High-thermal-conductivity single-component underfill adhesive and preparation method thereof

An underfill, one-component technology, used in non-polymer adhesive additives, adhesives, adhesive types, etc., can solve the problems of low thermal conductivity, unhelpful heat dissipation of electronic components, high heat generation, and achieve thermal conductivity. High coefficient, the effect of reducing the reaction exothermic value and curing shrinkage, and high thermal conductivity

Inactive Publication Date: 2020-08-07
东莞市新懿电子材料技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, with the advent of the 5G era, the calculation of the chip is further increased, the heat generation is high, and the heat dissipation problem is becoming more and more prominent. However, the thermal conductivity of the traditional underfill adhesive is very low, which basically does not help the heat dissipation of electronic components.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] This embodiment provides an underfill adhesive with high thermal conductivity, which includes the following components by mass: 30 parts of polyurethane modified epoxy resin, 10 parts of first filler, 10 parts of second filler, 10 parts of curing agent, and 5 parts of curing accelerator 1 part, 3 parts of reactive diluent, 1 part of coupling agent; the first filler is spherical alumina, carbon nanotube and silicon carbide. Among them, the mass ratio of spherical alumina, carbon nanotubes and silicon carbide is 3:1:2. The second filler includes spherical silica, spherical magnesium oxide and spherical boron nitride. The particle size of spherical alumina and silicon carbide is 7 μm, and the particle size of the second filler is 3 μm. Polyurethane-modified epoxy resins include polyurethane-modified bisphenol-A epoxy resins and polyurethane-modified bisphenol-F epoxy resins. The coupling agent is γ-glycidyl ether propyl trimethoxysilane. The curing agent is a polythiol ...

Embodiment 2

[0035] This embodiment provides a high thermal conductivity one-component underfill adhesive, including the following components by mass: 30 parts of polyurethane modified epoxy resin, 5 parts of first filler, 10 parts of second filler, 5 parts of curing agent, curing 5 parts of accelerator, 1 part of reactive diluent, 2 parts of coupling agent; the first filler is spherical alumina, carbon nanotube and silicon carbide. Among them, the mass ratio of spherical alumina, carbon nanotubes and silicon carbide is 5:0.5:1. The second filler is spherical silica. The particle diameters of spherical alumina and silicon carbide are 9 μm, respectively, and the particle diameter of the second filler is 1 μm. The polyurethane modified epoxy resin is polyurethane modified bisphenol A type epoxy resin. The coupling agent is phenylaminopropyltrimethoxysilane. The curing agent is polythiol curing agent, and the curing accelerator is 2-phenyl-4,5-dimethylolimidazole. The reactive diluent is ...

Embodiment 3

[0043] This embodiment provides a high thermal conductivity one-component underfill adhesive, including the following components by mass: 10 parts of polyurethane modified epoxy resin, 15 parts of first filler, 10 parts of second filler, 15 parts of curing agent, curing 2 parts of accelerator, 5 parts of reactive diluent, 0.5 part of coupling agent; the first filler is spherical alumina, carbon nanotube and silicon carbide. Among them, the mass ratio of spherical alumina, carbon nanotubes and silicon carbide is 1:0.5:1. The second filler is spherical magnesium oxide and spherical boron nitride. The particle diameters of spherical alumina and silicon carbide are 6 μm, respectively, and the particle diameter of the second filler is 4 μm. The polyurethane modified epoxy resin is polyurethane modified bisphenol F epoxy resin. The coupling agent is γ-methacryloxypropyltrimethoxysilane. The curing agent is hexahydro-4-methylphthalic anhydride curing agent, and the curing accelerat...

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Abstract

The invention belongs to the technical field of filling adhesives and especially relates to a high-thermal-conductivity single-component underfill adhesive prepared from the following components, by mass: 10 to 30 parts of polyurethane modified epoxy resin, 5 to 15 parts of a first filler, 5 to 10 parts of a second filler, 5 to 15 parts of a curing agent, 2 to 5 parts of a curing accelerator, 1 to5 parts of reactive diluent and 0.5 to 2 parts of a coupling agent. The first filler is spherical aluminum oxide, carbon nanotubes and silicon carbide, and the polyurethane-modified epoxy resin is prepared from a polyurethane prepolymer and epoxy resin through a reaction. The added spherical aluminum oxide, carbon nano tube and silicon carbide belong to fillers with high heat conductivity coefficient, insulation, low fineness and small specific gravity, generate a synergistic effect, and can meet the characteristics of high heat conductivity, quick flowability, high permeability and low viscosity of the underfill adhesive. And the heat generated by a chip is quickly transferred to the printed circuit board, so that the temperature of the chip is effectively reduced, and the heat dissipation efficiency of the chip is improved.

Description

technical field [0001] The invention belongs to the technical field of filling adhesives, and in particular relates to a high thermal conductivity single-component bottom filling adhesive and a preparation method thereof. Background technique [0002] In the 21st century, due to the demand for wireless communications, portable computers, broadband Internet products and car navigation electronic products, the integration of electronic devices is getting higher and higher, the chip area is expanding, and the number of integrated circuit pins is increasing. At the same time, chip packaging is required The size is further miniaturized and miniaturized, integrated circuits are becoming lighter, thinner, and smaller, and the integration, density, and performance of integrated circuits are gradually improved, so many new packaging technologies and packaging forms have emerged. [0003] Packaging is to put "clothes" on the chip, protect the chip from damage caused by physical, chemi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/02C09J11/04
CPCC08K2201/003C08K2201/011C08K2201/014C08L2203/20C08L2205/025C09J11/04C09J163/00C08L63/00C08K13/04C08K7/18C08K3/041C08K3/34
Inventor 黄伟希袁丽松叶灼峰
Owner 东莞市新懿电子材料技术有限公司
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