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Anisotyopic conductive adhesive and its preparing method

An anisotropic and adhesive technology, applied in the field of new polymer anisotropic conductive adhesives, can solve the problems of thermal damage, high curing temperature and poor heat resistance of the electronic components to be bonded, so as to facilitate the use of automated production lines, process Good applicability and excellent comprehensive performance

Inactive Publication Date: 2003-08-27
HAISO TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Japanese patent No. 61-276873 and No. 62-41227 use polyester thermoplastic elastomer and acrylate thermoplastic elastomer as the insulating adhesive system, and mix conductive substances to form anisotropic conductive adhesive. The advantage of this type of adhesive is hot pressing The time is short, the preparation is simple, and its disadvantages are poor heat resistance, easy sliding during hot pressing, low peel strength, and poor reliability of connecting circuits
Subsequent research has improved it. Japanese Patent No. 1-113480 uses epoxy-modified thermosetting resin as the main body of the insulating adhesive to uniformly disperse conductive particles to form a hot-pressed anisotropic conductive adhesive; it improves the heat resistance and peel strength of the adhesive. and reliability, but there are disadvantages such as high curing temperature, long time, and easy thermal damage to the bonded electronic components.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] Get polyethylene glycol adipate 200g, toluene diisocyanate (80 / 20) 20g, ethylene glycol 6g epoxy resin E-44 100g, novolac resin 50g, KH-560 coupling agent 1g, antioxidant 2.6- Di-tert-butyl-4-methylphenol 2g, solvent toluene: ethyl acetate: cyclohexanone 400g according to the ratio of 1:1:1, conductive particle carbon powder 10g, allocate according to the following steps:

[0041] In a reaction flask equipped with a stirrer, a condenser, and a heating device, heat and melt polyethylene glycol adipate, add toluene diisocyanate, stir and react at 65°C for 2 hours, then add ethylene glycol and stir for reaction 1 Hours, to obtain a uniform viscous glue. Add a mixture of epoxy resin E44, novolac resin, antioxidant and coupling agent dissolved in an appropriate amount of solvent, then dilute with a mixed solvent, and finally add conductive particle carbon powder, and stir well to obtain an anisotropic conductive adhesive. The adhesive was evenly coated on the polyester film...

Embodiment 2

[0043] Take 200g of polytetramethylene glycol adipate, 40g of 4,4' diphenylmethane diisocyanate, 8g of butanediol, 100g of epoxy resin E51, 50g of novolac resin, 1g of KH-550 coupling agent, and 2 , 2,4-trimethyl-1,2-quinoline dioxide 2g, solvent xylene:cyclohexanone=7:3 mixed solvent amount, conductive particle carbon powder 10g, allocate according to the following steps:

[0044] Melt polytetramethylene glycol adipate in a reaction flask equipped with a stirrer, condenser, and heating device, then add isocyanate, stir and react at 55°C for 2 hours, then add butanediol and continue to stir for 1 hour, get uniform viscous reactant, add the mixture of epoxy resin E51, phenolic resin, antioxidant, coupling agent dissolved with an appropriate amount of solvent, then dilute to solid with the mixed solvent of xylene: cyclohexanone=7: 3 The content is 46%, and finally add conductive granular carbon powder, and fully stir to obtain the anisotropic conductive adhesive of the present i...

Embodiment 3

[0047] Get polyethylene glycol adipate 200g, toluene diisocyanate (80 / 20) 25g, 1,4-bis(2-hydroxyethoxy)benzene 12g, epoxy resin E20 100g, phenolic resin 50g, KH-570 1g of coupling agent, 2g of anti-oxidant dilauryl dipropionate sulfide, appropriate amount of solvent cyclohexanone: ethyl acetate = 1:1 mixed solvent, 10g of conductive particle carbon powder, prepared according to the following steps.

[0048] In a reaction flask equipped with a stirrer, a condenser, and a heating device, heat and melt polyethylene glycol adipate, add toluene diisocyanate, react at 60°C for 2 hours, add 1,4-bis(2 -Hydroxyethoxy)benzene continued to stir for 1 hour to obtain a uniform viscous reactant. Add a mixture of epoxy resin E20, phenolic resin, antioxidant and coupling agent dissolved in an appropriate amount of solvent, then dilute to a solid content of 55% with a mixed solvent of cyclohexanone: ethyl acetate = 1:1, and finally add conductive particles The carbon powder is fully stirred e...

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Abstract

The anisotropic conductive adhesive is prepared with polyol, polyisocyanic ester, chain expander, epoxy resin, phenolic resin, coupling agent, antioxidant, conducting particle and solvent through combination of the chemical reaction with physical mixing. As one new type electronic component and device assembling material, the adhesive may be used in hot pressed adhesion of polyester film circuit, LCD glass, PCB printed circuit board, etc; has short cure period, low cure temperature, high adhesion strength, high reliability and wide adaptability; and is suitable for use in automatic production line.

Description

technical field [0001] The present invention relates to the composition and preparation method of a new polymer anisotropic conductive adhesive. The adhesive can be used for thermocompression bonding and connection of thin film circuits and LCD glass, PCB boards and drive circuits, and can also be used for surface components and wiring , Thermocompression bonding connection between multilayer wiring and printed circuit board, etc. Background technique [0002] Anisotropic conductive polymer adhesives are used in the thermocompression bonding of thin-film circuits between LCDs and drive circuit PCBs to adapt to the development of automated production, light weight, and thinner electronic products, and have been rapidly popularized and applied. Japanese patent No. 61-276873 and No. 62-41227 use polyester thermoplastic elastomer and acrylate thermoplastic elastomer as the insulating adhesive system, and mix conductive substances to form anisotropic conductive adhesive. The adva...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J9/02C09J175/06
Inventor 于洁袁明王琛宋文华周厚阳王洛礼
Owner HAISO TECH
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