Feeding and discharging method for PECVD surface coating

A surface coating and coating technology, which is applied in the direction of gaseous chemical plating, metal material coating process, coating, etc., can solve the problem of affecting the production efficiency of the whole line. Cell quality, no coating, no silicon wafer coating detection in graphite boats To achieve stable efficiency, smooth production process, and improve quality

Active Publication Date: 2020-09-04
HUNAN RED SUN PHOTOELECTRICITY SCI & TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, these two methods are for single-piece detection in the inserting machine, which can detect whether the single piece is fragmented or cracked before entering the graphite boat, and whether the coating thickness and uniformity meet the requirements before entering the next process flower basket after coating. and other inspections, but none of them have tested whether the silicon wafer in the graphite boat is coated or not.
Therefore, it is easy to have repeated coating on the whole boat or no coating on the whole boat, which will affect the production efficiency of the whole line and the quality of the cells

Method used

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  • Feeding and discharging method for PECVD surface coating
  • Feeding and discharging method for PECVD surface coating
  • Feeding and discharging method for PECVD surface coating

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Embodiment Construction

[0051] The present invention will be described in further detail below in conjunction with the accompanying drawings and specific embodiments.

[0052] Such as figure 1 with figure 2 As shown, the loading and unloading method of the PECVD surface coating of the present embodiment comprises the following steps:

[0053] S1. The graphite boat is in place: the graphite boat 1 inserted by the inserting and unloading machine moves to the bottom of the PECVD purification table through the conveying mechanism 2. The chip taker inserts the silicon chip into the graphite boat 1;

[0054] S2. Cache shelf on the graphite boat: the manipulator grabs the graphite boat 1 and puts it on the cache shelf of the clean bench to wait;

[0055] S3. The pushing mechanism on the graphite boat: there is space in the reaction chamber 3, and the manipulator grabs the graphite boat 1 on the buffer rack and puts it on the pushing mechanism 4;

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Abstract

The invention discloses a feeding and discharging method for PECVD surface coating. The feeding and discharging method comprises the steps of graphite boat positioning, feeding a graphite boat to a buffer frame, pushing the graphite boat onto a boat pushing mechanism, coating detection before boat feeding, feeding the graphite boat into a reaction chamber, discharging the graphite boat out of thereaction chamber, feeding the graphite boat on a conveying mechanism, coating detection before sheet taking, returning the graphite boat to a sheet inserting and taking machine and the like. Accordingto the invention, two coating detection steps are added on an inevitable path of the graphite boat; namely, firstly, a boat pushing detection mechanism detects whether a silicon wafer in a graphite boat which is about to enter a reaction chamber is coated or not, secondary coating in the reaction chamber is avoided; and secondly, whether the silicon wafer to enter the wafer inserting and taking machine on the conveying mechanism is coated or not is detected, and the silicon wafers which are not coated are prevented from flowing into the next process, so that each boat of silicon wafers are coated, repeated coating is avoided, the smoothness of a production process is guaranteed, the efficiency of the silicon wafers is more stable, and the quality of battery pieces is improved.

Description

technical field [0001] The invention relates to a PECVD surface coating process, in particular to a method for loading and unloading PECVD surface coatings. Background technique [0002] PECVD (Plasma Enhanced Chemical Vapor Deposition, PECVD equipment includes three parts, namely gas source cabinet, furnace cabinet and purification platform, the reaction chamber is located in the furnace cabinet; the pusher mechanism, buffer rack, and manipulator are located in the purification platform; the transmission mechanism is connected to the purification platform. Taiwan and inserting chip machine) refers to the vapor phase deposition method of plasma enhanced chemistry. In the PECVD surface coating process, the graphite boat is the carrier of the solar cell, and the silicon wafer is processed into a solar cell after several processes, and the surface coating is one of the core processes of the solar cell processing. The graphite boat is the carrier of the solar cells in the surfa...

Claims

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Application Information

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IPC IPC(8): H01L31/18H01L21/66H01L21/677C23C16/50C23C16/52C23C16/54
CPCH01L31/1804H01L31/1876H01L22/12H01L22/20H01L21/67739C23C16/50C23C16/54C23C16/52Y02P70/50
Inventor 朱辉成秋云刘帅梁浩石书清罗志敏
Owner HUNAN RED SUN PHOTOELECTRICITY SCI & TECH
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