Heat-conducting powder modifier, heat-conducting silica gel and preparation methods thereof

A heat-conducting powder and modifier technology, applied in chemical instruments and methods, organic silicon compounds, heat-exchange materials, etc., can solve the problems of silicone oil precipitation, poor extrudability, and colloid hardening, and achieve oil absorption value. Stable, fast curing, stable production process effect

Active Publication Date: 2020-08-14
新纶光电材料(深圳)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a heat-conducting powder modifier, a heat-conducting silicone gel and a preparation method thereof, which solves the problem of silicone oil precipitation and poor extrudability of silicone heat-conducting materials in the prior art during storage and use. , The problem that the colloid becomes hard when used for a long time

Method used

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  • Heat-conducting powder modifier, heat-conducting silica gel and preparation methods thereof
  • Heat-conducting powder modifier, heat-conducting silica gel and preparation methods thereof
  • Heat-conducting powder modifier, heat-conducting silica gel and preparation methods thereof

Examples

Experimental program
Comparison scheme
Effect test

experiment example 1

[0036]Referring to Table 1, according to the amount of Examples 1A-12A, the catalyst is dissolved in ethanol to obtain a catalyst solution, the amount of the solvent can be dissolved in the catalyst, the organosilicon precursor and the organotitanium precursor are mixed and then added to the catalyst solution. Stir at 25-30°C for 20-24 hours, then heat up to 60-70°C and stir for 5-8 hours, then filter with suction to remove insoluble matter in the reaction system, use a rotary evaporator to rotate the filtrate to remove excess solvent, Then cool down to obtain a heat-conducting powder modifier, which is put into corresponding reagent bottles for standby.

[0037] Taking Example 1A in Table 1 as an example, the purified heat-conducting powder modifier was prepared by KBr tablet method, and tested on an infrared spectrometer with a scanning range of 4000-400cm -1 , with a resolution of 4cm -1 , the number of scans is 32 times. Fourier transform infrared spectrum (not listed) a...

experiment example 2

[0039] Referring to Table 2, the thermally conductive powder modifiers prepared in Examples 1A-12A were added to the ball mill pot according to the proportions in Table 2, and ball milled at 150 rpm for at least 1 hour to obtain the samples of Examples B1-B12. Modified thermal conductive powder. The modified thermally conductive powders in Comparative Example 1' and Comparative Example 2' are obtained by ball milling with ordinary modifier A171 coupling agent and KH560 coupling agent at 150 rpm for at least 1 hour. thermally conductive powder.

[0040] Among them, the oil absorption value test is carried out on the modified heat-conducting powder obtained in Examples B1-B12 and Comparative Example 1' and Comparative Example 2'. The test method is: put 5.0 g of the powder to be tested on a glass plate, drop Add dioctyl phthalate (DOP) for titration, grind and press with a ink knife to make it into agglomerates. The calculation method of oil absorption value is: oil absorption...

experiment example 3

[0043] Referring to Table 4, weigh each component according to the amount of components in Examples C1-C12 and Comparative Example 1-2 in Table 4, and add each component to a vacuum kneader with a heating jacket, at 20-30°C Stir evenly; then heat the heat-conducting oil in the heating jacket, and start the vacuum pump to vacuum the inside of the vacuum kneader at the same time, and continue stirring for 60-90 minutes to obtain a semi-finished silicone gel; Grinding; the fineness of the semi-finished silicone gel after grinding is less than 20 μm; the ground semi-finished silicone gel is added to a vacuum kneader with a heating jacket, and then the heat-conducting oil in the heating jacket is heated to 60-90 ° C, and at the same time Start the vacuum machine to evacuate the inside of the vacuum kneader, and stir for 20-30 minutes to obtain an ultra-low thermal resistance thermal conductive silicone gel.

[0044] Referring to Table 5 and Table 6, it can be seen from the results ...

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Abstract

The invention relates to a heat-conducting powder modifier, heat-conducting silica gel and preparation methods thereof. The heat-conducting powder modifier contains stereostructure molecules, the stereostructure molecules contain A and O, the A represents Si and/or Ti, each A forms the vertex of the stereostructure molecule, and O is connected between two adjacent As. Compared with powder modifiedby a common silane coupling agent, the heat-conducting powder modified by the heat-conducting powder modifier is stable in oil absorption value which can be controlled to be +/-5%, the extrudabilityof mixed colloid can be kept in a stable state, continuous operation of production equipment cannot be affected, and the stability of the production process is facilitated; when the heat-conducting powder modifier is used in match with polydimethylsiloxane, the negative influence on the addition amount of the small molecular additive is avoided, fast curing can be realized, and the hardening problem cannot occur after the long-term use.

Description

technical field [0001] The invention relates to the technical field of heat-conducting materials, and more specifically, relates to a heat-conducting powder modifier, a heat-conducting silica gel and a preparation method thereof. Background technique [0002] With the promotion and application of 5G technology and the Internet of Things, the speed of heat exchange between various electronic components is getting faster and faster. However, due to the size difference between electronic components and heat sinks, it is difficult to achieve an ideal flat surface. . When air exists in the interface gap between the two, it will increase the interface thermal resistance and seriously affect the heat dissipation effect of the overall device. Therefore, many heat dissipation technologies and related heat dissipation materials have been developed. At present, silicone heat-conducting materials are mainly used in the market. Silicone heat-conducting materials can be designed in diffe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09C3/12C09C1/40C09C1/00C07F7/21C07F7/00C09K5/08
CPCC01P2006/19C07F7/003C07F7/21C09C1/00C09C1/407C09C3/12C09K5/08
Inventor 张利利范兆明
Owner 新纶光电材料(深圳)有限公司
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