra-fast photon curing conductive adhesive and preparation method thereof

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preparation example Construction

[0060] A second aspect of the present invention provides a method for preparing an ultra-fast photon-cured conductive adhesive, comprising the following steps:

[0061] (1) Preparation of conductive adhesive: Fully stir and disperse vinyl ester resin, diluent, coupling agent, photoinitiator, thermal initiator, thixotropic agent, anti-impact agent, and silver powder, then grind and defoam, that is obtain the conductive adhesive;

[0062] (2) Curing of the conductive adhesive: the conductive adhesive prepared in step (1) was cured by using a photonic sintering system.

[0063] The inventors of the present application found that by introducing functional double bond groups into the polymer chain of the conductive adhesive body resin, under the conditions of the presence of multifunctional reactive diluents and silver powder, the use of photon energy helps the conductive adhesive to achieve super With the effect of rapid curing, a conductive adhesive with low resistivity and high...

Embodiment 1

[0067] Embodiment 1 provides an ultra-fast photon-curable conductive adhesive. In parts by weight, the preparation raw materials are 15 parts of vinyl ester resin, 10 parts of diluent, 0.5 part of coupling agent, 2 parts of photoinitiator, and 0 parts of thermal initiator. parts, 0.5 parts of thixotropic agent, 2 parts of anti-impact agent, and 70 parts of silver powder.

[0068] The vinyl ester resin is novolak epoxy vinyl ester resin, which can be obtained commercially, the manufacturer is Ripoxy, and the brand is 630.

[0069] The diluent is hydroxyethyl methacrylate (CAS: 868-77-9).

[0070] The coupling agent is epoxy silane KH-560 (CAS: 2530-83-8).

[0071] The photoinitiator is a triaryl iodonium salt, commercially available, the manufacturer is Bluesil PI, and the brand is 2074.

[0072] The thixotropic agent is polyamide wax, which can be obtained commercially, the manufacturer is Disparlon, and the brand is 6500.

[0073] The anti-impact agent is 1,3-propanediol b...

Embodiment 2

[0079] Embodiment 2 provides an ultra-fast photon-curable conductive adhesive. In parts by weight, the preparation raw materials are 20 parts of vinyl ester resin, 5 parts of diluent, 0.5 part of coupling agent, 0 part of photoinitiator, and 2 parts of thermal initiator. parts, 0.5 parts of thixotropic agent, 2 parts of anti-impact agent, and 70 parts of silver powder.

[0080] The vinyl ester resin is a polyurethane-modified epoxy vinyl ester resin, which is commercially available, and the manufacturer is Atlac, and the brand is 580.

[0081] The diluent is 1,6-hexanediol diacrylate (CAS: 13048-33-4).

[0082] The coupling agent is aminosilane KH-550 (CAS: 919-30-2).

[0083] The thermal initiator is a peroxyketal, which can be obtained commercially, the manufacturer is Trigonox, and the brand is 122-C80.

[0084] The thixotropic agent is silicon dioxide, which can be obtained commercially, the manufacturer is Aerosil, and the brand is R202.

[0085] The anti-impact agent ...

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Abstract

The invention belongs to the field of micro-nano electronic packaging and semiconductor materials, and specifically discloses an ultra-fast photon-cured conductive adhesive and a preparation method thereof. In parts by weight, the preparation raw materials at least include: 10-20 parts of vinyl ester resin, diluent 2-10 parts, 0-0.5 parts of coupling agent, 0-2 parts of photoinitiator, 0-2 parts of thermal initiator, 0-0.5 parts of thixotropic agent, 0-2 parts of anti-impact agent, 70-90 parts of silver powder . The present invention introduces functional double bond groups into the polymer chain of conductive adhesive base resin, and achieves ultra-ultra-fast curing with the help of photon energy, and its radiation energy is 1‑3J·cm ‑2 1. The radiation time is 90-200ms, and the conductive adhesive of the present invention has a low volume resistance of 6-20μΩ·cm and a high bonding strength of 6-8MPa.

Description

technical field [0001] The invention relates to the fields of micro-nano electronic packaging and semiconductor materials, in particular to an ultrafast photon-cured conductive adhesive and a preparation method thereof. Background technique [0002] Conductive adhesive is a material used for micro-nano electronic packaging and interconnection of semiconductor components. It is mainly prepared from conductive fillers, matrix resins, diluents, solvents and additives. The curing of conductive adhesive includes heat curing and light curing. At present, the vast majority of conductive adhesives are heat-curable and UV-curable. The curing temperature of heat-curable conductive adhesives is 120-150°C, and the curing time is 30-60 minutes. The curing time of UV-curable conductive adhesives is from a few minutes to Dozens of minutes. In addition, there is a room temperature curing type conductive adhesive, which takes longer to cure, and generally needs more than 2 hours to achieve...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J9/02C09J163/10
CPCC08K2003/0806C08K2201/001C08K2201/011C08L2201/04C08L2203/206C08L2205/03C09J9/02C09J163/10C08L77/00C08K13/02C08K3/08C08K5/5435C08K5/18C08L83/10C08K5/544C08K3/36C08L91/00
Inventor 彭赛崔会旺
Owner 诺特达新材料科技(上海)有限公司
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