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Substrate including polymer and ceramic cold-sintered material

A technology of polymers and mixed materials, applied in circuits, electrical components, capacitors, etc., can solve the problems of high-frequency ceramic dielectric substrates lacking high mechanical stability and high thermal conductivity, so as to prevent thermal stress cracking and improve thermal shock resistance sex, stress-relieving effect

Inactive Publication Date: 2020-06-12
SHPP GLOBAL TECH BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, high frequency ceramic dielectric substrates may lack high mechanical stability (crack resistance) and high thermal conductivity

Method used

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  • Substrate including polymer and ceramic cold-sintered material
  • Substrate including polymer and ceramic cold-sintered material
  • Substrate including polymer and ceramic cold-sintered material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0075] Example 1 - Electrical Properties

[0076] In one embodiment, the Na2 Mo 2 o 7 The powder is mixed with polyetherimide (PEI) according to the following composition: (1-x)Na 2 Mo 2 o 7 - xPEI (x=0 vol%, 10 vol%, 20 vol%, 30 vol%, 40 vol%, 50 vol%). The mixture was ball milled in ethanol for 24 hours and then dried at 85 °C.

[0077] (1-x)Na 2 Mo 2 o 7 Multilayer composite of xPEI (x=0 vol%, 10 vol%, 20 vol%) and silver electrodes. First, the (1-x)Na 2 Mo 2 o 7 - xPEI powder was mixed with a solution of 95 wt% methyl ethyl ketone (MEK) and 5 wt% QPAC 40 resin (Empower Materials, Newark, DE, USA) and ball milled for 12 to 24 hours. Then, 66.3 wt% methyl ethyl ketone (MEK), 28.4 wt% QPAC 40 resin and 5.3 wt% butyl benzyl phthalate S-160 (Tape Casting Warehouse, Morrisville, PA, USA) were added to the slurry , then ball milled for 24 hours and rolled for 1 to 2 hours (MX-T6-S Analog Tube Roller, Scilogex, Rocky Hill, CT, USA). Then, using a laboratory belt ca...

Embodiment 2

[0081] Embodiment 2 - coefficient of thermal expansion

[0082] The thermal expansion coefficients of the cold-sintered hybrid materials were measured using a TA Instruments thermomechanical analyzer TMA Q400, and the data were analyzed using TA Instruments' Universal Analysis V4.5A.

[0083] The samples were reshaped to form round pellets with a diameter of 13 mm and a thickness of 2 mm to fit the TMA Q400 equipment. Put the sample into TMAQ400, heat to 150°C (@20°C / min) to release moisture and stress, then cool to -80°C (@20°C / min) to start the actual thermal expansion coefficient measurement. The sample was heated from -80°C to 150°C at a temperature of 5°C per minute, and the change of displacement with temperature was measured.

[0084] The measured data are then loaded into the analysis software and the coefficient of thermal expansion is calculated using the αx1-x2 method. This method measures the dimensional change from temperature T1 to temperature T2 and converts...

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Abstract

Various examples disclosed relate to a substrate. The substrate includes a cold-sintered hybrid material. The cold-sintered hybrid material includes a polymer component and a ceramic component. The substrate further includes a conductor at least partially embedded within the cold-sintered hybrid material. The substrate further includes a via attached to the conductor. The cold-sintered hybrid material has a relative density in a range of from about 80% to about 99%.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of priority to U.S. Provisional Patent Application No. 62 / 550417, filed August 25, 2017, entitled "SUBSTRATE INCLUDING POLYMERAND CERAMIC COLD-SINTERED MATERIAL"; the disclosure of which is incorporated by reference into this article. Background technique [0003] High frequency ceramic dielectric substrates may be limited in the ability to easily tune electrical properties (eg, having a suitable dielectric constant, having a resonant frequency or a flat temperature coefficient of permittivity). In addition, high-frequency ceramic dielectric substrates may lack high mechanical stability (crack resistance) and high thermal conductivity. Contents of the invention [0004] According to the present disclosure, a ceramic / polymer composite material has been developed through a cold sintering process (CSP) as a substrate for a high-frequency device substrate in electronic applications to s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/495C04B35/634C04B35/638C04B35/645H01G4/00
CPCC04B35/495C04B35/634C04B35/63464C04B35/638C04B35/645C04B2235/3201C04B2235/3256C04B2235/6025H01G4/206C04B35/01C04B35/64C04B41/009C04B41/4505C04B2235/66
Inventor 尼尔·普法伊芬贝格尔托马斯·L·埃文斯克莱夫·兰德尔郭晶
Owner SHPP GLOBAL TECH BV
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