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Resin composition and application thereof

A technology of resin composition and compound, applied in applications, other household appliances, synthetic resin layered products, etc., can solve the problems of low roughness, high cohesiveness, and affecting the water absorption rate of the final cured product, etc.

Active Publication Date: 2020-10-30
常熟生益科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Furthermore, Japanese Patent JP2017019970 discloses a resin composition in which a triazine-hydroxyl-containing active ester compound is used in an epoxy resin system to solve the problems of low roughness and high adhesion, but the compound contains Hydroxyl, which affects the water absorption and other properties of the final cured product

Method used

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  • Resin composition and application thereof
  • Resin composition and application thereof
  • Resin composition and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0082] Synthesis Example 1: Synthesis of Dicyclopentadienyl Active Ester Compound

[0083] The first step: get 1mol dicyclopentadienol resin and 2mol p-isothiocyanatobenzoic acid, stir and dissolve in toluene solvent evenly, under the temperature condition of 60 ℃, feed nitrogen simultaneously, add catalyst (tetrabutyl Ammonium bromide), reacted 4 hours;

[0084]

[0085] The second step: under the protection of nitrogen, sodium hydroxide solution was added dropwise, and the reaction was continued to obtain the active ester compound A containing a thiol group at the end.

[0086]

Synthetic example 2

[0087] Synthesis Example 2: Synthesis of Tricyclopentadienyl Active Ester Compound

[0088] The tricyclopentadienyl phenol resin was used to replace the dicyclopentadiene naphthol resin in Synthesis Example 1, and other steps were the same as in Synthesis Example 1 to obtain tricyclopentadienyl active ester compound B.

Synthetic example 3

[0089] Synthesis example 3: Synthesis of naphthyl active ester compound

[0090]Naphthol resin was used to replace dicyclopentadiene naphthol resin in Synthesis Example 1, and other steps were the same as Synthesis Example 1 to obtain naphthyl active ester compound C.

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Abstract

The invention discloses a resin composition which comprises the following components in parts by solid weight: (A) 100 parts of epoxy resin; (B) 1-100 parts of a curing agent; (C) 0-200 parts of a filler; (D) 0.001 to 5 parts of a curing accelerator, wherein the curing agent at least contains an active ester compound. According to the invention, an active ester compound containing two reaction groups is adopted; when the active ester group reacts with the epoxy resin, hydroxyl with relatively strong polarity is not generated so that the dielectric property is excellent, and the coarsening degree is low; meanwhile, the aromatic thiol group at the tail end can react with epoxy resin; the thiol has relatively good cohesiveness so that the cohesiveness is extremely high, the problems of two opposite properties of low coarsening degree and high peeling strength are solved, and the resin composition has excellent low coarsening degree, high peeling strength, dielectric property and heat resistance after being cured so that the resin composition can be relatively well applied to a high multi-laminated circuit board.

Description

technical field [0001] The invention relates to a resin composition and a prepreg and a laminate prepared by using the resin composition, which belong to the technical field of electronic materials. Background technique [0002] In recent years, the focus of the printed circuit board market has gradually shifted from computers to communications, especially mobile terminals such as smartphones and tablet computers. Therefore, HDI boards for mobile terminals are the main point of PCB growth. Mobile terminals represented by smartphones drive HDI boards to be denser and thinner. According to literature reports, the line width / line spacing L / S (Line and Space) of the future PCB board will reach 10 / 10 microns or less. Therefore, the Ra value (ie, the average roughness) of the laminated insulating layer needs to reach 300nm or less, the cohesiveness reaches above 0.6kgf / cm. [0003] In addition, in the field of packaging technology, flip chip (Flip chip) will gradually become th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L71/10C08L79/04C08J5/24C08K7/14C08K3/36C08G59/66C08J5/18B32B27/36B32B27/06B32B33/00B32B15/14B32B17/02H05K1/03
CPCC08L63/00C08J5/24C08G59/66C08J5/18B32B27/36B32B27/06B32B33/00B32B15/14B32B5/02H05K1/0366C08J2363/00C08K7/14B32B2260/021B32B2262/10B32B2262/101B32B2307/306B32B2307/204B32B2457/08C08L71/00C08L79/04C08K3/36
Inventor 崔春梅焦锋戴善凯陈诚何继亮杨宋
Owner 常熟生益科技有限公司
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