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High-thermal-conductivity silicon-containing flame-retardant resin composition and application thereof

A technology of flame retardant resin and composition, applied in application, other household appliances, household appliances, etc., can solve the problems of not taking into account thermal conductivity, thermal expansion, heat-resistant dielectric constant, dielectric loss and flame retardancy at the same time, and achieve low Effects of water absorption, low dielectric constant, and high thermal conductivity

Pending Publication Date: 2020-11-10
SHANGHAI RES INST OF MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the resin compositions involved in the above-mentioned patents cannot simultaneously take into account comprehensive properties such as thermal conductivity, thermal expansion, heat resistance, dielectric constant, dielectric loss, and flame retardancy.

Method used

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  • High-thermal-conductivity silicon-containing flame-retardant resin composition and application thereof
  • High-thermal-conductivity silicon-containing flame-retardant resin composition and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-9

[0049] Preparation of High Thermal Conductivity Silicon-Containing Flame Retardant Resin Composition

[0050]According to the formulations listed in Table 1 and Table 2, the resin components and inorganic fillers were firstly mixed and dispersed in toluene to obtain resin compositions. Examples 1-9 respectively correspond to components 1-9 in Table 1. Then impregnate 1078 glass fiber cloth (Honghe Electronics) with the composition, heat and dry at 115° C. for 6 minutes to obtain a prepreg with a resin content of 65%-68%.

[0051] Five prepregs were stacked together, two copper foils with a thickness of 35 microns were placed on the upper and lower surfaces, and hot-pressed at 220 ° C and 4 MPa for 120 minutes to obtain a double-sided copper-clad laminate.

[0052] The copper foil is removed by etching to evaluate the dielectric constant, dielectric loss, thermal conductivity, glass transition temperature, thermal expansion coefficient, flame retardancy, etc.

[0053] The name...

Embodiment 10

[0075] A high thermal conductivity silicon-containing flame retardant resin composition, comprising the following components by mass:

[0076] Modified polyphenylene ether resin containing unsaturated carbon-carbon double bonds: 16 parts;

[0077] Vinyl silicone resin: 12 parts;

[0078] Peroxide initiator: 1 part;

[0079] Phosphorus-containing flame retardant: 5 parts;

[0080] Auxiliary cross-linking agent: 5 parts;

[0081] Inorganic filler: 35 parts.

[0082] In this embodiment, the modified polyphenylene ether resin containing unsaturated carbon-carbon double bonds is selected from: allyl grafted polyphenylene ether resin;

[0083] In this embodiment, the vinyl silicone resin is a methylphenyl silicone resin, its R / Si is between 1.0-1.5, and its Ph / Me value is between 0.6-0.9.

[0084] In this embodiment, the peroxide initiator is selected from the following substances: dibenzoyl peroxide (BPO).

[0085] In this embodiment, the phosphorus-containing flame retardant...

Embodiment 11

[0096] A high thermal conductivity silicon-containing flame retardant resin composition, comprising the following components by mass:

[0097] Modified polyphenylene ether resin containing unsaturated carbon-carbon double bonds: 40 parts;

[0098] Vinyl silicone resin: 25 parts;

[0099] Peroxide initiator: 6 parts;

[0100] Phosphorus-containing flame retardant: 15 parts;

[0101] Auxiliary cross-linking agent: 10 parts;

[0102] Inorganic filler: 60 parts.

[0103] In this embodiment, the modified polyphenylene ether resin containing unsaturated carbon-carbon double bonds is selected from: vinyl benzyl ether polyphenylene ether resin (resin of Mitsubishi Gas Chemical Co., Ltd. whose model is OPE-2s);

[0104] In this embodiment, the vinyl silicone resin is a methylphenyl silicone resin, its R / Si is between 1.0-1.5, and its Ph / Me value is between 0.6-0.9.

[0105] In this embodiment, the peroxide initiator is selected from the following substances: dicumyl di-tert-butyl ...

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Abstract

The invention belongs to the technical field of composite materials, and relates to a high-thermal-conductivity silicon-containing flame-retardant resin composition and application thereof. The resincomposition specifically comprises vinyl-containing organic silicon resin, unsaturated carbon-carbon double bond modified polyphenyl ether resin, a peroxide initiator, an assistant crosslinking agent,a phosphorus-containing flame retardant, an inorganic filler and a proper amount of an organic solvent. Compared with the prior art, a composite material prepared from the silicon-containing resin composition has the excellent characteristics of higher heat conductivity coefficient, high heat resistance, lower dielectric constant, lower dielectric loss and the like, satisfies the requirements forno halogen and flame retardancy, and is more suitable for occasions with the use requirement for high-power output.

Description

technical field [0001] The invention belongs to the technical field of composite materials, and relates to a high thermal conductivity silicon-containing flame-retardant resin composition and an application thereof. Background technique [0002] With the rapid development of 5G electronic information, the development of electronic device integration technology and the power of electronic devices are also increasing, and their operating temperature is also gradually increasing. Compared with 4G, 5G has a larger amount of data, a higher transmission frequency, and a higher operating frequency band. This requires PCB boards for base stations to have better transmission performance and heat dissipation performance, which means that PCB boards for 5G base stations need to use more Electronic substrates with high frequency, higher transmission speed, and better heat resistance. Therefore, in order to meet the needs of market development, high heat resistance, high frequency, and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L51/08C08L83/04C08L83/08C08K13/06C08K9/06C08K5/5399C08K5/523C08K5/5313C08K7/28C08K5/3492C08K3/36C08K3/22C08K3/28C08K3/38C08K3/34C09K5/14B32B15/20B32B15/14B32B17/04B32B17/06B32B33/00
CPCC08J5/24C09K5/14B32B15/20B32B15/14B32B5/02B32B17/061B32B33/00C08J2351/08C08J2483/04C08J2483/08C08K13/06C08K9/06C08K5/5399C08K5/523C08K5/5313C08K7/28C08K5/3492C08K3/36C08K2003/2227C08K2003/2241C08K2003/282C08K2003/385C08K3/34C08K5/14C08K2201/011C08K2201/005B32B2260/021B32B2260/046B32B2262/101B32B2307/204B32B2307/302B32B2307/3065B32B2457/08
Inventor 段家真李小慧金石磊马峰岭侯李明韩瑞
Owner SHANGHAI RES INST OF MATERIALS CO LTD
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