Modification preparation method of high-thermal-conductivity mica paper

Abstract

The invention discloses a modification preparation method of high-thermal-conductivity mica paper. The modification preparation method comprises the steps: treating a mica raw material into coarse slurry and fine slurry; then, taking a mixture of nano BN and nano-scale silicon compound powder as a filler, adding a mixture aqueous solution of cationic starch, ethylenediamine tetraacetic acid and pentabromophenol to prepare a filler solution; mixing the filler solution with para-aramid chopped fibers modified by a silane coupling agent, carrying out ultrasonic dispersion, carrying out papermaking molding between a coarse slurry layer and a fine slurry layer of mica paper, and carrying out dehydration and drying to obtain the high-thermal-conductivity mica paper. The high-thermal-conductivitymica paper has excellent mechanical strength, dielectric breakdown strength and high thermal conductivity stability when applied to power equipment such as large and medium-sized high-voltage generators and motors.

Description

technical field [0001] The invention relates to the field of insulating mica products, in particular to a method for modifying and preparing mica paper with high thermal conductivity. Background technique [0002] With the continuous improvement of people's living standards and the development of power systems, the power industry has become an important development target that cannot be ignored in various countries. The demand for power equipment in production and living behaviors is also increasing, and the capacity of large and medium-sized high-voltage motors is also constantly expanding. The degree of withstand voltage and the corresponding insulation protection requirements of power equipment are getting higher and higher. Compared with traditional metal insulating materials, mica paper has excellent electrical properties such as high electrical strength, low dielectric loss, high surface resistance and volume resistance, as well as heat resistance, water resistance, ch...

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Problems solved by technology

[0007] In the Chinese invention patent with application number 201910583047.8, a method for preparing mica paper with high thermal conductivity is provided. The mica paper prepared by this method for preparing mica paper with high thermal conductivity uses hexagonal BN, BN whiskers, graphene oxide, nano α- Al 2 o 3 The mixture of the mica paper is used as a filler. During the mica paper pulping process, it passes through the five-fold cylinder net sizing. After passing through the cylinder net sizing each time, the above filler is filled between the slurry layers by spraying. After the spraying is completed, it is dehydrated and dried. Dry, you can get high thermal conductivity mica paper, this kind of high thermal conductivity mica paper as insulating paper breaks through the limitations of the material and structure itself, and has better thermal conductivity, but this kind of high thermal conductivity mica paper is sprayed between the layers of mica paper. The filler is prone to delamination during long-term use, resulting in a decrease in its mechanical properties and electrical insulation properties after delamination occurs, and there is a risk in use

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