Reversal copper foil production process

Abstract

The invention relates to a reversal copper foil production process, belonging to the technical field of electrolytic copper foils. The process comprises electrolysis of raw foil and surface treatment,wherein the surface treatment comprises microetching, acid pickling, roughening, washing, curing, washing, roughening, washing, curing, washing, surface alloying treatment, washing, surface anti-oxidation treatment, washing, passivation, applying of an anti-sticking film on a rough surface, silanization treatment, and drying; the applied anti-sticking film comprises the following components according to the weight percentage: 35.5-46 wt% of organochlorosilane, 27.8-33 wt% of organopolysiloxane resin, 12.7-20.1 wt% of aminosilane, 10.2-12.2 wt% of polyester resin, and 2-8.2 wt% of acid carclazyte catalyst; and the applied anti-sticking film has the thickness of 3 micrometers. The production process can reduce the residual copper rate on the surface of a copper foil while ensuring the bonding force between the surface of the copper foil and an etching resist, and ensures the elongation rate of the copper foil.

Description

technical field [0001] The invention belongs to the technical field of electrolytic copper foil, and in particular relates to a reverse copper foil production process. Background technique [0002] Electrolytic copper foil is an important material for the manufacture of copper clad laminates (CCL), printed circuit boards (PCB), and lithium-ion batteries. In the rapid development of today's electronic information industry, electrolytic copper foil is called the "neural network" of electronic product signal and power transmission and communication. As an emerging copper processing product, electrolytic copper foil plays an increasingly important role in the electronic material industry. Copper foil produced by electrolysis, in addition to maintaining the high electrical conductivity, high thermal conductivity, certain mechanical strength, and beautiful metallic luster of copper foil produced by other methods, is also easy to stick to the surface of other materials. One side ...

AI Technical Summary

Problems solved by technology

[0003] However, some problems in the production and processing of this kind of products have gradually become prominent. Due to the rough surface of some reversed copper foil plates, residual glue is easy to remain after dry film development, and residual copper is easy to occur after etching. The problem of residual copper is A common problem in the process of plate processing. In order to solve this technical problem, some existing methods are to change the roughness of the copper foil surface by grinding the plate and other processes. Although this method reduces the residual copper rate on the copper foil surface, but At the same time, it also loses some advantages of reversed copper foil, which will easily lead to a decrease in its surface bonding force and affect the elongation of the sheet, etc.

Images