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A kind of high electrical and thermal conductivity aluminum-based composite material and preparation method thereof

A high-conductivity, aluminum alloy technology, applied in metal material coating process, carbide, liquid chemical plating and other directions, can solve the problems of limited strength improvement of aluminum alloy, low strength, affecting the scope of use, etc., to achieve superior performance, The best tensile strength and the effect of solving the thermal conductivity

Active Publication Date: 2021-01-12
HUNAN INSTITUTE OF ENGINEERING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Pure aluminum has extremely high thermal conductivity and electrical conductivity, but its low strength affects its application range
The commonly used reinforcement materials for aluminum matrix are silicon carbide, alumina, aluminosilicate, carbon fiber, etc. The traditional particle-added aluminum matrix composite materials have limited improvement in the strength of aluminum alloys due to interface problems and agglomeration problems, and even have conductive properties for aluminum alloys. , strength and other performance reverse effects

Method used

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  • A kind of high electrical and thermal conductivity aluminum-based composite material and preparation method thereof
  • A kind of high electrical and thermal conductivity aluminum-based composite material and preparation method thereof
  • A kind of high electrical and thermal conductivity aluminum-based composite material and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0033] This embodiment provides a method for preparing a highly conductive and thermally conductive aluminum alloy, the steps of which include:

[0034] (1) Mix quartz sand and expanded graphite powder (1-10um in size) according to the mass ratio of 7:3, and add Fe powder and Ni powder according to the mass ratio of 1:1, which account for 0.001% of the quartz sand mass percentage. , ball milling, the quartz sand after the ball milling and the expanded graphite composite powder grain size are 100nm, then add and account for 1% of the quartz sand mass percentage, and the particle size is 200nm short carbon fiber, after mixing by a high-speed mixer (rotating speed is 800rpm, mixing time 30min), placed at 1680°C for heat preservation treatment for 40h, while passing propane gas to obtain powder, and then calcined at 800°C for 0.5h to obtain SiC whisker and nano-SiC particle composite powder, figure 1 It is a picture of the mixture of SiC particles and whiskers prepared in the embo...

Embodiment 2

[0044] On the basis of the preparation method of high electrical and thermal conductivity aluminum alloy in Example 1, the addition amount of copper-plated SiC particles and SiC whiskers is controlled as follows: based on the total mass of raw materials as 100%, take the copper-plated SiC particles with a mass percentage of 3wt% It is mixed with SiC whiskers and pure aluminum powder with a mass percentage of 97wt%, and other conditions are the same as in Example 1.

Embodiment 3

[0046] On the basis of the preparation method of high electrical and thermal conductivity aluminum alloy in Example 1, the addition amount of copper-plated SiC particles and SiC whiskers is controlled as follows: the total mass of raw materials is 100%, and the mass percentage is 5 wt% of copper-plated SiC particles Mix with SiC whiskers and the pure aluminum powder of 95wt% by mass percentage, other conditions are all identical with embodiment 1, image 3 It is the dimple SEM picture of the tensile fracture of the 5% SiC reinforced pure aluminum composite material in this example.

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Abstract

The invention discloses a high-conductivity and high-heat-conductivity aluminum matrix composite and a preparation method thereof. The preparation method comprises the steps that SiC whisker and nanoSiC particle composite powder is prepared, and copper-plated SiC particles and SiC whiskers are obtained through pretreatment, roughening treatment, sensitization treatment and chemical copper platingtreatment of the SiC whisker and nano SiC particle composite powder; and by taking the total mass of the raw materials as 100%, the copper-plated SiC particles and the SiC whiskers with the mass percentage being 2wt%-9wt% and pure aluminum powder with the mass percentage being 91wt%-96wt% are taken to be mixed and pressed into a blank, the blank is heated to 580 DEG C for liquid phase sintering,the blank is subjected to hot forging through a die forging process, the forged blank is extruded and shrunk through the extrusion compression ratio being (9-15): 1, a sample is obtained, the obtainedsample is subjected to solution treatment for 2-10h at the temperature of 480-520 DEG C and then quenched, the sample is placed for 72h at the room temperature, and a high-conductivity and high-heat-conductivity aluminum alloy is obtained. The measured tensile strength is 279.6Mpa, and the heat conductivity is 171.6.

Description

technical field [0001] The invention belongs to the technical field of aluminum alloy composite material preparation, and in particular relates to an aluminum-based composite material with high electrical and thermal conductivity and a preparation method thereof. Background technique [0002] With the development of application scenarios such as 5G technology, traditional aluminum alloys cannot meet the performance in terms of strength, electrical conductivity, and thermal conductivity at the same time. Therefore, researchers are constantly seeking combinatorial innovations that can obtain high-performance materials. In air conditioners, mobile phone middle frames, etc., and CPU cooling bases, etc., all turn to aluminum alloy research. Aluminum matrix composite materials are considered to be a relatively low cost, comprehensive performance, and can be applied to functional materials. [0003] Pure aluminum has extremely high thermal and electrical conductivity, but its low ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C47/14C22C49/06C22C49/14B22F3/17B22F3/10C23C18/40C23C18/18C01B32/97C22C101/14
CPCB22F3/1035B22F3/17C22C47/14C22C49/06C22C49/14C23C18/1872C23C18/40C01B32/97
Inventor 高平平吴安如彭小敏陈爽
Owner HUNAN INSTITUTE OF ENGINEERING