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Flexible high-thermal-conductivity polymer nanocomposite film and preparation method thereof

A nanocomposite and polymer technology, applied in chemical instruments and methods, heat exchange materials, etc., can solve the problems of reducing polymer plasticity and toughness, deteriorating polymer mechanical properties, and failing to meet performance requirements, etc., to achieve excellent thermal conductivity , easy mass production, good flexibility

Inactive Publication Date: 2020-06-19
EAST CHINA JIAOTONG UNIVERSITY +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the thermally conductive plastics involved in these inventions have low thermal conductivity, and the presence of a large amount of thermally conductive additives greatly deteriorates the mechanical properties of the polymer, especially the plasticity and toughness of the polymer, which cannot meet its application in the field of thermal diffusion. performance requirements

Method used

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  • Flexible high-thermal-conductivity polymer nanocomposite film and preparation method thereof
  • Flexible high-thermal-conductivity polymer nanocomposite film and preparation method thereof
  • Flexible high-thermal-conductivity polymer nanocomposite film and preparation method thereof

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preparation example Construction

[0025] A flexible high thermal conductivity polymer nanocomposite film proposed by the present invention uses hexagonal layered boron nitride (h-BN) as a thermal conductive filler and high-density polyethylene (HDPE) as a matrix. As far as the film is concerned, the content of the thermally conductive filler determines its flexibility and thermal conductivity, and the content of the thermally conductive filler depends on its dispersion in the polymer matrix; The h-BN / HDPE mixture was melt blended by machine to increase the dispersion of h-BN in HDPE, and finally the composite material was thermally stretched to induce the orientation of layered h-BN in HDPE, so that the obtained polymer The nanocomposite film has ultrahigh thermal conductivity and excellent flexibility. Such as figure 2 As shown, the specific steps for preparing the flexible high thermal conductivity polymer nanocomposite film are as follows:

[0026] Step 1. Stir the hexagonal layered boron nitride and hig...

Embodiment 1

[0031] First, after mixing 500g of hexagonal layered boron nitride (with a particle size of 1-3mm) and 9500g of polyethylene, stir at high speed in a high-speed stirrer for 30 minutes to obtain a premixture to obtain a 5w.t.% polyethylene boron nitride mixture . Then the mixture is melted and blended by a twin-screw extruder and extruded to pelletize. After drying, it is stretched by stretching equipment at a temperature of 120°C and a stretch ratio of 1 to obtain polyethylene boron nitride. nanocomposite film. Then the film was made into a circular sample with a diameter of 25.4 mm for the measurement of thermal conductivity. The thermal conductivity of the thermally conductive polymer nanocomposite obtained in this example is 0.32W m -1 K -1 .

Embodiment 2

[0033] First, after mixing 500g of hexagonal layered boron nitride (with a particle size of 1-3mm) and 9500g of polyethylene, stir at high speed in a high-speed stirrer for 30 minutes to obtain a premixture to obtain a 5w.t.% polyethylene boron nitride mixture . Then the mixture is melted and blended by a twin-screw extruder and extruded to pelletize. After drying, it is stretched by stretching equipment at a temperature of 120°C and a stretch ratio of 2 to obtain polyethylene boron nitride. nanocomposite film. Then the film was made into a circular sample with a diameter of 25.4 mm for the measurement of thermal conductivity. The thermal conductivity of the thermally conductive polymer nanocomposite obtained in this example is 0.58W m -1 K -1 .

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Abstract

The invention discloses a flexible high-thermal-conductivity polymer nanocomposite film. According to the invention, an h-BN thermal-conductivity filler is adopted and HDPE is used as a matrix. A preparation method for the flexible high-thermal-conductivity polymer nanocomposite film comprises the following steps: physically premixing the h-BN and the HDPE, carrying out melt blending with a twin-screw extruder to increase the dispersibility of the h-BN in the HDPE, extruding a formed h-BN-HDPE composite material through a single-screw extruder, carrying out cooling, stretching and flaking; andfinally, carrying out hot stretching treatment on the composite material to induce the orientation of the layered h-BN in the HDPE, wherein the content of the filler determines the flexibility and the heat-conducting property of the film, and the content of the filler depends on the dispersity of the filler in the polymer matrix. The polymer heat conduction nanocomposite film prepared by the invention has ultrahigh heat conductivity, good heat dissipation capability, good flexibility and excellent comprehensive performance, is applicable to mass production, can be made into various components, and has wide application prospects in the fields of electronic packaging, LED lighting systems, automobiles, aerospace and the like.

Description

technical field [0001] The invention relates to a formulation and a processing method of a flexible polymer nano-heat-conducting composite film with ultra-high thermal conductivity, in particular to a preparation of a highly dispersed layered boron nitride-filled binary heat-conducting polymer nano-composite material and its preparation method. Film processing and preparation methods. Background technique [0002] With the rapid development of miniaturization, integration, lightweight and digital industrial electronic equipment, the requirements for the heat dissipation performance of electronic equipment are also getting higher and higher, especially in the field of aerospace, the lightweight of plastic packaging materials for electronic equipment, The requirements for electrical insulation, mechanical properties, and heat dissipation are particularly stringent. As a traditional heat-conducting material, the application of metal materials in some fields is limited due to t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L23/06C08K7/00C08K3/38C08J5/18C09K5/14
CPCC08J5/18C09K5/14C08J2323/06C08K7/00C08K2003/385
Inventor 章日超杨海波王海华王茂雪马兴贵
Owner EAST CHINA JIAOTONG UNIVERSITY
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