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Fully synthetic cutting fluid for sapphire processing and preparation method thereof

A fully synthetic, cutting fluid technology, applied in the petroleum industry, lubricating compositions, etc., can solve the problems of low pass rate of sapphire surface roughness, slow settling of glass powder in the liquid tank, and workers' skin allergies, etc., to achieve excellent glass powder Sedimentation performance, excellent resistance to glass powder hardening performance, and the effect of improving filtration efficiency

Inactive Publication Date: 2020-08-11
俄美达(武汉)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing sapphire processing fluids at home and abroad are mainly fully synthetic cutting fluids, that is, the formula does not contain mineral oil, but most cutting fluid products will appear liquid during the processing process after ensuring the lubrication level required for sapphire processing Slow settling of the glass powder in the tank, some even have the problem of agglomeration very hard after the powder accumulates, which will lead to low filtration efficiency of the liquid during processing and difficult powder processing, low pass rate of sapphire surface roughness, Moreover, it is extremely difficult to remove the agglomerated powder on the surface of the machine tool, the wall of the liquid tank or the equipment that transfers the workpiece.
Secondly, because high-pH processing fluids can cause skin allergies or corrosion of workers, some cutting fluids are designed as neutral formulas, which are milder than human skin, but such cutting fluids are extremely prone to bacteria and odor

Method used

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  • Fully synthetic cutting fluid for sapphire processing and preparation method thereof
  • Fully synthetic cutting fluid for sapphire processing and preparation method thereof
  • Fully synthetic cutting fluid for sapphire processing and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] A fully synthetic cutting fluid for sapphire processing, comprising the following components by weight:

[0031] 69.1 parts by weight of water, 18 parts by weight of pH buffering agent, 0.5 parts by weight of benzotriazole, 4 parts by weight of solubilizer, 8 parts by weight of special lubricant, 0.2 parts by weight of sedimentation agent and 0.2 parts by weight of Alcohol wetting and dispersing agent.

[0032] Wherein, the pH buffer includes the following components by weight: 20 parts by weight of monoethanolamine, 30 parts by weight of triethanolamine and 50 parts by weight of boric acid, and the preparation method of the pH buffer is as follows:

[0033] The monoethanolamine, triethanolamine and boric acid in the above parts by weight were successively added into the reaction kettle, and stirred at 55° C. for 2 hours.

[0034] Wherein, the special lubricant is formed by mixing water-based polymer polyether and glycerin, and the special lubricant includes the follow...

Embodiment 2

[0041] A fully synthetic cutting fluid for sapphire processing, comprising the following components by weight:

[0042] 51.5 parts by weight of water, 25 parts by weight of pH buffering agent, 0.9 parts by weight of benzotriazole, 7 parts by weight of solubilizer, 15 parts by weight of special lubricant, 0.4 parts by weight of sedimentation agent and 0.2 parts by weight of Alcohol wetting and dispersing agent.

[0043] Wherein, the pH buffering agent comprises the following components by weight: 10 parts by weight of monoethanolamine, 70 parts by weight of triethanolamine and boric acid of 20 parts by weight, and the preparation method of the pH buffering agent is as follows:

[0044] The above weight parts of monoethanolamine, triethanolamine and boric acid were sequentially added into the reaction kettle, and stirred at 68° C. for 2 hours.

[0045] Wherein, the special lubricant is formed by mixing water-based polymer polyether and glycerin, and the special lubricant includ...

Embodiment 3

[0052] A fully synthetic cutting fluid for sapphire processing, comprising the following components by weight:

[0053] 39.6 parts by weight of water, 30 parts by weight of pH buffering agent, 0.6 parts by weight of benzotriazole, 9 parts by weight of solubilizer, 20 parts by weight of special lubricant, 0.4 parts by weight of sedimentation agent and 0.4 parts by weight of Alcohol wetting and dispersing agent.

[0054] Wherein, the pH buffer comprises the following components by weight: 30 parts by weight of monoethanolamine, 40 parts by weight of triethanolamine and 30 parts by weight of boric acid, and the preparation method of the pH buffer is as follows:

[0055] The monoethanolamine, triethanolamine and boric acid in the above parts by weight were successively added into the reaction kettle, and stirred at 80° C. for 2 hours.

[0056] Wherein, the special lubricant is formed by mixing water-based polymer polyether and glycerin, and the special lubricant includes the foll...

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Abstract

The invention discloses a fully synthetic cutting fluid for sapphire processing and a preparation method thereof. The fully synthetic cutting fluid comprises the following components in parts by weight: 20-90 parts of water, 5-50 parts of a pH buffer agent, 0.1-10 parts of benzotriazole, 0.01-20 parts of a solubilizer, 1-40 parts of a special lubricant, 0.01-2 parts of a settling agent and 0.01-2parts of an alcohol wetting dispersant. According to the fully synthetic cutting fluid for sapphire processing and the preparation method of the fully synthetic cutting fluid, the fully synthetic cutting fluid is mainly suitable for processing materials such as quartz and sapphire, and can meet various performance requirements of high lubricating performance, good skin compatibility, high glass grinding and settling speed, softness and no caking after grinding and settling, no corrosion to an adhesive and the like.

Description

technical field [0001] The invention relates to the field of cutting fluid. More specifically, the present invention relates to a fully synthetic cutting fluid for sapphire processing and a preparation method thereof. Background technique [0002] In recent years, with the rapid development of infrared technology, microelectronics and optoelectronics technology, the requirements for optoelectronic functional materials are getting higher and higher, and traditional optoelectronic materials have been difficult to meet the requirements. Among all natural materials, sapphire has the highest hardness, second only to diamond, and has good light transmission, thermal conductivity, electrical insulation and mechanical properties, and is widely used in various industries, such as: infrared military devices, Window materials for high-intensity lasers, substrates for light-emitting diodes (LEDs), and more. But precisely because of its high hardness and its application in high-tech fi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C10M169/04C10N30/06C10N30/16C10N40/22
CPCC10M169/048C10M2201/087C10M2207/02C10M2207/022C10M2209/103C10M2215/042C10M2215/223
Inventor 吴明洋高原罗丽琳
Owner 俄美达(武汉)有限公司
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